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"wang ying lang"的相關文件
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| 國立成功大學 |
2006-05-22 |
Secondary emission of strain-induced dopant contrast in the source/drain regions of metal-oxide-semiconductor devices
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Hsiao, Wen-Chu; Liu, Chuan-Pu; Wang, Ying-Lang |
| 國立成功大學 |
2006-03-01 |
High-selectivity damascene chemical mechanical polishing
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Chiu, Shao-Yu; Wang, Ying-Lang; Liu, Chuan-Pu; Chang, Shih-Chieh; Hwang, Gwo-Jen; Feng, Ming-Shiann; Chen, Chia-Fu |
| 國立成功大學 |
2006-03-01 |
Characterization and thermal stability of fluorosilicate glass films deposited by high density plasma chemical vapor deposition with different bias power
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Hsiao, Wen-Chu; Liu, Chuan-Pu; Wang, Ying-Lang; Cheng, Yi-Lung |
| 國立成功大學 |
2006-03-01 |
Uniform COSi2 nano-nucleus formation by oxide mediated silicidation with a Ti capping layer
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Chang, Juin-Jie; Hsieh, Tsung-Eong; Liu, Chuan-Pu; Wang, Ying-Lang |
| 國立成功大學 |
2006-02-28 |
Phase transformation of tantalum on different dielectric films with plasma treatment
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Huang, Chun-Chieh; Wang, Ying-Lang; Chang, Shih-Chieh; Hwang, Gwo-Jen; Huang, Jow-Lay |
| 國立成功大學 |
2006-02-28 |
Characterization of sputter-induced temperature effect in fluorine doped SiO2 film deposition by high-density plasma chemical vapor deposition
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Hsiao, Wen-Chu; Liu, Chuan-Pu; Wang, Ying-Lang |
| 國立成功大學 |
2006-02-24 |
The study of diffusion and nucleation for COSi2 formation by oxide-mediated cobalt silicidation
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Chang, Juin-Jie; Liu, Chuan-Pu; Hsieh, Tsung-Eong; Wang, Ying-Lang |
| 國立成功大學 |
2005-09 |
Influence of thermal budget on phosphosilicate glass prepared by high-density plasma chemical-vapor deposition
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Hsiao, Wen-Chu; Liu, Chuan-Pu; Wang, Ying-Lang |
| 國立成功大學 |
2005 |
Study of diffusion and quality control for CoSi2 formation by oxide-mediated cobalt silicidation with Ti capping
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Chang, Juin-Jie; Liu, Chuan-Pu; Hsieh, Tsung-Eong; Wang, Ying-Lang |
| 國立成功大學 |
2004-12-22 |
Thermal stability and bonding configuration of fluorine-modified low-k SiOC : H composite films
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JangJian, Shiu-Ko; Liu, Chuan-Pu; Wang, Ying-Lang; Hwang, Weng-Sing; Tseng, Wei-Tsu |
| 國立成功大學 |
2004-11 |
Effects of wetting ability of plating electrolyte on Cu seed layer for electroplated copper film
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Liu, Chi-Wen; Tsao, Jung-Chih; Tsai, Ming-Shih; Wang, Ying-Lang |
| 國立成功大學 |
2004-09 |
Direct COSi2 thin-film formation with homogeneous nanograin-size distribution by oxide-mediated silicidation
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Chang, Juin-Jie; Liu, Chuan-Pu; Chen, Shih-Wei; Chang, Chih-Chia; Hsieh, Tsung-Eong; Wang, Ying-Lang |
| 國立成功大學 |
2004-01-30 |
Monitor and eliminate the circular defects in HDP-STI deposition through oxynitride/oxide composite liner
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Lan, Jin-Kun; Wang, Ying-Lang; Liu, Chuan-Pu; Lee, Wen-His; Ay, Chyung; Cheng, Yi-Lung; Chang, Shih-Chieh |
| 國立成功大學 |
2004-01-30 |
Study on precipitations of fluorine-doped silicon oxide
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Wu, Jun; Wang, Ying-Lang; Liu, Chuan-Pu; Chang, Shih-Chieh; Kuo, Cheng-Tzu; Ay, Chyung |
| 國立成功大學 |
2004-01-30 |
Fluorine-modified low-k a-SiOC : H composite films prepared by plasma enhanced chemical vapor deposition
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JangJean, Shiuh-Ko; Liu, Chuan-Pu; Wang, Ying-Lang; Hwang, Weng-Sing; Tseng, Wei-Tsu; Chen, Sheng-Wen; Lo, Kuang-Yao |
| 國立成功大學 |
2003-11-15 |
The application of electrochemical metrologies for investigating chemical mechanical polishing of Al with a Ti barrier layer
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Chiu, Shao-Yu; Wang, Ying-Lang; Liu, Chuan-Pu; Lan, Jin-Kun; Ay, Chyung; Feng, Ming-Shiann; Tsai, Ming-Shih; Dai, Bau-Tong |
| 國立成功大學 |
2003-09 |
Mechanisms of circular defects for shallow trench isolation oxide deposition
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Lan, Jin-Kun; Wang, Ying-Lang; Liu, Chuan-Pu; Chao, Chuen-Guang; Ay, Chyung; Liu, Chi-Wen; Cheng, Yi-Lung |
| 國立成功大學 |
2003-06-30 |
In situ fluorine-modified organosilicate glass prepared by plasma enhanced chemical vapor deposition
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JangJean, Shiuh-Ko; Wang, Ying-Lang; Liu, Chuan-Pu; Hwang, Weng-Sing; Tseng, Wei-Tsu; Liu, Chi-Wen |
| 國立成功大學 |
2001-11 |
Characterization and reliability of low dielectric constant fluorosilicate glass and silicon rich oxide process for deep sub-micron device application
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Cheng, Y. L.; Wang, Ying-Lang; Liu, C. W.; Wu, Y. L.; Lo, Kuang-Yao; Liu, Chuan-Pu; Lan, J. K. |
| 國立成功大學 |
2001-11 |
Integration of MOCVD titanium nitride with collimated titanium and ion metal plasma titanium for 0.18-mu m logic process
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Lan, J. K.; Wang, Ying-Lang; Lo, Kuang-Yao; Liu, Chuan-Pu; Liu, C. W.; Wang, JK; Cheng, Y. L.; Chau, C. G. |
| 國立成功大學 |
2000-07-17 |
Microstructure-related resistivity change after chemical-mechanical polish of Al and W thin films
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Tseng, Wei-Tsu; Wang, Ying-Lang; Niu, James |
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