| 國立成功大學 |
2009 |
A Strategic Copper Plating Method Without Annealing Process
|
Chen, Kei-Wei; Hsu, Li-Hsuan; Huang, Jiun-Kai; Wang, Ying-Lang; Lo, Kuang-Yao |
| 國立成功大學 |
2008-12-25 |
Plasma over-treatment effect on the MOCVD-TiN contact glue layer
|
Chang, Shih-Chieh; Wang, Ying-Lang; Chan, Din-Yuen; Huang, J. K.; Wang, Ming-Tsong |
| 國立成功大學 |
2008-12-01 |
Investigation of deplating behavior of Pt contact pins in semiconductor Cu electroplating process
|
Hu, Shao-Yu; Hung, Chi-Cheng; Lee, Wen-Hsi; Chang, Shih-Chieh; Chan, Din-Yuen; Wang, Ying-Lang |
| 國立成功大學 |
2008-09 |
Investigation of the suppression effect of polyethylene glycol on copper electroplating by electrochemical impedance spectroscopy
|
Hung, Chi-Cheng; Lee, Wen-Hsi; Wang, Ying-Lang; Chan, Din-Yuen; Hwang, Gwo-Jen |
| 國立成功大學 |
2008-09 |
Investigation of copper scratches and void defects after chemical mechanical polishing
|
Hung, Chi-Cheng; Lee, Wen-Hsi; Chang, Shih-Chieh; Wang, Ying-Lang; Hwang, Gwo-Jen |
| 國立成功大學 |
2008-06-30 |
Under-layer behavior study of low resistance Ta/TaNx barrier film
|
Wang, Yu-Sheng; Hung, Chi-Cheng; Lee, Wen-Hsi; Chang, Shih-Chieh; Wang, Ying-Lang |
| 國立成功大學 |
2008-05 |
The effects of oxygen content on bonding configurations and properties of low-k organosilicate glass dielectric films
|
Chen, Sheng-Wen; Liu, Chuan-Pu; JangJian, Shiu-Ko; Wang, Ying-Lang |
| 國立成功大學 |
2008-05 |
Direct alpha Ta formation on TaN by resputtering for low resistive diffusion barriers
|
Tsao, Jung-Chih; Liu, Chuan-Pu; Wang, Ying-Lang; Chen, Kei-Wei |
| 國立成功大學 |
2008-05 |
The integration solution of copper barrier deposition for nanometer interconnect process
|
Chen, Kei-Wei; Wang, Ying-Lang; Tsao, Jung-Chih; Lo, Kuang-Yao |
| 國立成功大學 |
2008-02 |
The electrical property of plasma-treated Ta/TaNx diffusion barrier
|
Wang, Yu-Sheng; Lee, Wen-Hsi; Wang, Ying-Lang; Hung, Chi-Cheng; Chang, Shih-Chieh |
| 國立成功大學 |
2008-02 |
Mechanism of the metal-insulator-metal capacitance drift for advanced mixed-signal copper process device
|
JangJian, Shiu-Ko; Wang, Ying-Lang; Liao, Mlao-Cheng; Chang, Hung-Jui; Juang, Yungder |
| 國立成功大學 |
2008-02 |
Interface integration defect of copper and low-K materials beyond nano-scale copper damascene process
|
Chen, Kel-Wei; Wang, Ying-Lang; Tsao, Jung-Chih; Juang, Yungder; Lee, Feng-Yi |
| 國立成功大學 |
2008-02 |
The effect of oxygen content on bonding configuration and properties of low-k organosilicate glass dielectric film
|
Chen, Sheng-Wen; Liu, Chuan-Pu; JangJian, Shiu-Ko; Wang, Ying-Lang |
| 國立成功大學 |
2008-02 |
Mechanism of over-etching defects during Ta/TaN barrier resputtering in micro-trench for Cu metallization
|
Tsao, Jung-Chih; Liu, Chuan-Pu; Wang, Ying-Lang; Chen, Kel-Wel; Lo, Kuang-Yao |
| 國立成功大學 |
2008-02 |
Thermal properties of hydrogenated amorphous silicon prepared by high-density plasma chemical vapor deposition
|
Hsao, Wen-Chu; Liu, Chuan-Pu; Wang, Ying-Lang |
| 國立成功大學 |
2008-02 |
Controlling Ta phase in Ta/TaN bilayer by surface pre-treatment on TaN
|
Tsao, Jung-Chih; Liu, Chuan-Pu; Wang, Ying-Lang; Wang, Yu-Sheng; Chen, Ke-Wei |
| 國立成功大學 |
2008-01 |
Effect of bis-(3-sodiumsulfopropyl disulfide) byproducts on copper defects after chemical mechanical polishing
|
Hung, Chi-Cheng; Lee, Wen-Hsi; Hu, Shao-Yu; Chang, Shih-Chieh; Chen, Kei-Wei; Wang, Ying-Lang |
| 國立成功大學 |
2008-01 |
Study of pretreatment prior to silicon-oxycarbide deposition on Cu interconnect
|
Huang, Chun-Chieh; Huang, Jow-Lay; Wang, Ying-Lang; Lo, Kuang-Yao |
| 國立成功大學 |
2008 |
Suppression effect of low-concentration bis-(3-sodiumsulfopropyl disulfide) on copper electroplating
|
Hung, Chi-Cheng; Lee, Wen-Hsi; Chang, Shih-Chieh; Chen, Kei-Wei; Wang, Ying-Lang |
| 國立成功大學 |
2008 |
Investigation of bis-(3-sodiumsulfopropyl disulfide) (SPS) decomposition in a copper-electroplating bath using mass spectroscopy
|
Hung, Chi-Cheng; Lee, Wen-Hsi; Hu, Shao-Yu; Chang, Shih-Chieh; Chen, Kei-Wei; Wang, Ying-Lang |
| 國立成功大學 |
2008 |
Investigation of static corrosion between W metals and TiNx barriers in a W chemical-mechanical-polishing slurry
|
Hung, Chi-Cheng; Wang, Ying-Lang; Lee, Wen-Hsi; Chang, Shih-Chieh |
| 國立成功大學 |
2008 |
Competitive adsorption between bis(3-sodiumsulfopropyl disulfide) and polyalkylene glycols on copper electroplating
|
Hung, Chi-Cheng; Wang, Ying-Lang; Lee, Wen-Hsi; Chang, Shih-Chieh |
| 國立成功大學 |
2008 |
Investigation of slurry chemical corrosion on TaN barriers with plasma treatment
|
Hung, Chi-Cheng; Lee, Wen-Hsi; Wang, Ying-Lang |
| 國立成功大學 |
2007-05 |
Role of surface tension in copper electroplating
|
Chang, Shih-Chieh; Wang, Ying-Lang; Hung, Chi-Cheng; Lee, Wen-His; Hwang, Gwo-Jen |
| 國立成功大學 |
2007 |
Investigation of galvanic corrosion between TaNx barriers and copper seed by electrochemical impedance spectroscopy
|
Hung, Chi-Cheng; Lee, Wen-Hsi; Wang, Yu-Sheng; Chang, Shih-Chieh; Wang, Ying-Lang |
