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"wang chun shan"的相关文件
显示项目 31-40 / 49 (共5页) << < 1 2 3 4 5 > >> 每页显示[10|25|50]项目
| 國立成功大學 |
2001-02 |
Modification of epoxy resin with siloxane containing phenol aralkyl epoxy resin for electronic encapsulation application
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Ho, Tsung-Han; Wang, Chun-Shan |
| 國立成功大學 |
2001-02 |
Synthesis and luminescent characteristics of novel phosphorus containing light-emitting polymers
|
Sun, Yih-Min; Wang, Chun-Shan |
| 國立成功大學 |
2000-11-28 |
Synthesis and properties of novel phosphorus-containing hardener for epoxy resins
|
Shieh, Jeng-Yueh; Wang, Chun-Shan |
| 國立成功大學 |
2000-11 |
Novel phosphorus-containing epoxy resins. Part II: Curing kinetics
|
Wang, Chun-Shan; Lin, Ching-Hsuan |
| 國立成功大學 |
2000-10-03 |
Synthesis and properties of phosphorus-containing advanced epoxy resins. II
|
Lin, Ching-Hsuan; Wu, C. Y.; Wang, Chun-Shan |
| 國立成功大學 |
2000-06-15 |
Synthesis and property of phosphorus-containing bismaleimide by a novel method
|
Lin, Ching-Hsuan; Wang, Chun-Shan |
| 國立成功大學 |
2000-05 |
Synthesis and characterization of polyimides containing naphthalene pendant group and flexible ether linkages
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Wang, Chun-Shan; Leu, Tsu-Shang |
| 國立成功大學 |
2000-05 |
Synthesis and properties of epoxy resins containing 2-(6-oxid-6H-dibenz(c,e)(1,2) oxaphosphorin-6-yl) 1,4-benzenediol (II)
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Wang, Chun-Shan; Lee, M. C. |
| 國立成功大學 |
2000-03 |
Synthesis and properties of epoxy resins containing bis(3-hydroxyphenyl) phenyl phosphate
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Wang, Chun-Shan; Shieh, Jeng-Yueh |
| 國立成功大學 |
1999-09 |
Thermally initiated cure kinetic of bismaleimides containing poly(dimethylsiloxane)
|
Wang, Chun-Shan; Leu, Tsu-Shang |
显示项目 31-40 / 49 (共5页) << < 1 2 3 4 5 > >> 每页显示[10|25|50]项目
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