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Showing items 1-17 of 17 (1 Page(s) Totally)
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| 國立交通大學 |
2019-04-02T06:04:29Z |
An 80 nm In0.7Ga0.3As MHEMT with Flip-Chip Packaging for W-Band Low Noise Applications
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Wang, Chin-Te; Kuo, Chien-, I; Lim, Wee-Chin; Hsu, Li-Han; Hsu, Heng-Tung; Miyamoto, Yasuyuki; Chang, Edward Yi; Tsai, Szu-Ping; Chiu, Yu-Sheng |
| 國立交通大學 |
2019-04-02T05:59:39Z |
V-Band Flip-Chip Assembled Gain Block Using In0.6Ga0.4As Metamorphic High-Electron-Mobility Transistor Technology
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Chiang, Che-Yang; Hsu, Heng-Tung; Wang, Chin-Te; Kuo, Chien-I; Hsu, Heng-Shou; Chang, Edward Yi |
| 國立交通大學 |
2014-12-16T06:15:32Z |
High Frequency Flip Chip Package Process of Polymer Substrate and Structure thereof
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Chang, Edward-yi; Hsu, Li-Han; Oil, Chee-Way; Wu, Wei-Cheng; Wang, Chin-te |
| 國立交通大學 |
2014-12-16T06:15:24Z |
HIGH FREQUENCY FLIP CHIP PACKAGE STRUCTURE OF POLYMER SUBSTRATE
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Chang Edward-yi; Hsu Li-Han; Oh Chee-Way; Wu Wei-Cheng; Wang Chin-te |
| 國立交通大學 |
2014-12-16T06:14:18Z |
High frequency flip chip package process of polymer substrate and structure thereof
|
Chang Edward-yi; Hsu Li-Han; Oh Chee-Way; Wu Wei-Cheng; Wang Chin-te |
| 國立交通大學 |
2014-12-12T02:40:03Z |
應用於毫微米波段高電子遷移率電晶體之覆晶封裝研究
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王景德; Wang, Chin-Te; 張翼; Chang, Edward Yi |
| 國立交通大學 |
2014-12-08T15:48:37Z |
Design of Flip-Chip Interconnect Using Epoxy-Based Underfill Up to V-Band Frequencies With Excellent Reliability
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Hsu, Li-Han; Wu, Wei-Cheng; Chang, Edward Yi; Zirath, Herbert; Hu, Yin-Chu; Wang, Chin-Te; Wu, Yun-Chi; Tsai, Szu-Ping |
| 國立交通大學 |
2014-12-08T15:37:07Z |
An 80 nm In(0.7)Ga(0.3)As MHEMT with Flip-Chip Packaging for W-Band Low Noise Applications
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Wang, Chin-Te; Kuo, Chien-I; Lim, Wee-Chin; Hsu, Li-Han; Hsu, Heng-Tung; Miyamoto, Yasuyuki; Chang, Edward Yi; Tsai, Szu-Ping; Chiu, Yu-Sheng |
| 國立交通大學 |
2014-12-08T15:34:36Z |
Investigation of the Flip-Chip Package With BCB Underfill for W-Band Applications
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Wang, Chin-Te; Hsu, Li-Han; Wu, Wei-Cheng; Hsu, Heng-Tung; Chang, Edward Yi; Hu, Yin-Chu; Lee, Ching-Ting; Tsai, Szu-Ping |
| 國立交通大學 |
2014-12-08T15:33:24Z |
Assessment of Thermal Impact on Performance of Metamorphic High-Electron-Mobility Transistors on Polymer Substrates Using Flip-Chip-on-Board Technology
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Wang, Chin-Te; Hsu, Heng-Tung; Chiang, Che-Yang; Chang, Edward Yi; Lim, Wee-Chin |
| 國立交通大學 |
2014-12-08T15:29:06Z |
Flip-Chip Packaging of In0.6Ga0.4As MHEMT Device on Low-Cost Organic Substrate for W-Band Applications
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Lim, Wee Chin; Wang, Chin-Te; Kuo, Chien-I; Hsu, Li-Han; Tsai, Szu-Ping; Chang, Edward Yi |
| 國立交通大學 |
2014-12-08T15:27:17Z |
Flip-Chip Packaging of Low-Noise Metamorphic High Electron Mobility Transistors on Low-Cost Organic Substrate
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Wang, Chin-Te; Kuo, Chien-I; Hsu, Heng-Tung; Chang, Edward Yi; Hsu, Li-Han; Lim, Wee-Chin; Miyamoto, Yasuyuki |
| 國立交通大學 |
2014-12-08T15:24:24Z |
InGaP/GaAs Dual-Junction Solar Cell with AlGaAs/GaAs Tunnel Diode Grown on 10 degrees off Misoriented GaAs Substrate
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Yu, Hung Wei; Chung, Chen Chen; Wang, Chin Te; Hong Quan Nguyen; Binh Tinh Tran; Lin, Kung Liang; Dee, Chang Fu; Majlis, Burhanuddin Yeop; Chang, Edward Yi |
| 國立交通大學 |
2014-12-08T15:21:53Z |
Design, Fabrication, and Reliability of Low-Cost Flip-Chip-On-Board Package for Commercial Applications up to 50 GHz
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Hsu, Li-Han; Oh, Chee-Way; Wu, Wei-Cheng; Chang, Edward Yi; Zirath, Herbert; Wang, Chin-Te; Tsai, Szu-Ping; Lim, Wee-Chin; Lin, Yueh-Chin |
| 國立交通大學 |
2014-12-08T15:20:45Z |
V-Band Flip-Chip Assembled Gain Block Using In(0.6)Ga(0.4)As Metamorphic High-Electron-Mobility Transistor Technology
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Chiang, Che-Yang; Hsu, Heng-Tung; Wang, Chin-Te; Kuo, Chien-I; Hsu, Heng-Shou; Chang, Edward Yi |
| 國立交通大學 |
2014-12-08T15:07:28Z |
Design and Fabrication of 0/1-Level RF-Via Interconnect for RF-MEMS Packaging Applications
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Hsu, Li-Han; Wu, Wei-Cheng; Chang, Edward Yi; Zirath, Herbert; Wu, Yun-Chi; Wang, Chin-Te; Lee, Ching-Ting |
| 國立成功大學 |
2014-01 |
Investigation of the Flip-Chip Package With BCB Underfill for W-Band Applications
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Wang, Chin-Te; Hsu, Li-Han; Wu, Wei-Cheng; Hsu, Heng-Tung; Chang, Edward Yi; Hu, Yin-Chu; Lee, Ching-Ting; Tsai, Szu-Ping |
Showing items 1-17 of 17 (1 Page(s) Totally)
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