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| 臺大學術典藏 |
2020-02-03T08:43:21Z |
Modeling noise coupling between package and PCB power/ground planes with an efficient 2-D FDTD/lumped element method
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Wang, Ting-Kuang; Chen, Sin-Ting; Tsai, Chi-Wei; Wu, Sung-Mao; Drewniak, James L.; Wu, Tzong-Lin; CHI-WEI TSAI |
| 國立臺灣大學 |
2010 |
Design and Modelling of Miniaturized Bandgap Structure for Wideband GHz-Noise Suppression Based on LTCC Technology
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Huang, Yu-Wen; Wang, Ting-Kuang; Wu, Tzong-Lin |
| 國立臺灣大學 |
2010 |
Overview of Power Integrity Solutions on Package and PCB: Decoupling and EBG Isolation
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Wu, Tzong-Lin; Chuang, Hao-Hsiang; Wang, Ting-Kuang |
| 國立臺灣大學 |
2009 |
Design and modeling of a stopband-enhanced EBG structure using ground surface perturbation lattice for power/ground noise suppression
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Wang, Ting-Kuang; Hsieh, Chia-Yuan; Chuang, Hao-Hsiang; Wu, Tzong-Lin |
| 國立臺灣大學 |
2008 |
A Novel Power/Ground Layer Using Artificial Substrate EBG for Simultaneously Switching Noise Suppression
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Wang, Ting-Kuang; Han, Tzu-Wei; Wu, Tzong-Lin |
| 國立臺灣大學 |
2007 |
Modeling Noise Coupling Between Package and PCB Power/Ground Planes With an Efficient 2-D FDTD/Lumped Element Method
|
Wang, Ting-Kuang; Chen, Sin-Ting; Tsai, Chi-Wei; Wu, Sung-Mao; Drewniak, J.L.; Wu, Tzong-Lin |
| 國立臺灣大學 |
2005 |
Electromagnetic Bandgap Power/Ground Planes for Wideband Suppression of Ground Bounce Noise and Radiated Emission in High-speed Circuits
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Wu, Tzong-Lin; Lin, Yen-Hui; Wang, Ting-Kuang; Wang, Chien-Chung; Chen, Sin-Ting |
Showing items 1-7 of 7 (1 Page(s) Totally)
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