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显示项目 11-20 / 121 (共13页)
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机构 日期 题名 作者
國立交通大學 2018-08-21T05:52:53Z Effect of tungsten incorporation in cobalt tungsten alloys as seedless diffusion barrier materials Su, Yin-Hsien; Kuo, Tai-Chen; Lee, Wen-Hsi; Wang, Yu-Sheng; Hung, Chi-Cheng; Tseng, Wei-Hsiang; Wei, Kuo-Hsiu; Wang, Ying-Lang
國立交通大學 2018-01-24T07:38:52Z 先進電子封裝技術無鉛銲錫與銅界面介金屬化合物的探討 鄭錫圭; 劉增豐; 王英郎; Cheng,Hsi-Kuei; Liu, Tzeng-Feng; Wang, Ying-Lang
國立交通大學 2017-04-21T06:56:30Z Microstructural Evolution of Cu/Solder/Cu Pillar-Type Structures with Different Diffusion Barriers Cheng, Hsi-Kuei; Lin, Yu-Jie; Chen, Chih-Ming; Liu, Kuo-Chio; Wang, Ying-Lang; Liu, Tzeng-Feng
國立交通大學 2017-04-21T06:49:59Z A study on the plating and wetting ability of ruthenium-tungsten multi-layers for advanced Cu metallization Kuo, Tai-Chen; Su, Yin-Hsien; Lee, Wen-Hsi; Liao, Wei-Hsiang; Wang, Yu-Sheng; Hung, Chi-Cheng; Wang, Ying-Lang
國立交通大學 2017-04-21T06:48:55Z Cleaning methodology of small residue defect with surfactant in copper chemical mechanical polishing post-cleaning Wei, Kuo-Hsiu; Hung, Chi-Cheng; Wang, Yu-Sheng; Liu, Chuan-Pu; Chen, Kei-Wei; Wang, Ying-Lang
國立成功大學 2016-11-01 Cleaning methodology of small residue defect with surfactant in copper chemical mechanical polishing post-cleaning Wei, Kuo-Hsiu; Hung, Chi-Cheng; Wang, Yu-Sheng; Liu, Chuan-Pu; Chen, Kei-Wei; Wang, Ying-Lang
國立成功大學 2016-08-16 A study on the plating and wetting ability of ruthenium-tungsten multi-layers for advanced Cu metallization Kuo, Tai-Chen; Su, Yin-Hsien; Lee, Wen-Hsi; Liao, Wei-Hsiang; Wang, Yu-Sheng; Hung, Chi-Cheng; Wang, Ying-Lang
國立交通大學 2015-07-21T08:29:25Z Unusual Morphological Evolution of the Cu Pillar/Solder Micro-joints During High-Temperature Annealing Cheng, Hsi-Kuei; Lin, Yu-Jie; Chang, Hou-Chien; Liu, Kuo-Chio; Wang, Ying-Lang; Liu, Tzeng-Feng; Chen, Chih-Ming
國立交通大學 2015-07-21T08:28:57Z Interfacial reactions between Cu and SnAgCu solder doped with minor Ni Cheng, Hsi-Kuei; Huang, Chin-Wen; Lee, Hsuan; Wang, Ying-Lang; Liu, Tzeng-Feng; Chen, Chih-Ming
國立交通大學 2015-07-21T08:28:43Z Investigation of Barrier Property of Copper Manganese Alloy on Ruthenium Su, Yin-Hsien; Wu, Sze-Ann; Wu, Chia-Yang; Wang, Ying-Lang; Lee, Wen-Hsi

显示项目 11-20 / 121 (共13页)
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