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Showing items 1-50 of 121 (3 Page(s) Totally)
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| 國立交通大學 |
2019-04-03T06:44:25Z |
A Study on the Diffuse Mechanism and the Barrier Property of Copper Manganese Alloy on Tantalum
|
Su, Ying-Sen; Lee, Wen-Hsi; Chang, Shih-Chieh; Wang, Ying-Lang |
| 國立交通大學 |
2019-04-03T06:40:46Z |
Effect of bis-(3-sodiumsulfopropyl disulfide) byproducts on copper defects after chemical mechanical polishing
|
Hung, Chi-Cheng; Lee, Wen-Hsi; Hu, Shao-Yu; Chang, Shih-Chieh; Chen, Kei-Wei; Wang, Ying-Lang |
| 國立交通大學 |
2019-04-02T06:04:50Z |
A Study on the Plating and Wetting Ability of Ruthenium-Tungsten Multi-layers for Advanced Cu Metallization
|
Kuo, Tai-Chen; Su, Yin-Hsien; Lee, Wen-Hsi; Liao, Wei-Hsiang; Wang, Yu-Sheng; Hung, Chi-Cheng; Wang, Ying-Lang |
| 國立交通大學 |
2019-04-02T06:00:17Z |
Effects of direct current and pulse-reverse copper plating incubation behavior of self-annealing
|
Cheng, Min-Yuan; Chen, Kei-Wei; Liu, Tzeng-Feng; Wang, Ying-Lang; Feng, Hsien-Ping |
| 國立交通大學 |
2019-04-02T05:59:51Z |
Pulsed Electrodeposition of CuInSe2 Thin Films onto Mo-Glass Substrates
|
Hu, Shao-Yu; Lee, Wen-Hsi; Chang, Shih-Chieh; Cheng, Yi-Lung; Wang, Ying-Lang |
| 國立交通大學 |
2019-04-02T05:58:56Z |
Enhancement of the Thermal Stability of TiNx Capping Layer on the Nickel Silicides
|
Wu, Chi-Ting; Lee, Wen-Hsi; Chang, Shih-Chieh; Cheng, Yi-Lung; Wang, Ying-Lang |
| 國立交通大學 |
2019-04-02T05:58:53Z |
Effect of N-2/H-2 plasma treatment on the moisture adsorption of MOCVD-TiN films
|
Huang, J. K.; Huang, Cheng-Liang; Chang, Shih-Chieh; Cheng, Yi-Lung; Wang, Ying-Lang |
| 國立交通大學 |
2019-04-02T05:58:26Z |
Effect of Cu-Ion Concentration in Concentrated H3PO4 Electrolyte on Cu Electrochemical Mechanical Planarization
|
Kung, Te-Ming; Liu, Chuan-Pu; Chang, Shih-Chieh; Chen, Kei-Wei; Wang, Ying-Lang |
| 國立交通大學 |
2019-04-02T05:57:52Z |
Silicon introduced effect on resistive switching characteristics of WOX thin films
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Syu, Yong-En; Chang, Ting-Chang; Tsai, Tsung-Ming; Chang, Geng-Wei; Chang, Kuan-Chang; Tai, Ya-Hsiang; Tsai, Ming-Jinn; Wang, Ying-Lang; Sze, Simon M. |
| 國立交通大學 |
2018-08-21T05:54:18Z |
Cleaning methodology of small residue defect with surfactant in copper chemical mechanical polishing post-cleaning
|
Wei, Kuo-Hsiu; Hung, Chi-Cheng; Wang, Yu-Sheng; Liu, Chuan-Pu; Chen, Kei-Wei; Wang, Ying-Lang |
| 國立交通大學 |
2018-08-21T05:52:53Z |
Effect of tungsten incorporation in cobalt tungsten alloys as seedless diffusion barrier materials
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Su, Yin-Hsien; Kuo, Tai-Chen; Lee, Wen-Hsi; Wang, Yu-Sheng; Hung, Chi-Cheng; Tseng, Wei-Hsiang; Wei, Kuo-Hsiu; Wang, Ying-Lang |
| 國立交通大學 |
2018-01-24T07:38:52Z |
先進電子封裝技術無鉛銲錫與銅界面介金屬化合物的探討
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鄭錫圭; 劉增豐; 王英郎; Cheng,Hsi-Kuei; Liu, Tzeng-Feng; Wang, Ying-Lang |
| 國立交通大學 |
2017-04-21T06:56:30Z |
Microstructural Evolution of Cu/Solder/Cu Pillar-Type Structures with Different Diffusion Barriers
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Cheng, Hsi-Kuei; Lin, Yu-Jie; Chen, Chih-Ming; Liu, Kuo-Chio; Wang, Ying-Lang; Liu, Tzeng-Feng |
| 國立交通大學 |
2017-04-21T06:49:59Z |
A study on the plating and wetting ability of ruthenium-tungsten multi-layers for advanced Cu metallization
|
Kuo, Tai-Chen; Su, Yin-Hsien; Lee, Wen-Hsi; Liao, Wei-Hsiang; Wang, Yu-Sheng; Hung, Chi-Cheng; Wang, Ying-Lang |
| 國立交通大學 |
2017-04-21T06:48:55Z |
Cleaning methodology of small residue defect with surfactant in copper chemical mechanical polishing post-cleaning
|
Wei, Kuo-Hsiu; Hung, Chi-Cheng; Wang, Yu-Sheng; Liu, Chuan-Pu; Chen, Kei-Wei; Wang, Ying-Lang |
| 國立成功大學 |
2016-11-01 |
Cleaning methodology of small residue defect with surfactant in copper chemical mechanical polishing post-cleaning
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Wei, Kuo-Hsiu; Hung, Chi-Cheng; Wang, Yu-Sheng; Liu, Chuan-Pu; Chen, Kei-Wei; Wang, Ying-Lang |
| 國立成功大學 |
2016-08-16 |
A study on the plating and wetting ability of ruthenium-tungsten multi-layers for advanced Cu metallization
|
Kuo, Tai-Chen; Su, Yin-Hsien; Lee, Wen-Hsi; Liao, Wei-Hsiang; Wang, Yu-Sheng; Hung, Chi-Cheng; Wang, Ying-Lang |
| 國立交通大學 |
2015-07-21T08:29:25Z |
Unusual Morphological Evolution of the Cu Pillar/Solder Micro-joints During High-Temperature Annealing
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Cheng, Hsi-Kuei; Lin, Yu-Jie; Chang, Hou-Chien; Liu, Kuo-Chio; Wang, Ying-Lang; Liu, Tzeng-Feng; Chen, Chih-Ming |
| 國立交通大學 |
2015-07-21T08:28:57Z |
Interfacial reactions between Cu and SnAgCu solder doped with minor Ni
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Cheng, Hsi-Kuei; Huang, Chin-Wen; Lee, Hsuan; Wang, Ying-Lang; Liu, Tzeng-Feng; Chen, Chih-Ming |
| 國立交通大學 |
2015-07-21T08:28:43Z |
Investigation of Barrier Property of Copper Manganese Alloy on Ruthenium
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Su, Yin-Hsien; Wu, Sze-Ann; Wu, Chia-Yang; Wang, Ying-Lang; Lee, Wen-Hsi |
| 國立交通大學 |
2015-07-21T08:28:09Z |
Effects of Varied Negative Stop Voltages on Current Self-Compliance in Indium Tin Oxide Resistance Random Access Memory
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Lin, Chih-Yang; Chang, Kuan-Chang; Chang, Ting-Chang; Tsai, Tsung-Ming; Pan, Chih-Hung; Zhang, Rui; Liu, Kuan-Hsien; Chen, Hua-Mao; Tseng, Yi-Ting; Hung, Ya-Chi; Syu, Yong-En; Zheng, Jin-Cheng; Wang, Ying-Lang; Zhang, Wei; Sze, Simon M. |
| 國立成功大學 |
2015-06 |
Effects of Varied Negative Stop Voltages on Current Self-Compliance in Indium Tin Oxide Resistance Random Access Memory
|
Lin, Chih-Yang; Chang, Kuan-Chang; Chang, Ting-Chang; Tsai, Tsung-Ming; Pan, Chih-Hung; Zhang, Rui; Liu, Kuan-Hsien; Chen, Hua-Mao; Tseng, Yi-Ting; Hung, Ya-Chi; Syu, Yong-En; Zheng, Jin-Cheng; Wang, Ying-Lang; Zhang, Wei; Sze, Simon M. |
| 國立成功大學 |
2015-03 |
Investigation of Barrier Property of Copper Manganese Alloy on Ruthenium
|
Su, Yin-Hsien; Wu, Sze-Ann; Wu, Chia-Yang; Wang, Ying-Lang; Lee, Wen-Hsi |
| 國立交通大學 |
2014-12-08T15:48:11Z |
Effects of direct current and pulse-reverse copper plating incubation behavior of self-annealing
|
Cheng, Min-Yuan; Chen, Kei-Wei; Liu, Tzeng-Feng; Wang, Ying-Lang; Feng, Hsien-Ping |
| 國立交通大學 |
2014-12-08T15:44:46Z |
Plasma treatment effects on hydrogenated amorphous carbon films prepared by plasma-enhanced chemical vapor deposition
|
Wu, Jun; Wang, Ying-Lang; Kuo, Cheng-Tzu |
| 國立交通大學 |
2014-12-08T15:44:44Z |
Effects of plasma treatment on the precipitation of fluorine-doped silicon oxide
|
Wu, Jun; Wang, Ying-Lang; Kua, Cheng-Tzu |
| 國立交通大學 |
2014-12-08T15:37:57Z |
Effect of Annealing on the Microstructure and Electrical Property of RuN Thin Films
|
Wu, Chia-Yang; Lee, Wen-Hsi; Chang, Shih-Chieh; Cheng, Yi-Lung; Wang, Ying-Lang |
| 國立交通大學 |
2014-12-08T15:37:50Z |
Pulsed Electrodeposition of CuInSe(2) Thin Films onto Mo-Glass Substrates
|
Hu, Shao-Yu; Lee, Wen-Hsi; Chang, Shih-Chieh; Cheng, Yi-Lung; Wang, Ying-Lang |
| 國立交通大學 |
2014-12-08T15:35:56Z |
Effect of polyimide baking on bump resistance in flip-chip solder joints
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Cheng, Hsi-Kuei; Feng, Shien-Ping; Lai, Yi-Jen; Liu, Kuo-Chio; Wang, Ying-Lang; Liu, Tzeng-Feng; Chen, Chih-Ming |
| 國立交通大學 |
2014-12-08T15:33:46Z |
The influence of abrasive particle size in copper chemical mechanical planarization
|
Wei, Kuo-Hsiu; Wang, Yu-Sheng; Liu, Chuan-Pu; Chen, Kei-Wei; Wang, Ying-Lang; Cheng, Yi-Lung |
| 國立交通大學 |
2014-12-08T15:32:22Z |
An electroplating method for copper plane twin boundary manufacturing
|
Wang, Yu-Sheng; Lee, Wen-Hsi; Chang, Shih-Chieh; Nian, Jun-Nan; Wang, Ying-Lang |
| 國立交通大學 |
2014-12-08T15:32:05Z |
Impact of Electroforming Current on Self-Compliance Resistive Switching in an ITO/Gd:SiOx/TiN Structure
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Tseng, Hsueh-Chih; Chang, Ting-Chang; Wu, Yi-Chun; Wu, Sei-Wei; Huang, Jheng-Jie; Chen, Yu-Ting; Yang, Jyun-Bao; Lin, Tzu-Ping; Sze, Simon. M.; Tsai, Ming-Jinn; Wang, Ying-Lang; Chu, Ann-Kuo |
| 國立交通大學 |
2014-12-08T15:31:06Z |
Investigation the Electroplating Behavior of Self Formed CuMn Barrier
|
Wu, Chia-Yang; Lee, Wen-Hsi; Chang, Shih-Chieh; Wang, Ying-Lang |
| 國立交通大學 |
2014-12-08T15:30:42Z |
Atomic-level quantized reaction of HfOx memristor
|
Syu, Yong-En; Chang, Ting-Chang; Lou, Jyun-Hao; Tsai, Tsung-Ming; Chang, Kuan-Chang; Tsai, Ming-Jinn; Wang, Ying-Lang; Liu, Ming; Sze, Simon M. |
| 國立交通大學 |
2014-12-08T15:29:55Z |
Investigating bipolar resistive switching characteristics in filament type and interface type BON-based resistive switching memory
|
Tseng, Hsueh-Chih; Chang, Ting-Chang; Cheng, Kai-Hung; Huang, Jheng-Jie; Chen, Yu-Ting; Jian, Fu-Yen; Sze, Simon M.; Tsai, Ming-Jinn; Chu, Ann-Kuo; Wang, Ying-Lang |
| 國立交通大學 |
2014-12-08T15:29:55Z |
Effects of (002) beta-Ta barrier on copper chemical mechanical polishing behavior
|
Wang, Yu-Sheng; Chen, Kei-Wei; Cheng, Min-Yuan; Lee, Wen-Hsi; Wang, Ying-Lang |
| 國立交通大學 |
2014-12-08T15:29:12Z |
How tantalum proceeds phase change on tantalum nitride underlayer with sequential Ar plasma treatment
|
Tsao, Jung-Chih; Liu, Chuan-Pu; Fang, Hsin-Chiao; Wang, Ying-Lang |
| 國立交通大學 |
2014-12-08T15:24:16Z |
A Novel Synthesis of a CuInSe2 Thin Film from Electrodeposited Cu-Se-In-Se Precursors with Three Steps Annealing
|
Hu, Shao-Yu; Lee, Wen-Hsi; Chang, Shih-Chieh; Wang, Ying-Lang |
| 國立交通大學 |
2014-12-08T15:23:03Z |
Effect of Electrolyte Composition on Cu Stripping of Pt Contact Pins in Semiconductor Cu Electroplating Process
|
Hu, Shao-Yu; Lee, Wen-Hsi; Chang, Shih-Chieh; Wang, Ying-Lang |
| 國立交通大學 |
2014-12-08T15:22:20Z |
A Study of Trimethylsilane (3MS) and Tetramethylsilane (4MS) Based alpha-SiCN:H/alpha-SiCO:H Diffusion Barrier Films
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Chen, Sheng-Wen; Wang, Yu-Sheng; Hu, Shao-Yu; Lee, Wen-Hsi; Chi, Chieh-Cheng; Wang, Ying-Lang |
| 國立交通大學 |
2014-12-08T15:22:12Z |
Investigation of the Galvanic Effect between RuN Barriers and Cu Seed Layers
|
Wu, Chia-Yang; Lee, Wen-Hsi; Chang, Shih-Chieh; Wang, Ying-Lang |
| 國立交通大學 |
2014-12-08T15:21:54Z |
Asymmetric Carrier Conduction Mechanism by Tip Electric Field in WSiOX Resistance Switching Device
|
Syu, Yong-En; Chang, Ting-Chang; Tsai, Tsung-Ming; Chang, Geng-Wei; Chang, Kuan-Chang; Lou, Jyun-Hao; Tai, Ya-Hsiang; Tsai, Ming-Jinn; Wang, Ying-Lang; Sze, Simon M. |
| 國立交通大學 |
2014-12-08T15:21:51Z |
Effect of Electric Potential and Mechanical Force on Copper Electro-Chemical Mechanical Planarization
|
Chen, Sheng-Wen; Kung, Te-Ming; Liu, Chuan-Pu; Chang, Shih-Chieh; Cheng, Yi-Lung; Wang, Ying-Lang |
| 國立交通大學 |
2014-12-08T15:21:29Z |
Silicon introduced effect on resistive switching characteristics of WO(X) thin films
|
Syu, Yong-En; Chang, Ting-Chang; Tsai, Tsung-Ming; Chang, Geng-Wei; Chang, Kuan-Chang; Tai, Ya-Hsiang; Tsai, Ming-Jinn; Wang, Ying-Lang; Sze, Simon M. |
| 國立交通大學 |
2014-12-08T15:11:45Z |
Enhancement of the Thermal Stability of TiN(x) Capping Layer on the Nickel Silicides
|
Wu, Chi-Ting; Lee, Wen-Hsi; Chang, Shih-Chieh; Cheng, Yi-Lung; Wang, Ying-Lang |
| 國立交通大學 |
2014-12-08T15:11:31Z |
Effect of N(2)/H(2) plasma treatment on the moisture adsorption of MOCVD-TiN films
|
Huang, J. K.; Huang, Cheng-Liang; Chang, Shih-Chieh; Cheng, Yi-Lung; Wang, Ying-Lang |
| 國立交通大學 |
2014-12-08T15:11:02Z |
Effect of Under-Layer Treatment of Ta/TaN Barrier Film on Corrosion Between Cu Seed and Ta in Chemical-Mechanical-Polishing Slurry
|
Lee, Wen-Hsi; Hung, Chi-Cheng; Wang, Yu-Sheng; Chang, Shih-Chieh; Wang, Ying-Lang |
| 國立交通大學 |
2014-12-08T15:09:04Z |
Evolution of Fluorine Content with Precipitate Formation in Fluorine-Doped Silicon Oxide
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Wu, Jun; Wang, Ying-Lang; Kuo, Cheng-Tzu; Pan, Fu-Ming |
| 國立交通大學 |
2014-12-08T15:07:51Z |
Effect of Cu-Ion Concentration in Concentrated H(3)PO(4) Electrolyte on Cu Electrochemical Mechanical Planarization
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Kung, Te-Ming; Liu, Chuan-Pu; Chang, Shih-Chieh; Chen, Kei-Wei; Wang, Ying-Lang |
| 國立交通大學 |
2014-12-08T15:07:06Z |
Microstructure and Formation of Copper Oxide in the Cu Electro-Polishing Process
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Kung, Te-Ming; Huang, Michael Rong-Shie; Tsao, Jung-Chih; Liu, Chuan-Pu; Wang, Ying-Lang |
Showing items 1-50 of 121 (3 Page(s) Totally)
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