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Showing items 571-580 of 1515  (152 Page(s) Totally)
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Institution Date Title Author
臺大學術典藏 2020-06-03T08:10:46Z Thyroid hormone changes cardiovascular surgery and clinical implications Chu S.-H.;Tien-Shang Huang;Hsu R.-B.;Wang S.-S.;Wang C.-J.; Chu S.-H.; TIEN-SHANG HUANG; Hsu R.-B.; Wang S.-S.; Wang C.-J.
臺大學術典藏 2020-05-12T02:53:29Z Intermetallic compounds formed during the interfacial reactions between liquid In-49Sn solder and Ni substrates Wang, S. S.; Tseng, Y. H.; Chuang, T. H.; TUNG-HAN CHUANG
臺大學術典藏 2020-05-12T02:53:19Z Corrosion behaviors of Al-Si-Cu-based filler metals and 6061-T6 brazements Su, T.L.; Wang, S.S.; Tsao, L.C.; Chang, S.Y.; Chuang, T.H.; Yeh, M.S.; TUNG-HAN CHUANG
臺大學術典藏 2020-05-12T02:53:19Z Corrosion behavior of Al-Si-Cu-(Sn, Zn) brazing filler metals Wang, S.S.; Cheng, M.D.; Tsao, L.C.; Chuang, T.H.; TUNG-HAN CHUANG
臺大學術典藏 2020-05-12T02:53:18Z Intermetallic compounds formed at the interface between liquid indium and copper substrates Yu, C.L.; Wang, S.S.; Chuang, T.H.; TUNG-HAN CHUANG
臺大學術典藏 2020-05-12T02:53:18Z Intermetallic compounds formed during interfacial reactions between liquid Sn-8Zn-3Bi solders and Ni substrates Chiu, M.Y.; Wang, S.S.; Chuang, T.H.; TUNG-HAN CHUANG
臺大學術典藏 2020-05-12T02:53:18Z Soldering reactions between In49Sn and Ag thick films Cheng, M.D.; Wang, S.S.; Chuang, T.H.; TUNG-HAN CHUANG
臺大學術典藏 2020-05-12T02:53:16Z Morphology and kinetics of discontinuous precipitation and dissolution in an Fe-8.5Al-27Mn-1.0Si-0.92C alloy Chang, S.-Y.; Wang, S.-S.; Tsao, L.-C.; Chuang, T.-H.; TUNG-HAN CHUANG
臺大學術典藏 2020-05-12T02:53:14Z Intermetallic compounds formed during the interfacial reactions between liquid In-49Sn solder and Ni substrates Wang, S.S.; Tseng, Y.H.; Chuang, T.H.; TUNG-HAN CHUANG
臺大學術典藏 2020-05-12T02:53:11Z Intermetallic reactions in a Sn-51In solder BGA package with immersion Ag surface finish Jain, C.-C.; Wang, S.-S.; Wu, H.-M.; Chuang, T.-H.; TUNG-HAN CHUANG

Showing items 571-580 of 1515  (152 Page(s) Totally)
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