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Showing items 1-22 of 22 (1 Page(s) Totally)
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Institution	Date	Title	Author
元智大學	Sep-18	TEM Characterization of Cu Self-annealing and Direct Proof of Pinhole Formation Mechanism in a Cu Film	Cheng-En Ho; Chang-Chih Chen; Cheng-Hsien Yang; Pei-Tzu Lee; Wan-Zhen Hsieh; Ying-Syuan Wu
元智大學	Sep-16	Real-time Study of Electromigration in Sn Blech Structure	Cheng-En Ho; Wan-Zhen Hsieh; Cheng-Hsien Yang; Pei-Tzu Lee
元智大學	Nov-14	Pronounced Effects of Ni(P) Thickness on the Interfacial Reaction and High Impact Resistance of the Solder/Au/Pd(P)/Ni(P)/Cu Reactive System	Cheng-En Ho; Chia-Wei Fan; Wan-Zhen Hsieh
元智大學	Nov-14	Electron Backscatter Diffraction Analysis on the Microstructures of Electrolytic Cu Deposition in the Through Hole Filling Process: Butterfly Deposition Mode	Cheng-En Ho; Wan-Zhen Hsieh; Chang-Chih Chen; Ming-Kai Lu
元智大學	Mar-18	High-temperature stability of Au/Pd/Cu and Au/Pd(P)/Cu surface finishes	Cheng-En Ho; Wan-Zhen Hsieh; Pei-Tzu Lee; Yu-Hsuan Huang; Tsai-Tung Kuo
元智大學	Jun-22	Synchrotron X-ray study of electromigration, whisker growth, and residual strain evolution in a Sn Blech structure	Pei-Tzu Lee; Wan-Zhen Hsieh; Cheng-Yu Lee; Shao-Chin Tseng; Mau-Tsu Tang; Ching-Yu Chiang; C.R. Kao; Cheng-En Ho
元智大學	Jun-17	High-speed Cu Electrodeposition and Its Solderability	Pei-Tzu Lee; Ying-Syuan Wu; Pin-Chung Lin; Chang-Chih Chen; Wan-Zhen Hsieh; Cheng-En Ho
元智大學	Jan-19	Reaction of Au/Pd/Cu and Au/Pd/Au/Cu multilayers with Sn-Ag-Cu alloy	Yu-Hsuan Huang; Wan-Zhen Hsieh; Pei-Tzu Lee; Ying-Syuan Wu; Tsai-Tung Kuo; Cheng-En Ho
元智大學	Jan-15	Depletion and Phase Transformation of a Submicron Ni(P) Film in the Early Stage of Soldering Reaction between Sn-Ag-Cu and Au/Pd(P)/Ni(P)/Cu	Cheng-En Ho; Wan-Zhen Hsieh; Tsung-Hsun Yang
元智大學	Jan-15	Interfacial Reaction and Mechanical Characterization of Sn-Ag-Cu/Au/Pd(P)/Cu Solder Joints: Thick Pd(P) Deposition	Cheng-En Ho; Wan-Zhen Hsieh; Cheng-Hsien Yang; Ting-Chun Yeh; Tsai-Tung Kuo
元智大學	Feb-19	Interfacial reaction and mechanical reliability between Sn-3Ag-0.5Cu alloy and ultrathin-Ni(P)-type Au/Pd(P)/Ni(P)/Cu metallization pad	Ying-Syuan Wu; Pei-Tzu Lee; Wan-Zhen Hsieh; Tsai-Tung Kuo; Cheng-En Ho
元智大學	Dec-14	Theoretical and experimental determination of Cu diffusivity in eutectic Sn-Ag system at 235-280 degrees C	Cheng-En Ho; Wan-Zhen Hsieh; Chao-Sheng Liu; Cheng-Hsien Yang
元智大學	Aug-16	Comparative Study between Au/Pd/Cu and Au/Pd(P)/Cu Films in Soldering Applications	Pei-Tzu Lee; Wan-Zhen Hsieh; Ting-Chun Yeh; Hsiao-Keng Wang; Cheng-En Ho
元智大學	Aug-16	Interfacial Microstructures and Mechanical Properties of Molten Sn Reacting with Ni-xP Films	Wan-Zhen Hsieh; Md. Arifur Rahman; Tsung-Hsun Yang; Tsai-Tung Kuo; Cheng-En Ho
元智大學	2018-11-16	Synchrotron X-ray Nanodiffraction Study of Tin Whisker Growth	Wan-Zhen Hsieh; Pei-Tzu Lee; Wei-Ling·Chou; Ching-Shun Ku; Cheng-En Ho
元智大學	2018-11-16	Characterization of Allotropic Phase Transformation of Hexagonal- into Monoclinic-Cu6Sn5 Using Synchrotron White X-ray Laue Diffraction	Pei-Tzu Lee; Wan-Zhen Hsieh; Cheng-Yu Lee; Ching-Shun Ku; C. Robert Kao; Cheng-En Ho
元智大學	2018-11-16	Flexible Ni(P) Microstructure and Its Working Mechanism	Wei-Ling Chou; Wan-Zhen Hsieh; Cheng-Yu Lee; Cheng-Sam Peng; Tsai-Tung Kuo; Cheng-En Ho
元智大學	2018-10-23	Toward A Better Understanding of Working Mechanism of Flexible Ni(P)	Wei-Ling Chou; Wan-Zhen Hsieh; Cheng-Yu Lee; Cheng-Sam Peng; Tsai-Tung Kuo; Cheng-En Ho
元智大學	2018	錫之電遷移行為及其引發錫鬚生長機制	謝宛蓁; Wan-Zhen Hsieh
元智大學	2016-10-26	Reliability Testing of Au/Pd/Cu and Au/Pd(P)/Cu Surface Finishes at High Temperature Storage	Cheng-En Ho; Wan-Zhen Hsieh; Pei-Tzu Lee; Tsai-Tung Kuo
元智大學	2014-10-22	Correlation between Ni(P) Depletion and IMCs Formation in Microelectronic Solder Joints with A Submicron Ni(P) Surface Finish	Wan-Zhen Hsieh; Tsung-Hsun Yang; Wei-Hsiang Wu; Yu-Wei Lee; Cheng-En Ho
元智大學	2014-10-22	Unusual Cu Depletion in Line-bump Solder Joints under Current Stressing	Cheng-En Ho; Cheng-Hsien Yang; Wan-Zhen Hsieh; Bo-Zong Chen

Showing items 1-22 of 22 (1 Page(s) Totally)
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