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Showing items 76-85 of 148  (15 Page(s) Totally)
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Institution Date Title Author
國立中山大學 2001 Effect of Temperature Cycling on Joint Strength of PbSn and AuSn Solders in Laser Packages J.H. Kuang; M.T. Sheen; C.H. Chang; C.C. Chen; G.L. Wang; W.H. Cheng
國立中山大學 2001 Fiber Alignment Shift Formation Mechanisms of Fiber-Solder-Ferrule Joints in Laser Module Packaging W.H. Cheng; M.T. Sheen; G.L. Wang; S.C. Wang; J.H. Kuang
國立中山大學 2001 Post-Weld-Shift in Dual-in-Line Package J.H. Kuang; M.T. Sheen; S.C. Wang; G.L. Wang; W.H. Cheng
國立中山大學 2001 Electromagnetic Shielding of Nylon-66 Composites Applied to Laser Modules W.S. Jou;T.L. Wu;S.K. Chiu;W.H. Cheng
國立中山大學 2001 An Optimum Approach for Fabrication of Low Loss Fused Fiber C.S. Hsieh;T.L. Wu;W.H. Cheng
國立中山大學 2001 sFiber Alignment Shift Formation Mechanisms of Fiber-Solder-Ferrule Joints in Laser Module Packaging W.H. Cheng;M.T. Sheen;G.L. Wang;S.C. Wang;J.H. Kuang
國立中山大學 2001 Post-Weld-Shift in Dual-in-Line Laser Package J.H. Kuang;M.T. Sheen;S.C. Wang;G.L. Wang;W.H. Cheng
國立中山大學 2001 An Optimum Approach for Fabrication of Tapered Hemispherical-End Fiber for Laser Module Packaging H.M. Yang;D.C. Jou;M.H. Chen;S.H. Wu;W.H. Cheng
國立中山大學 2001 Effect of Temperature Cycling on Joint Strength of PbSn and AuSn Solders in Laser Package J.H. Kuang;M.T. Sheen;C.F. Chang;C.C. Chen;G.L. Wang;W.H. Cheng
國立中山大學 2000 Reduction of Fiber Alignment Shifts in Semiconductor Laser Module Packaging W.H. Cheng; M.T. Sheen; C.P. Chien; H.L. Chang; J.H. Kuang

Showing items 76-85 of 148  (15 Page(s) Totally)
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