臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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	2019臺灣學術機構典藏研討會
	機構典藏系統RC7版本已發佈

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Institution	Date	Title	Author
元智大學	Feb-19	Interfacial reaction and mechanical reliability between Sn-3Ag-0.5Cu alloy and ultrathin-Ni(P)-type Au/Pd(P)/Ni(P)/Cu metallization pad	Ying-Syuan Wu; Pei-Tzu Lee; Wan-Zhen Hsieh; Tsai-Tung Kuo; Cheng-En Ho
元智大學	Dec-14	Theoretical and experimental determination of Cu diffusivity in eutectic Sn-Ag system at 235-280 degrees C	Cheng-En Ho; Wan-Zhen Hsieh; Chao-Sheng Liu; Cheng-Hsien Yang
元智大學	Aug-16	Comparative Study between Au/Pd/Cu and Au/Pd(P)/Cu Films in Soldering Applications	Pei-Tzu Lee; Wan-Zhen Hsieh; Ting-Chun Yeh; Hsiao-Keng Wang; Cheng-En Ho
元智大學	Aug-16	Interfacial Microstructures and Mechanical Properties of Molten Sn Reacting with Ni-xP Films	Wan-Zhen Hsieh; Md. Arifur Rahman; Tsung-Hsun Yang; Tsai-Tung Kuo; Cheng-En Ho
元智大學	2018-11-16	Synchrotron X-ray Nanodiffraction Study of Tin Whisker Growth	Wan-Zhen Hsieh; Pei-Tzu Lee; Wei-Ling·Chou; Ching-Shun Ku; Cheng-En Ho
元智大學	2018-11-16	Characterization of Allotropic Phase Transformation of Hexagonal- into Monoclinic-Cu6Sn5 Using Synchrotron White X-ray Laue Diffraction	Pei-Tzu Lee; Wan-Zhen Hsieh; Cheng-Yu Lee; Ching-Shun Ku; C. Robert Kao; Cheng-En Ho
元智大學	2018-11-16	Flexible Ni(P) Microstructure and Its Working Mechanism	Wei-Ling Chou; Wan-Zhen Hsieh; Cheng-Yu Lee; Cheng-Sam Peng; Tsai-Tung Kuo; Cheng-En Ho
元智大學	2018-10-23	Toward A Better Understanding of Working Mechanism of Flexible Ni(P)	Wei-Ling Chou; Wan-Zhen Hsieh; Cheng-Yu Lee; Cheng-Sam Peng; Tsai-Tung Kuo; Cheng-En Ho
元智大學	2018	錫之電遷移行為及其引發錫鬚生長機制	謝宛蓁; Wan-Zhen Hsieh
元智大學	2016-10-26	Reliability Testing of Au/Pd/Cu and Au/Pd(P)/Cu Surface Finishes at High Temperature Storage	Cheng-En Ho; Wan-Zhen Hsieh; Pei-Tzu Lee; Tsai-Tung Kuo
元智大學	2014-10-22	Correlation between Ni(P) Depletion and IMCs Formation in Microelectronic Solder Joints with A Submicron Ni(P) Surface Finish	Wan-Zhen Hsieh; Tsung-Hsun Yang; Wei-Hsiang Wu; Yu-Wei Lee; Cheng-En Ho
元智大學	2014-10-22	Unusual Cu Depletion in Line-bump Solder Joints under Current Stressing	Cheng-En Ho; Cheng-Hsien Yang; Wan-Zhen Hsieh; Bo-Zong Chen

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