|
English
|
正體中文
|
简体中文
|
總筆數 :0
|
|
造訪人次 :
52572558
線上人數 :
787
教育部委託研究計畫 計畫執行:國立臺灣大學圖書館
|
|
|
"wang s s"的相關文件
顯示項目 571-580 / 1515 (共152頁)
<< < 53 54 55 56 57 58 59 60 61 62 > >>
每頁顯示[10|25|50]項目
| 臺大學術典藏 |
2020-06-03T08:10:46Z |
Thyroid hormone changes cardiovascular surgery and clinical implications
|
Chu S.-H.;Tien-Shang Huang;Hsu R.-B.;Wang S.-S.;Wang C.-J.; Chu S.-H.; TIEN-SHANG HUANG; Hsu R.-B.; Wang S.-S.; Wang C.-J. |
| 臺大學術典藏 |
2020-05-12T02:53:29Z |
Intermetallic compounds formed during the interfacial reactions between liquid In-49Sn solder and Ni substrates
|
Wang, S. S.; Tseng, Y. H.; Chuang, T. H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:19Z |
Corrosion behaviors of Al-Si-Cu-based filler metals and 6061-T6 brazements
|
Su, T.L.; Wang, S.S.; Tsao, L.C.; Chang, S.Y.; Chuang, T.H.; Yeh, M.S.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:19Z |
Corrosion behavior of Al-Si-Cu-(Sn, Zn) brazing filler metals
|
Wang, S.S.; Cheng, M.D.; Tsao, L.C.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:18Z |
Intermetallic compounds formed at the interface between liquid indium and copper substrates
|
Yu, C.L.; Wang, S.S.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:18Z |
Intermetallic compounds formed during interfacial reactions between liquid Sn-8Zn-3Bi solders and Ni substrates
|
Chiu, M.Y.; Wang, S.S.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:18Z |
Soldering reactions between In49Sn and Ag thick films
|
Cheng, M.D.; Wang, S.S.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:16Z |
Morphology and kinetics of discontinuous precipitation and dissolution in an Fe-8.5Al-27Mn-1.0Si-0.92C alloy
|
Chang, S.-Y.; Wang, S.-S.; Tsao, L.-C.; Chuang, T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:14Z |
Intermetallic compounds formed during the interfacial reactions between liquid In-49Sn solder and Ni substrates
|
Wang, S.S.; Tseng, Y.H.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:11Z |
Intermetallic reactions in a Sn-51In solder BGA package with immersion Ag surface finish
|
Jain, C.-C.; Wang, S.-S.; Wu, H.-M.; Chuang, T.-H.; TUNG-HAN CHUANG |
顯示項目 571-580 / 1515 (共152頁)
<< < 53 54 55 56 57 58 59 60 61 62 > >>
每頁顯示[10|25|50]項目
|
