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机构 日期 题名 作者
元智大學 May-23 Electromigration-induced Remarkable Intermetallic Compound (IMC) Formation in Micro Joints and Its Prevention P. T. Lee; C. Y. Lee; W. Z. Hsieh; C. T. Chen; Cheng-En Ho
元智大學 Jul-21 Synchrotron white Laue nanodiffraction study on the allotropic phase transformation between hexagonal and monoclinic Cu6Sn5 P. T. Lee; W. Z. Hsieh; C. Y. Lee; Y. H. Huang; C. Y. Chiang; C. S. Ku; C. R. Kao; Cheng-En Ho
元智大學 2023/10/25 Electromigration Reliability of Micro Joints with Different Surface Finishes Z. Y. Yang; S. C. Chang; C. T. Chen; W. Z. Hsieh; C. Y. Lee; H. C. Liu; K. H. Lan; P. C. Lin; Cheng-En Ho
元智大學 2021/5/12 White X-ray Nanodiffraction Study of Allotropic Phase Transformation of Hexagonal- into Monoclinic-Cu6Sn5 P. T. Lee; W. Z. Hsieh; C. Y. Lee; C. R. Kao; Cheng-En Ho
元智大學 2020/11/7 Thermal Stability and Electrochemical Corrosion of ENEPIG Surface Finish Deposited on the Cu Traces C. Y. Lee; W. Z. Hsieh; P. T. Lee ; C. H. Li; S. P. Yang; Cheng-En Ho
元智大學 2019/11/15 White X-ray Laue Diffraction Characterization of Microstructure Transition and Stress Relaxation of Electroplating Cu upon Self-annealing Y. H. Huang; W. Z. Hsieh; C. Y. Lee; C. H. Yang; S. J. Chiu; C. S. Ku; Cheng-En Ho
元智大學 2019/11/15 Nano-XRF and X-ray Nanodiffraction Studies on the Working Mechanism of Flexible Ni(P) Thin Films W. L. Chou; C. Y. Lee; P. T. Lee; W. Z. Hsieh; C. S. Ku; X. Y. Li; S. C. Tseng; M. T. Tang; Cheng-En Ho
元智大學 2019/11/15 White X-ray Laue Diffraction Characterization of Microstructure Transition and Stress Relaxation of Electroplating Cu upon Self-annealing Y. H. Huang; W. Z. Hsieh; C. Y. Lee; C. H. Yang; S. J. Chiu; C. S. Ku; Cheng-En Ho
元智大學 2019/11/15 Nano-XRF and X-ray Nanodiffraction Studies on the Working Mechanism of Flexible Ni(P) Thin Films W. L. Chou; C. Y. Lee; P. T. Lee; W. Z. Hsieh; C. S. Ku; X. Y. Li; S. C. Tseng; M. T. Tang; Cheng-En Ho
元智大學 2015-10-21 Electromigration in Tin Blech Structure W. Z. Hsieh; P. T. Lee; Cheng-En Ho

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