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Showing items 21-37 of 37  (2 Page(s) Totally)
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Institution Date Title Author
國立臺灣科技大學 2018 Theoretical model and experimental analysis of chemical mechanical polishing with the effect of slurry for abrasive removal depth and surface morphology of silicon wafer Lin, Z.-C.;Wang, R.-Y.;Ma, S.-H.
國立臺灣科技大學 2018 Innovative Plasma Process of Grafting Methyl Diallyl Ammonium Salt onto Polypropylene to Impart Antibacterial and Hydrophilic Surface Properties Tsou C.-H.; Yao W.-H.; Hung W.-S.; Suen M.-C.; De Guzman M.; Chen J.; Tsou C.-Y.; Wang R.Y.; Chen J.-C.; Wu C.-S.
國立臺灣科技大學 2018 Establishing a theoretical model for abrasive removal depth of silicon wafer chemical mechanical polishing by integrating a polishing times analytical model and specific down force energy theory Lin Z.-C.; Wang R.-Y.; Jhang Z.-W.
國立臺灣科技大學 2018 Theoretical model and experimental analysis of chemical mechanical polishing with the effect of slurry for abrasive removal depth and surface morphology of silicon wafer Lin, Z.-C.;Wang, R.-Y.;Ma, S.-H.
國立臺灣科技大學 2017 Antibacterial property and cytotoxicity of a poly(lactic acid)/nanosilver-doped multiwall carbon nanotube nanocomposite Tsou, C.-H;Yao, W.-H;Lu, Y.-C;Tsou, C.-Y;Wu, C.-S;Chen, J;Wang, R.Y;Su, C.-C;Hung, W.-S;Guzman, M.D;Suen, M.-C.
國立臺灣科技大學 2016 Establishing a theoretical model for abrasive removal depth of silicon wafer chemical mechanical polishing by integrating a polishing times analytical model and specific down force energy theory Lin, Z.-C;Wang, R.-Y;Jhang, Z.-W.
國立臺灣科技大學 2015 Investigation of abrasive removal depth of sapphire wafer for different slurry volume concentrations of chemical mechanical polishing with cross pattern polishing pad Lin, Z.-C.;Wang, R.-Y.
國立臺灣科技大學 2014 Abrasive removal depth for polishing a sapphire wafer by a cross-patterned polishing pad with different abrasive particle sizes Lin, Z.-C.;Wang, R.-Y.
國立臺灣科技大學 2014 Preparation and characterization of Bioplastic-Based green renewable composites from tapioca with acetyl tributyl citrate as a plasticizer Tsou, C.-H.;Suen, M.-C.;Yao, W.-H.;Yeh, J.-T.;Wu, C.-S.;Tsou, C.-Y.;Chiu, S.-H.;Chen, J.-C.;Wang, R.Y.;Lin, S.-M.;Hung, W.-S.;de Guzman, M.;Hu, C.-C.;Lee, K.-R.
國立臺灣科技大學 2014 A study of simulation of three-dimensional quasi-steady molecular statics nanoscale orthogonal cutting of single-crystal silicon material having rows of atoms with vacancy defect Lin, Z.-C.;Jian, C.-S.;Wang, R.-Y.
國立臺灣科技大學 2013 Investigation of the abrasive removal depth for bowl-shaped structure of sapphire wafer under compensated chemical mechanical polishing Lin, Z.C.;Wang, R.Y.
國立臺灣科技大學 2012 Analytical study of simulated nanoscale abrasive cutting of sapphire substrate by three dimensional quasi-steady molecular statics Lin, Z.-C.;Wang, R.-Y.
國立臺灣科技大學 2010 Simulation of nanoscale orthogonal cutting of single-crystal silicon Lin Z.-C.; Peng S.-S.; Wang R.-Y.
國立臺灣科技大學 2010 Three Dimensional Nanoscale Abrasive Cutting Simulation and Analysis for Single-Crystal Silicon Workpiece Lin, Z.C.;Wang, R.Y.
國立臺灣大學 1988 A Study on Aggradation of Coarse Sediment in Open Channel 顏清連; Wang, R. Y.; Chang, S. Y.; Yen, Chin-Lien; Wang, R. Y.; Chang, S. Y.
國立臺灣大學 1986 Air Slot in Tunnel Spillway of Feitsui Dam 顏清連; Cheng, Y.; Hsu, R. L.; Wang, R. Y.; Yen, Chin-Lien; Cheng, Y.; Hsu, R. L.; Wang, R. Y.
國立臺灣大學 1984 Flow Characteristics around an Aeration Device in Tunnel Spillway 顏清連; Wang, R. Y.; Ho, S. Y.; Cheng, K. C.; Yen, Chin-Lien; Wang, R. Y.; Ho, S. Y.; Cheng, K. C.

Showing items 21-37 of 37  (2 Page(s) Totally)
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