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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)
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Institution Date Title Author
元智大學 Sep-18 TEM Characterization of Cu Self-annealing and Direct Proof of Pinhole Formation Mechanism in a Cu Film Cheng-En Ho; Chang-Chih Chen; Cheng-Hsien Yang; Pei-Tzu Lee; Wan-Zhen Hsieh; Ying-Syuan Wu
元智大學 Sep-16 Real-time Study of Electromigration in Sn Blech Structure Cheng-En Ho; Wan-Zhen Hsieh; Cheng-Hsien Yang; Pei-Tzu Lee
元智大學 Nov-14 Pronounced Effects of Ni(P) Thickness on the Interfacial Reaction and High Impact Resistance of the Solder/Au/Pd(P)/Ni(P)/Cu Reactive System Cheng-En Ho; Chia-Wei Fan; Wan-Zhen Hsieh
元智大學 Nov-14 Electron Backscatter Diffraction Analysis on the Microstructures of Electrolytic Cu Deposition in the Through Hole Filling Process: Butterfly Deposition Mode Cheng-En Ho; Wan-Zhen Hsieh; Chang-Chih Chen; Ming-Kai Lu
元智大學 Mar-18 High-temperature stability of Au/Pd/Cu and Au/Pd(P)/Cu surface finishes Cheng-En Ho; Wan-Zhen Hsieh; Pei-Tzu Lee; Yu-Hsuan Huang; Tsai-Tung Kuo
元智大學 Jun-22 Synchrotron X-ray study of electromigration, whisker growth, and residual strain evolution in a Sn Blech structure Pei-Tzu Lee; Wan-Zhen Hsieh; Cheng-Yu Lee; Shao-Chin Tseng; Mau-Tsu Tang; Ching-Yu Chiang; C.R. Kao; Cheng-En Ho
元智大學 Jun-17 High-speed Cu Electrodeposition and Its Solderability Pei-Tzu Lee; Ying-Syuan Wu; Pin-Chung Lin; Chang-Chih Chen; Wan-Zhen Hsieh; Cheng-En Ho
元智大學 Jan-19 Reaction of Au/Pd/Cu and Au/Pd/Au/Cu multilayers with Sn-Ag-Cu alloy Yu-Hsuan Huang; Wan-Zhen Hsieh; Pei-Tzu Lee; Ying-Syuan Wu; Tsai-Tung Kuo; Cheng-En Ho
元智大學 Jan-15 Depletion and Phase Transformation of a Submicron Ni(P) Film in the Early Stage of Soldering Reaction between Sn-Ag-Cu and Au/Pd(P)/Ni(P)/Cu Cheng-En Ho; Wan-Zhen Hsieh; Tsung-Hsun Yang
元智大學 Jan-15 Interfacial Reaction and Mechanical Characterization of Sn-Ag-Cu/Au/Pd(P)/Cu Solder Joints: Thick Pd(P) Deposition Cheng-En Ho; Wan-Zhen Hsieh; Cheng-Hsien Yang; Ting-Chun Yeh; Tsai-Tung Kuo

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