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Institution Date Title Author
臺大學術典藏 2020-02-03T08:43:21Z Modeling noise coupling between package and PCB power/ground planes with an efficient 2-D FDTD/lumped element method Wang, Ting-Kuang; Chen, Sin-Ting; Tsai, Chi-Wei; Wu, Sung-Mao; Drewniak, James L.; Wu, Tzong-Lin; CHI-WEI TSAI
國立臺灣大學 2010 Design and Modelling of Miniaturized Bandgap Structure for Wideband GHz-Noise Suppression Based on LTCC Technology Huang, Yu-Wen; Wang, Ting-Kuang; Wu, Tzong-Lin
國立臺灣大學 2010 Overview of Power Integrity Solutions on Package and PCB: Decoupling and EBG Isolation Wu, Tzong-Lin; Chuang, Hao-Hsiang; Wang, Ting-Kuang
國立臺灣大學 2009 Design and modeling of a stopband-enhanced EBG structure using ground surface perturbation lattice for power/ground noise suppression Wang, Ting-Kuang; Hsieh, Chia-Yuan; Chuang, Hao-Hsiang; Wu, Tzong-Lin
國立臺灣大學 2008 A Novel Power/Ground Layer Using Artificial Substrate EBG for Simultaneously Switching Noise Suppression Wang, Ting-Kuang; Han, Tzu-Wei; Wu, Tzong-Lin
國立臺灣大學 2007 Modeling Noise Coupling Between Package and PCB Power/Ground Planes With an Efficient 2-D FDTD/Lumped Element Method Wang, Ting-Kuang; Chen, Sin-Ting; Tsai, Chi-Wei; Wu, Sung-Mao; Drewniak, J.L.; Wu, Tzong-Lin
國立臺灣大學 2005 Electromagnetic Bandgap Power/Ground Planes for Wideband Suppression of Ground Bounce Noise and Radiated Emission in High-speed Circuits Wu, Tzong-Lin; Lin, Yen-Hui; Wang, Ting-Kuang; Wang, Chien-Chung; Chen, Sin-Ting

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