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教育部委託研究計畫 計畫執行:國立臺灣大學圖書館
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"wang moo chin"的相關文件
顯示項目 91-100 / 137 (共14頁)
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| 國立成功大學 |
2003-07 |
Transformation kinetics for mullite in kaolin-Al2O3 ceramics
|
Chen, Yung-Feng; Wang, Moo-Chin; Hon, Min-Hsiung |
| 國立成功大學 |
2003-06-30 |
Dielectric properties of Ba(ZrxTi1-x)O-3 thin films prepared using radio frequency magnetron sputtering
|
Hsi, Chi-Shiung; Chen, Chung-Yi; Wu, Nan-Chung; Wang, Moo-Chin |
| 國立成功大學 |
2003-06 |
Solid-state reactions at the Sn-9Zn-xAg lead-free solders/Cu interface
|
Chang, Tao-Chih; Hon, Min-Hsiung; Wang, Moo-Chin |
| 國立成功大學 |
2003-06 |
Adhesion strength of the Sn-9Zn-xAg/Cu interface
|
Chang, Tao-Chih; Hon, Min-Hsiung; Wang, Moo-Chin |
| 國立成功大學 |
2003-05-25 |
Effects of Al2O3 addition on the phases, flow characteristics and morphology of the porous kaolin ceramics
|
Chen, Yung-Feng; Chang, Yu-Hsein; Wang, Moo-Chin; Hon, Min-Hsiung |
| 國立成功大學 |
2003-05-01 |
Crystal growth of the intermetallic compounds at the Sn-9Zn-xAg/Cu interface during isothermal aging
|
Chang, Tao-Chih; Wang, Moo-Chin; Hon, Min-Hsiung |
| 國立成功大學 |
2003-05 |
Effect of Ag addition on the structures of intermetallic compounds and the adhesion strength of the Sn-9Zn-xAg/Cu interface
|
Chang, Tao-Chih; Wang, Moo-Chin; Hon, Min-Hsiung |
| 國立成功大學 |
2003-04-30 |
Intermetallic compounds formed at the interface between Cu substrate and an Sn-9Zn-0.5Ag lead-free solder
|
Chang, Tao-Chih; Hon, Min-Hsiung; Wang, Moo-Chin |
| 國立成功大學 |
2003-03-24 |
Intermetallic compounds formation and interfacial adhesion strength of Sn-9Zn-0.5Ag solder alloy hot-dipped on Cu substrate
|
Chang, Tao-Chih; Hon, Min-Hsiung; Wang, Moo-Chin |
| 國立成功大學 |
2003-03 |
Characterization and dielectric properties of (SrTiO3/BaTiO3)(n) multilayer thin films deposited on Pt/Ti/SiO2/Si substrates by double rf magnetron sputtering
|
Hsi, Chi-Shiung; Shiao, Fu-Yuan; Wu, Nan-Chung; Wang, Moo-Chin |
顯示項目 91-100 / 137 (共14頁)
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