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Showing items 81-105 of 148 (6 Page(s) Totally)
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Institution	Date	Title	Author
國立中山大學	2001	sFiber Alignment Shift Formation Mechanisms of Fiber-Solder-Ferrule Joints in Laser Module Packaging	W.H. Cheng;M.T. Sheen;G.L. Wang;S.C. Wang;J.H. Kuang
國立中山大學	2001	Post-Weld-Shift in Dual-in-Line Laser Package	J.H. Kuang;M.T. Sheen;S.C. Wang;G.L. Wang;W.H. Cheng
國立中山大學	2001	An Optimum Approach for Fabrication of Tapered Hemispherical-End Fiber for Laser Module Packaging	H.M. Yang;D.C. Jou;M.H. Chen;S.H. Wu;W.H. Cheng
國立中山大學	2001	Effect of Temperature Cycling on Joint Strength of PbSn and AuSn Solders in Laser Package	J.H. Kuang;M.T. Sheen;C.F. Chang;C.C. Chen;G.L. Wang;W.H. Cheng
國立中山大學	2000	Reduction of Fiber Alignment Shifts in Semiconductor Laser Module Packaging	W.H. Cheng; M.T. Sheen; C.P. Chien; H.L. Chang; J.H. Kuang
國立中山大學	2000	Spectral Characteristics for a Fiber Grating External Cavity Laser	W.H. Cheng;S.F. Chiu;C.Y. Hong; H.W. Chang
國立中山大學	2000	Electromagnetic Shielding of Plastic Packaging in Low-Cost Laser Modules	W.H. Cheng;J.Y. Cheng; T.L. Wu; C.M. Wang;S.C. Wang; W.S. Jou
國立中山大學	2000	Reduction of Fiber Alignment Shifts in Laser Module Packaging	W.H. Cheng; M.T. Sheen; C.P. Chien; H.L. Chang
國立中山大學	2000	Performance Characteristics of a Regenerative Catalytic Oxidizer to Treat VOC-Contaminated Air Streams	M.S. Chou; W.H. Cheng; W.S. Li
國立中山大學	2000	Heat Transfer Model for Regenerative Beds	M.S. Chou; W.H. Cheng; B.J. Huang
國立高雄第一科技大學	1999.04	Thermal stresses in box-type laser packages	W.H.Cheng;Y.D.Yang;T.C.Liang;G.L.Wang;M.T.Sheen;J.H.Kuang
國立中山大學	1999	Thermal Stresses in Box-Type Laser Packages	W.H. Cheng; Y.D. Yang; T.C. Liang; G.L. Wang; M.T. Sheen; J.H. Kuang
國立中山大學	1999	The Principle Cause of Crack Defects in Optoelectronic Materials with Phosphorus-Containing Underlayer	W.H. Cheng; M.T. Sheen; J.H. Kuang; C.H. Chen
國立中山大學	1999	Crack Formation Mechanism in Laser-Welded Au-Coated Invar Materials for Semiconductor Laser Packaging	J.H. Kuang; M.T. Sheen; S.C. Wang; C.H. Chen; W.H. Cheng
國立中山大學	1999	Effect of Thermal Stresses on Temperature Dependence of Refractive Index for Ta2O5 Dielectric Films	W.H. Cheng; S.F. Chiu; A.K. Chu
國立中山大學	1999	Spectral Characteristics for a Fiber Grating External Cavity Laser	W.H. Cheng; S.F. Chiu;C.Y. Hong; H.W. Chang
國立中山大學	1999	Thermal Stresses in Box-Type Laser Packages	W.H. Cheng;Y.D. Yang; T.C. Liang; G.L. Wang; M.T. Sheen;J.H. Kuang
國立中山大學	1999	The Principle Cause of Crack Defects in Optoelectronic Materials with Phosphorus-Containing Underlayer	W.H. Cheng;M.T. Sheen; J.K. Kuang; C.H. Chen
國立中山大學	1999	Crack Formation Mechanism in Laser-Welded Au-Coated Invar Materials for Semiconductor Laser Packages	J.K. Kuang; M.T. Sheen; S.C. Wang; C.H. Chen; W.H. Cheng
國立中山大學	1998	Defect in Optoelectronic Materials Due to Phosphous-containing Underlayer	W.H. Cheng;S.C. Wang;Y.K. Tu;C.H. Chen;K.C. Hsieh
國立中山大學	1998	Defect in Optoelectronic Materials Due to Phosphorus-Containing Underlayer	W.H. Cheng; S.C. Wang;Y.K. Tu; C.H. Chen; K.C. Hsieh
國立中山大學	1998	A Simple Passive Aligned Packaging Technique for Laser to Single-Mode Fiber Modules	S.C. Wang;S. Chi;W.H. Cheng
國立中山大學	1997-05	Effect of Au Coating o?n Laser Beam Penetration in Invar-to-Invar Packages	S.C. Wang; H.L. Chang;C. Wang;J.H. Kuang; W.H. Cheng
國立中山大學	1997	Effect of Au Thickness on Laser Beam Penetration in Semiconductor Laser Packages	W.H. Cheng; Y.D. Yang; S.C. Wang; J.H. Kuang
國立中山大學	1997	Effects of Au Coating on Thermal Stresses in Stainless-to-Kovar Packages	W.H. Cheng; W.H. Wang; Y.D. Yang; J.H. Kuang

Showing items 81-105 of 148 (6 Page(s) Totally)
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