| 臺北醫學大學 |
2014 |
Evaluation Physical Characteristics and Comparison Antimicrobial and Anti-Inflammation Potentials of Dental Root Canal Sealers Containing Hinokitiol In Vitro
|
Shih, Yin-Hua;Lin, Dan-Jae;Chang, Kuo-Wei;Hsia, Shih-Min;Ko, Shun-Yao;Lee, Shyh-Yuan;Hsue, Shui-Sang;Wang, Tong-Hong;Chen, Yi-Ling;Shieh, Tzong-Ming |
| 臺北醫學大學 |
2014 |
Evaluation Physical Characteristics and Comparison Antimicrobial and Anti-Inflammation Potentials of Dental Root Canal Sealers Containing Hinokitiol In Vitro
|
Shih, Yin-Hua;Lin, Dan-Jae;Chang, Kuo-Wei;Hsia, Shih-Min;Ko, Shun-Yao;Lee, Shyh-Yuan;Hsue, Shui-Sang;Wang, Tong-Hong;Chen, Yi-Ling;Shieh, Tzong-Ming |
| 國立高雄應用科技大學 |
2010 |
Mechanical Properties of Multilayered Films Using Different Nanoindenters
|
Fang, Te-Hua; Wang, Tong Hong; Wu, Jia-Hung |
| 國立虎尾科技大學 |
2010 |
Nanomechanical Response of Indented Multilayered Nanofilms with Size Effect
|
Wang, Tong Hong;Fang, Te-Hua;Kang, Shao-Hui |
| 國立成功大學 |
2009-01 |
Coupled Power and Thermal Cycling Reliability of Board-Level Package-on-Package Stacking Assembly
|
Wang, Tong Hong; Lai, Yi-Shao; Lee, Chang-Chi; Lin, Yu-Cheng |
| 國立高雄應用科技大學 |
2009 |
Nanomechanical and surface behavior of polydimethylsiloxane-filled nanoporous anodic alumina
|
Fang, Te-Hua;Wang, Tong Hong;Kang, Shao-Hui |
| 國立成功大學 |
2008-11-24 |
晶片尺寸封裝銲接至測試板在功率與溫度耦合循環下之暫態熱傳分析和可靠度評估
|
黃東鴻; Wang, Tong-Hong |
| 國立成功大學 |
2008-06 |
Thermal characteristics and thermomechanical reliability of board-level stacked-die packages subjected to coupled power and thermal cycling test
|
Wang, Tong Hong; Lee, Chang-Chi; Lai, Yi-Shao; Lin, Yu-Cheng |
| 國立成功大學 |
2008-03 |
Finite-element analysis of the mechanical behavior of Au/Cu and Cu/Au multilayers on silicon substrate under nanoindentation
|
Wang, Tong Hong; Fang, Te-Hua; Lin, Yu-Cheng |
| 國立成功大學 |
2008-02 |
Creep characteristics of clamped Cu membranes subjected to indentation
|
Wang, Tong Hong; Fang, Te-Hua; Kang, Shao-Hui; Lin, Yu-Cheng |
| 國立成功大學 |
2008-01 |
Reliability evaluations for board-level chip-scale packages under coupled power and thermal cycling test conditions
|
Wang, Tong Hong; Lai, Yi-Shao; Lin, Yu-Cheng |
| 國立高雄應用科技大學 |
2008 |
Anodization capabilities of scanning probe lithography with conductive and carbon nanotube probes
|
Fang, Te-Hua; Wang, Tong Hong; Wu, Kuan-Te |
| 國立高雄應用科技大學 |
2008 |
Finite-element analysis of the mechanical behavior of Au/Cu and Cu/Au multilayers on silicon substrate under nanoindentation
|
wang, tong hong; fang, te-hua; lin, yu-cheng |
| 國立高雄應用科技大學 |
2008 |
Structural characteristicsofcarbonnanostructuressynthesized by ECR-CVD
|
Fang, Te-Hua; Wang, Tong-Hong; Lu, Deng-Maw; Lien, Wen-Chieh |
| 國立虎尾科技大學 |
2008 |
Anodization Capabilities of Scanning Probe Lithography with Conductive and Carbon Nanotube Probes
|
Fang, Te-Hua;Wang, Tong Hong;Wu, Kuan-Te |
| 國立成功大學 |
2007-04-04 |
Nanoindentation characteristics of clamped freestanding Cu membranes
|
Wang, Tong Hong; Fang, Te-Hua; Kang, Shao-Hui; Lin, Yu-Cheng |
| 國立成功大學 |
2007-02-25 |
A numerical study of factors affecting the characterization of nanoindentation on silicon
|
Wang, Tong Hong; Fang, Te-Hua; Lin, Yu-Cheng |
| 國立高雄應用科技大學 |
2007 |
A numerical study of factors affecting characterization of nanoindentation on silicon
|
Wang, Tong Hong; Fang, Te-Hua; Lin, Yu-Cheng |
| 國立高雄應用科技大學 |
2007 |
Physical behavior of nanoporous anodic alumina using nanoindentation and microhardness tests
|
Fang, Te-Hua; Wang, Tong Hong; Liu, Chien-Hung; Ji, Liang-Wen; Kang, Shao-Hui |
| 國立虎尾科技大學 |
2007 |
Nanoindentation characteristics of clamped freestanding Cu membranes
|
Wang, Tong Hong;Fang, Te-Hua;Kang, Shao-Hui;Lin, Yu-Cheng |
| 國立虎尾科技大學 |
2007 |
A numerical study of factors affecting the characterization of nanoindentation on silicon
|
Wang, Tong Hong;Fang, Te-Hua;Lin, Yu-Cheng |
| 國立成功大學 |
2006-09 |
Transient thermal analysis for board-level chip-scale packages subjected to coupled power and thermal cycling test conditions
|
Wang, Tong-Hong; Lee, Chang-Chi; Lai, Yi-Shao; Lin, Yu-Cheng |
| 國立成功大學 |
2005-10 |
Study on residual stresses of thin-walled injection molding
|
Wang, Tong-Hong; Young, Wen-Bin |
| 國立成功大學 |
2002-06-20 |
薄殼射出件翹曲變形與殘留應力研究
|
黃東鴻; Wang, Tong-Hong |
| 國立成功大學 |
2002-06-20 |
薄殼射出件翹曲變形與殘留應力研究
|
黃東鴻; Wang, Tong-Hong |
