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"wang ying lang"的相關文件
顯示項目 1-25 / 121 (共5頁)
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| 國立交通大學 |
2019-04-03T06:44:25Z |
A Study on the Diffuse Mechanism and the Barrier Property of Copper Manganese Alloy on Tantalum
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Su, Ying-Sen; Lee, Wen-Hsi; Chang, Shih-Chieh; Wang, Ying-Lang |
| 國立交通大學 |
2019-04-03T06:40:46Z |
Effect of bis-(3-sodiumsulfopropyl disulfide) byproducts on copper defects after chemical mechanical polishing
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Hung, Chi-Cheng; Lee, Wen-Hsi; Hu, Shao-Yu; Chang, Shih-Chieh; Chen, Kei-Wei; Wang, Ying-Lang |
| 國立交通大學 |
2019-04-02T06:04:50Z |
A Study on the Plating and Wetting Ability of Ruthenium-Tungsten Multi-layers for Advanced Cu Metallization
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Kuo, Tai-Chen; Su, Yin-Hsien; Lee, Wen-Hsi; Liao, Wei-Hsiang; Wang, Yu-Sheng; Hung, Chi-Cheng; Wang, Ying-Lang |
| 國立交通大學 |
2019-04-02T06:00:17Z |
Effects of direct current and pulse-reverse copper plating incubation behavior of self-annealing
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Cheng, Min-Yuan; Chen, Kei-Wei; Liu, Tzeng-Feng; Wang, Ying-Lang; Feng, Hsien-Ping |
| 國立交通大學 |
2019-04-02T05:59:51Z |
Pulsed Electrodeposition of CuInSe2 Thin Films onto Mo-Glass Substrates
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Hu, Shao-Yu; Lee, Wen-Hsi; Chang, Shih-Chieh; Cheng, Yi-Lung; Wang, Ying-Lang |
| 國立交通大學 |
2019-04-02T05:58:56Z |
Enhancement of the Thermal Stability of TiNx Capping Layer on the Nickel Silicides
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Wu, Chi-Ting; Lee, Wen-Hsi; Chang, Shih-Chieh; Cheng, Yi-Lung; Wang, Ying-Lang |
| 國立交通大學 |
2019-04-02T05:58:53Z |
Effect of N-2/H-2 plasma treatment on the moisture adsorption of MOCVD-TiN films
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Huang, J. K.; Huang, Cheng-Liang; Chang, Shih-Chieh; Cheng, Yi-Lung; Wang, Ying-Lang |
| 國立交通大學 |
2019-04-02T05:58:26Z |
Effect of Cu-Ion Concentration in Concentrated H3PO4 Electrolyte on Cu Electrochemical Mechanical Planarization
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Kung, Te-Ming; Liu, Chuan-Pu; Chang, Shih-Chieh; Chen, Kei-Wei; Wang, Ying-Lang |
| 國立交通大學 |
2019-04-02T05:57:52Z |
Silicon introduced effect on resistive switching characteristics of WOX thin films
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Syu, Yong-En; Chang, Ting-Chang; Tsai, Tsung-Ming; Chang, Geng-Wei; Chang, Kuan-Chang; Tai, Ya-Hsiang; Tsai, Ming-Jinn; Wang, Ying-Lang; Sze, Simon M. |
| 國立交通大學 |
2018-08-21T05:54:18Z |
Cleaning methodology of small residue defect with surfactant in copper chemical mechanical polishing post-cleaning
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Wei, Kuo-Hsiu; Hung, Chi-Cheng; Wang, Yu-Sheng; Liu, Chuan-Pu; Chen, Kei-Wei; Wang, Ying-Lang |
| 國立交通大學 |
2018-08-21T05:52:53Z |
Effect of tungsten incorporation in cobalt tungsten alloys as seedless diffusion barrier materials
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Su, Yin-Hsien; Kuo, Tai-Chen; Lee, Wen-Hsi; Wang, Yu-Sheng; Hung, Chi-Cheng; Tseng, Wei-Hsiang; Wei, Kuo-Hsiu; Wang, Ying-Lang |
| 國立交通大學 |
2018-01-24T07:38:52Z |
先進電子封裝技術無鉛銲錫與銅界面介金屬化合物的探討
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鄭錫圭; 劉增豐; 王英郎; Cheng,Hsi-Kuei; Liu, Tzeng-Feng; Wang, Ying-Lang |
| 國立交通大學 |
2017-04-21T06:56:30Z |
Microstructural Evolution of Cu/Solder/Cu Pillar-Type Structures with Different Diffusion Barriers
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Cheng, Hsi-Kuei; Lin, Yu-Jie; Chen, Chih-Ming; Liu, Kuo-Chio; Wang, Ying-Lang; Liu, Tzeng-Feng |
| 國立交通大學 |
2017-04-21T06:49:59Z |
A study on the plating and wetting ability of ruthenium-tungsten multi-layers for advanced Cu metallization
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Kuo, Tai-Chen; Su, Yin-Hsien; Lee, Wen-Hsi; Liao, Wei-Hsiang; Wang, Yu-Sheng; Hung, Chi-Cheng; Wang, Ying-Lang |
| 國立交通大學 |
2017-04-21T06:48:55Z |
Cleaning methodology of small residue defect with surfactant in copper chemical mechanical polishing post-cleaning
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Wei, Kuo-Hsiu; Hung, Chi-Cheng; Wang, Yu-Sheng; Liu, Chuan-Pu; Chen, Kei-Wei; Wang, Ying-Lang |
| 國立成功大學 |
2016-11-01 |
Cleaning methodology of small residue defect with surfactant in copper chemical mechanical polishing post-cleaning
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Wei, Kuo-Hsiu; Hung, Chi-Cheng; Wang, Yu-Sheng; Liu, Chuan-Pu; Chen, Kei-Wei; Wang, Ying-Lang |
| 國立成功大學 |
2016-08-16 |
A study on the plating and wetting ability of ruthenium-tungsten multi-layers for advanced Cu metallization
|
Kuo, Tai-Chen; Su, Yin-Hsien; Lee, Wen-Hsi; Liao, Wei-Hsiang; Wang, Yu-Sheng; Hung, Chi-Cheng; Wang, Ying-Lang |
| 國立交通大學 |
2015-07-21T08:29:25Z |
Unusual Morphological Evolution of the Cu Pillar/Solder Micro-joints During High-Temperature Annealing
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Cheng, Hsi-Kuei; Lin, Yu-Jie; Chang, Hou-Chien; Liu, Kuo-Chio; Wang, Ying-Lang; Liu, Tzeng-Feng; Chen, Chih-Ming |
| 國立交通大學 |
2015-07-21T08:28:57Z |
Interfacial reactions between Cu and SnAgCu solder doped with minor Ni
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Cheng, Hsi-Kuei; Huang, Chin-Wen; Lee, Hsuan; Wang, Ying-Lang; Liu, Tzeng-Feng; Chen, Chih-Ming |
| 國立交通大學 |
2015-07-21T08:28:43Z |
Investigation of Barrier Property of Copper Manganese Alloy on Ruthenium
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Su, Yin-Hsien; Wu, Sze-Ann; Wu, Chia-Yang; Wang, Ying-Lang; Lee, Wen-Hsi |
| 國立交通大學 |
2015-07-21T08:28:09Z |
Effects of Varied Negative Stop Voltages on Current Self-Compliance in Indium Tin Oxide Resistance Random Access Memory
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Lin, Chih-Yang; Chang, Kuan-Chang; Chang, Ting-Chang; Tsai, Tsung-Ming; Pan, Chih-Hung; Zhang, Rui; Liu, Kuan-Hsien; Chen, Hua-Mao; Tseng, Yi-Ting; Hung, Ya-Chi; Syu, Yong-En; Zheng, Jin-Cheng; Wang, Ying-Lang; Zhang, Wei; Sze, Simon M. |
| 國立成功大學 |
2015-06 |
Effects of Varied Negative Stop Voltages on Current Self-Compliance in Indium Tin Oxide Resistance Random Access Memory
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Lin, Chih-Yang; Chang, Kuan-Chang; Chang, Ting-Chang; Tsai, Tsung-Ming; Pan, Chih-Hung; Zhang, Rui; Liu, Kuan-Hsien; Chen, Hua-Mao; Tseng, Yi-Ting; Hung, Ya-Chi; Syu, Yong-En; Zheng, Jin-Cheng; Wang, Ying-Lang; Zhang, Wei; Sze, Simon M. |
| 國立成功大學 |
2015-03 |
Investigation of Barrier Property of Copper Manganese Alloy on Ruthenium
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Su, Yin-Hsien; Wu, Sze-Ann; Wu, Chia-Yang; Wang, Ying-Lang; Lee, Wen-Hsi |
| 國立交通大學 |
2014-12-08T15:48:11Z |
Effects of direct current and pulse-reverse copper plating incubation behavior of self-annealing
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Cheng, Min-Yuan; Chen, Kei-Wei; Liu, Tzeng-Feng; Wang, Ying-Lang; Feng, Hsien-Ping |
| 國立交通大學 |
2014-12-08T15:44:46Z |
Plasma treatment effects on hydrogenated amorphous carbon films prepared by plasma-enhanced chemical vapor deposition
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Wu, Jun; Wang, Ying-Lang; Kuo, Cheng-Tzu |
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