臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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机构	日期	题名	作者
元智大學	2020/10/21	Electromagnetic Properties of Ni(P) and Its Signal Transmission Performance in 5G Communication Applications	W. L. Chou; H. W. Tseng; C. J. Yu; C. Y. Lee; Huei-Ru Fuh; T. T. Kuo; Chien-Chang Huang; Cheng-En Ho
元智大學	2020/10/21	Electromagnetic Properties of Ni(P) and Its Signal Transmission Performance in 5G Communication Applications	W. L. Chou; H. W. Tseng; C. J. Yu; C. Y. Lee; Huei-Ru Fuh; T. T. Kuo; Chien-Chang Huang; Cheng-En Ho
元智大學	2019/11/15	Nano-XRF and X-ray Nanodiffraction Studies on the Working Mechanism of Flexible Ni(P) Thin Films	W. L. Chou; C. Y. Lee; P. T. Lee; W. Z. Hsieh; C. S. Ku; X. Y. Li; S. C. Tseng; M. T. Tang; Cheng-En Ho
元智大學	2019/11/15	Effect of Cu Interconnect Roughness on the Signal Transmission Performance at 1–110 GHz	W. L. Chou; J. C. Yu; C. Y. Lee; Y. S. Wu; Chien-Chang Huang; Cheng-En Ho
元智大學	2019/11/15	Effect of Cu Interconnect Roughness on the Signal Transmission Performance at 1–110 GHz	W. L. Chou; J. C. Yu; C. Y. Lee; Y. S. Wu; Chien-Chang Huang; Cheng-En Ho
元智大學	2019/11/15	Nano-XRF and X-ray Nanodiffraction Studies on the Working Mechanism of Flexible Ni(P) Thin Films	W. L. Chou; C. Y. Lee; P. T. Lee; W. Z. Hsieh; C. S. Ku; X. Y. Li; S. C. Tseng; M. T. Tang; Cheng-En Ho
元智大學	2019/10/23	Effect of Surface Finish on Signal Loss of Cu Interconnects in 5G High-frequency Transmission	Cheng-En Ho; Chien-Chang Huang; Y. S. Wu; W. L. Chou; C. J. Yu; C. Y. Lee; C. S. Chen
元智大學	2019/10/23	Effect of Surface Finish on Signal Loss of Cu Interconnects in 5G High-frequency Transmission	Cheng-En Ho; Chien-Chang Huang; Y. S. Wu; W. L. Chou; C. J. Yu; C. Y. Lee; C. S. Chen
元智大學	2019/10/23	Roughness Effect of Cu Interconnects on Signal Transmission Performance in 5G Communication Applications	W. L. Chou; Y. S. Wu; C. Y. Lee; C. S. Chen; Chien-Chang Huang; Cheng-En Ho
元智大學	2019/10/23	Roughness Effect of Cu Interconnects on Signal Transmission Performance in 5G Communication Applications	W. L. Chou; Y. S. Wu; C. Y. Lee; C. S. Chen; Chien-Chang Huang; Cheng-En Ho
元智大學	2019/10/23	Effect of Surface Finish on Signal Loss of Cu Interconnects in 5G High-frequency Transmission	Y. S. Wu; C. J. Yu; W. L. Chou; C. Y. Lee; C. S. Chen; Chien-Chang Huang; Cheng-En Ho
元智大學	2019/10/23	Effect of Surface Finish on Signal Loss of Cu Interconnects in 5G High-frequency Transmission	Y. S. Wu; C. J. Yu; W. L. Chou; C. Y. Lee; C. S. Chen; Chien-Chang Huang; Cheng-En Ho
中原大學	2004-11-15	Pervaporation of Water/Alcohol Mixtures through Chitosan/Cellulose Acetate Composite Hollow-Fiber Membranes	H. A. Tsai;H. C. Chen;W. L. Chou;K. R. Lee;M. C. Yang;J. Y. Lai
國立政治大學	2003-12	A Wafer Fabrication Dispatching Method for Minimizing Inventory Variability Using Fuzzy Inference	C-Y Chiu;C-H Paul Liu;W-L Chou;洪叔民;R-J Ku

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