國立臺灣大學 |
2010 |
控制水稻穀粒長、穀粒寬、抽穗期、株高與穗長之數量性狀基因座的遺傳定位
|
王群山; Wang, Chun-Shan |
國立成功大學 |
2009-03 |
Low Dielectric and Flame-Retardant Properties of Thermosetting Redistributed Poly(phenylene oxide)
|
Hwang, Hann-Jang; Hsu, Su-Wen; Wang, Chun-Shan |
國立成功大學 |
2008-11-15 |
Flame retardancy and dielectric properties of dicyclopentadiene-based benzoxazine cured with a phosphorus-containing phenolic resin
|
Hwang, Hann-Jang; Lin, Chi-Y.; Wang, Chun-Shan |
國立成功大學 |
2008-11-05 |
Synthesis and physical properties of low-molecular-weight redistributed poly(2,6-dimethyl-1,4-phenylene oxide) for epoxy resin
|
Hwang, Hann-Jang; Hsu, Su-Wen; Wang, Chun-Shan |
國立成功大學 |
2008-08 |
Low dielectric epoxy resins from dicyclopentadiene-containing poly(phenylene oxide) novolac cured with dicyclopentadiene containing epoxy
|
Hwang, Hann-Jang; Hsu, Su-Wen; Chung, Chia-Lung; Wang, Chun-Shan |
國立成功大學 |
2008-03-05 |
Structure and properties for conterminously linked polymer of copoly(amic acid) with triallyl isocyanurate and bismaleimide
|
Huang, Chien-Lin; Wang, Chun-Shan; Leu, Tsu-Shang |
國立成功大學 |
2008 |
Low Dielectric Thermoset from Redistributed Poly(phenylene oxide)
|
Hwang, Hann-Jang; Hsu, Su-Wen; Wang, Chun-Shan |
國立成功大學 |
2007-02-05 |
Dielectric and thermal properties of polymer network based on bismaleimide resin and cyanate ester containing dicyclopentadiene or dipentene. III
|
Hwang, Hann-Jang; Shieh, Jeng-Yueh; Li, Chun-Hung; Wang, Chun-Shan |
國立成功大學 |
2006-11 |
Synthesis and properties of bismaleimide resin containing dicyclopentadiene or dipentene. VI
|
Hwang, Hann-Jang; Li, Chun-Hung; Wang, Chun-Shan |
國立成功大學 |
2006-06-05 |
Synthesis and characterization of novel dihydrobenzoxazine resins
|
Shieh, Jeng-Yueh; Lin, Chi-Y.; Huang, Chine-Lin; Wang, Chun-Shan |
國立成功大學 |
2006-02-08 |
Dielectric and thermal properties of dicyclopentadiene containing bismaleimide and cyanate ester. Part IV
|
Hwang, Hann-Jang; Li, Chun-Hung; Wang, Chun-Shan |
國立成功大學 |
2005-06-15 |
Dielectric behavior and properties of a cyanate ester containing dicyclopentadiene. I
|
Hwang, Hann-Jang; Li, Chun-Hung; Wang, Chun-Shan |
國立成功大學 |
2005-04-13 |
Quality prognostics system and method for manufacturing processes
|
Wang, Chun-Shan; Shieh, Jeng-Yueh; Lin, Chi-Yi; Hsieh, Wan-Jung |
國立成功大學 |
2005-02-01 |
Synthesis and properties of a cyanate ester containing dicyclopentadiene(II)
|
Shieh, Jeng-Yueh; Hwang, Hann-Jang; Yang, Shih-Peng; Wang, Chun-Shan |
國立成功大學 |
2005-01-15 |
Synthesis and characterization of novel low-dielectric cyanate esters. II
|
Shieh, Jeng-Yueh; Yang, Shih-Peng; Wang, Chun-Shan |
國立成功大學 |
2004-10-28 |
Method for rapid prototyping by using linear light as sources
|
Huang, Sheng-Jye; Wang, Cheng-Chien; Lee, Sen-Yung; Wang, Chuih-Kuan; Wang, Chun-Shan; Chen, Chuh-Yung; Chen, Chieh-Li; Lai, Wei-Siang; Hsieh, Chen; Leu, Tzong-Shing; Cheng, Chun-I |
國立成功大學 |
2004-10-15 |
Synthesis and characterization of novel polyesterimides
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Shieh, Jeng-Yueh; Hsu, Pei-Hsuan; Wang, Chun-Shan |
國立成功大學 |
2004-06-01 |
Synthesis and characterization of novel low-dielectric cyanate esters
|
Shieh, Jeng-Yueh; Yang, Shih-Peng; Wu, Mei-Feng; Wang, Chun-Shan |
國立成功大學 |
2004-04-05 |
Synergistic effect of a phosphorus-nitrogen flame retardant on engineering plastics
|
Leu, Tsu-Shang; Wang, Chun-Shan |
國立成功大學 |
2003-06-13 |
Low dielectric thermoset. I. Synthesis and properties of novel 2,6-dimethyl phenol-dicyclopentadiene epoxy
|
Lin, Ching-Hsuan; Chiang, Jung-Chung; Wang, Chun-Shan |
國立成功大學 |
2003-05-23 |
Synthesis and characterization of copolyimides with high solubility
|
Leu, Tsu-Shang; Wang, Chun-Shan |
國立成功大學 |
2003-02-07 |
Synthesis and properties of polyimides containing bisphenol unit and flexible ether linkages
|
Leu, Tsu-Shang; Wang, Chun-Shan |
國立成功大學 |
2002-12 |
Synthesis and properties of copolyimides containing naphthalene group
|
Leu, Tsu-Shang; Wang, Chun-Shan |
國立成功大學 |
2002-11-15 |
Low dielectric thermoset. II. Synthesis and properties of novel 2,6-dimethyl phenol-dipentene epoxy
|
Lin, Ching-Hsuan; Jiang, Zheng Rong; Wang, Chun-Shan |
國立成功大學 |
2002-05 |
Synthesis, characterization and properties of tetramethyl stilbene-based epoxy resins for electronic encapsulation
|
Lin, Ching-Hsuan; Huang, Jung-Min; Wang, Chun-Shan |