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Showing items 66-75 of 121  (13 Page(s) Totally)
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Institution Date Title Author
國立成功大學 2011 Effect of Annealing on the Microstructure and Electrical Property of RuN Thin Films Wu, Chia-Yang; Lee, Wen-Hsi; Chang, Shih-Chieh; Cheng, Yi-Lung; Wang, Ying-Lang
國立成功大學 2010-07 Effect of Under-Layer Treatment of Ta/TaN Barrier Film on Corrosion Between Cu Seed and Ta in Chemical-Mechanical-Polishing Slurry Lee, Wen-Hsi; Hung, Chi-Cheng; Wang, Yu-Sheng; Chang, Shih-Chieh; Wang, Ying-Lang
國立成功大學 2010 Bis-(3-sodiumsulfopropyl disulfide) Decomposition with Cathodic Current Flowing in a Copper-Electroplating Bath Lee, Wen-Hsi; Hung, Chi-Cheng; Chang, Shih-Chieh; Wang, Ying-Lang
國立成功大學 2009-07 Magnetic Effect during Copper Electroplating Using Electrochemical Impedance Spectroscopy Hung, Chi-Cheng; Lee, Wen-Hsi; Chang, Shih-Chieh; Hwang, Gwo-Jen; Wang, Ying-Lang
國立成功大學 2009-02 Study of Nitrogen Diffusion Profile of Low Resistivity Diffusion Barrier by Resputtering Technology Tsao, Jung-Chih; Liu, Chuan-Pu; Wang, Ying-Lang; Chen, Kei-Wei
國立成功大學 2009 A Strategic Copper Plating Method Without Annealing Process Chen, Kei-Wei; Hsu, Li-Hsuan; Huang, Jiun-Kai; Wang, Ying-Lang; Lo, Kuang-Yao
國立成功大學 2008-12-25 Plasma over-treatment effect on the MOCVD-TiN contact glue layer Chang, Shih-Chieh; Wang, Ying-Lang; Chan, Din-Yuen; Huang, J. K.; Wang, Ming-Tsong
國立成功大學 2008-12-01 Investigation of deplating behavior of Pt contact pins in semiconductor Cu electroplating process Hu, Shao-Yu; Hung, Chi-Cheng; Lee, Wen-Hsi; Chang, Shih-Chieh; Chan, Din-Yuen; Wang, Ying-Lang
國立成功大學 2008-09 Investigation of the suppression effect of polyethylene glycol on copper electroplating by electrochemical impedance spectroscopy Hung, Chi-Cheng; Lee, Wen-Hsi; Wang, Ying-Lang; Chan, Din-Yuen; Hwang, Gwo-Jen
國立成功大學 2008-09 Investigation of copper scratches and void defects after chemical mechanical polishing Hung, Chi-Cheng; Lee, Wen-Hsi; Chang, Shih-Chieh; Wang, Ying-Lang; Hwang, Gwo-Jen

Showing items 66-75 of 121  (13 Page(s) Totally)
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