臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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Institution	Date	Title	Author
國立成功大學	2002-01	Effect of composition and thermal cycling on the adhesion strength of Sn-Zn-Al solder hot-dipped on Cu substrate	Yu, Shan-Pu; Wang, Hsin-Chien; Wang, Moo-Chin; Hon, Min-Hsiung
國立成功大學	2000-06	Composition and heat-treatment effects on the adhesion strength of Sn-Zn-Al solders on Cu substrate	Yu, Shan-Pu; Hon, Min-Hsiung; Wang, Hsin-Chien; Wang, Moo-Chin

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