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教育部委托研究计画 计画执行:国立台湾大学图书馆
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"wang shui jinn"的相关文件
显示项目 91-98 / 98 (共4页)
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| 國立成功大學 |
2002-04 |
Organic light-emitting diode on indium zinc oxide film prepared by ion assisted deposition dc sputtering system
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Lee, William J.; Fang, Yean-Kuen; Ho, Jyh-Jier; Chen, Chin-Ying; Chiou, L. H.; Wang, Shui-Jinn; Dai, F; Hsieh, T; Tsai, Rung-Ywan; Huang, Daoyang; Ho, Fang C. |
| 國立成功大學 |
2001-11 |
Influence of nitrogen doping on the barrier properties of sputtered tantalum carbide films for copper metallization
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Wang, Shui-Jinn; Tsai, Hao-Yi; Sun, Shi-Chung; Shiao, Ming-Hua |
| 國立成功大學 |
2001-09 |
Thermal stability of sputtered tungsten carbide as diffusion barrier for copper metallization
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Wang, Shui-Jinn; Tsai, Hao-Yi; Sun, Shi-Chung; Shiao, M. H. |
| 國立成功大學 |
2001-08-15 |
A comparative study of sputtered TaCx and WCx films as diffusion barriers between Cu and Si
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Wang, Shui-Jinn; Tsai, Hao-Yi; Sun, Shi-Chung |
| 國立成功大學 |
2001-08 |
Characterization of sputtered titanium carbide film as diffusion barrier for copper metallization
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Wang, Shui-Jinn; Tsai, Hao-Yi; Sun, Shi-Chung |
| 國立成功大學 |
2001-08 |
Characterization of sputtered Ta-C-N film in the Cu/barrier/Si contact system
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Wang, Shui-Jinn; Tsai, Hao-Yi; Sun, Shi-Chung; Shiao, M. H. |
| 國立成功大學 |
2001-04 |
Characterization of tungsten carbide as diffusion barrier for Cu metallization
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Wang, Shui-Jinn; Tsai, Hao-Yi; Sun, Shi-Chung |
| 國立成功大學 |
2000-07 |
Characterization of sputtered tantalum carbide barrier layer for copper metallization
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Tsai, Hao-Yi; Sun, Shi-Chung; Wang, Shui-Jinn |
显示项目 91-98 / 98 (共4页)
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