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"wang shui jinn"的相關文件
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| 國立成功大學 |
2005-03 |
Design and fabrication of high breakdown voltage 4H-SiC Schottky barrier diodes with floating metal ring edge terminations
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Chang, Shu-Cheng; Wang, Shui-Jinn; Uang, Kai-Ming; Liou, Bor-Wen |
| 國立成功大學 |
2005-02-14 |
Micro-structures of BF2+- and As+-implanted polycrystalline silicon thin films of various thicknesses and heat treatments
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Liou, Bor-Wen; Chang, Shu-Cheng; Wang, Shui-Jinn |
| 國立成功大學 |
2005-02 |
On the thermal annealing conditions for self-synthesis of tungsten carbide nanowires from WCx films
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Wang, Shui-Jinn; Chen, Chao-Hsuing; Chang, Shu-Cheng; Wong, Chin-Hong; Uang, Kai-Ming; Chen, Tron-Min; Ko, Rong-Ming; Liou, Bor-Wien |
| 國立成功大學 |
2005 |
High power silicon Schottky barrier diodes with different edge termination structures
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Liou, Bor-Wen; Chen, Tron-Min; Chen, Chih-Wei; Uang, Kai-Ming; Wang, Shui-Jinn |
| 國立成功大學 |
2004-09-20 |
Growth and characterization of tungsten carbide nanowires by thermal annealing of sputter-deposited WCx films
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Wang, Shui-Jinn; Chen, Chao-Hsuing; Chang, Shu-Cheng; Uang, Kai-Ming; Juan, Chuan-Ping; Cheng, Huang-Chung |
| 國立成功大學 |
2002-04 |
Organic light-emitting diode on indium zinc oxide film prepared by ion assisted deposition dc sputtering system
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Lee, William J.; Fang, Yean-Kuen; Ho, Jyh-Jier; Chen, Chin-Ying; Chiou, L. H.; Wang, Shui-Jinn; Dai, F; Hsieh, T; Tsai, Rung-Ywan; Huang, Daoyang; Ho, Fang C. |
| 國立成功大學 |
2001-11 |
Influence of nitrogen doping on the barrier properties of sputtered tantalum carbide films for copper metallization
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Wang, Shui-Jinn; Tsai, Hao-Yi; Sun, Shi-Chung; Shiao, Ming-Hua |
| 國立成功大學 |
2001-09 |
Thermal stability of sputtered tungsten carbide as diffusion barrier for copper metallization
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Wang, Shui-Jinn; Tsai, Hao-Yi; Sun, Shi-Chung; Shiao, M. H. |
| 國立成功大學 |
2001-08-15 |
A comparative study of sputtered TaCx and WCx films as diffusion barriers between Cu and Si
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Wang, Shui-Jinn; Tsai, Hao-Yi; Sun, Shi-Chung |
| 國立成功大學 |
2001-08 |
Characterization of sputtered titanium carbide film as diffusion barrier for copper metallization
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Wang, Shui-Jinn; Tsai, Hao-Yi; Sun, Shi-Chung |
| 國立成功大學 |
2001-08 |
Characterization of sputtered Ta-C-N film in the Cu/barrier/Si contact system
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Wang, Shui-Jinn; Tsai, Hao-Yi; Sun, Shi-Chung; Shiao, M. H. |
| 國立成功大學 |
2001-04 |
Characterization of tungsten carbide as diffusion barrier for Cu metallization
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Wang, Shui-Jinn; Tsai, Hao-Yi; Sun, Shi-Chung |
| 國立成功大學 |
2000-07 |
Characterization of sputtered tantalum carbide barrier layer for copper metallization
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Tsai, Hao-Yi; Sun, Shi-Chung; Wang, Shui-Jinn |
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