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Institution Date Title Author
元智大學 2014-10-22 Correlation between Ni(P) Depletion and IMCs Formation in Microelectronic Solder Joints with A Submicron Ni(P) Surface Finish Wan-Zhen Hsieh; Tsung-Hsun Yang; Wei-Hsiang Wu; Yu-Wei Lee; Cheng-En Ho
元智大學 2014-10-22 Unusual Cu Depletion in Line-bump Solder Joints under Current Stressing Cheng-En Ho; Cheng-Hsien Yang; Wan-Zhen Hsieh; Bo-Zong Chen

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