臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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Institution	Date	Title	Author
淡江大學	2025-10-21	Intermixing of Sn3Ag0.5Cu solder balls and Sn52In solder paste for interconnection	Wang, Yi‑Wun;Cheng, Kai‑Lin;Chen, Yu‑Ming;Lin, Xiang‑Ting;Fang, Jang‑Cheng
淡江大學	2023-10-12	Study on the growth mechanisms of Cu‑In compounds at the Sn52In/Cu interface	Wang, Yi‑wun
淡江大學	2023-07-19T04:05:58Z	Partial Segregation of Bi and Microvoid Formation on a Pure Cu Substrate After Solid–Solid Reactions	Wang, Yi‑wun

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