| 國立交通大學 |
2014-12-08T15:29:55Z |
Effects of (002) beta-Ta barrier on copper chemical mechanical polishing behavior
|
Wang, Yu-Sheng; Chen, Kei-Wei; Cheng, Min-Yuan; Lee, Wen-Hsi; Wang, Ying-Lang |
| 國立交通大學 |
2014-12-08T15:29:12Z |
How tantalum proceeds phase change on tantalum nitride underlayer with sequential Ar plasma treatment
|
Tsao, Jung-Chih; Liu, Chuan-Pu; Fang, Hsin-Chiao; Wang, Ying-Lang |
| 國立交通大學 |
2014-12-08T15:24:16Z |
A Novel Synthesis of a CuInSe2 Thin Film from Electrodeposited Cu-Se-In-Se Precursors with Three Steps Annealing
|
Hu, Shao-Yu; Lee, Wen-Hsi; Chang, Shih-Chieh; Wang, Ying-Lang |
| 國立交通大學 |
2014-12-08T15:23:03Z |
Effect of Electrolyte Composition on Cu Stripping of Pt Contact Pins in Semiconductor Cu Electroplating Process
|
Hu, Shao-Yu; Lee, Wen-Hsi; Chang, Shih-Chieh; Wang, Ying-Lang |
| 國立交通大學 |
2014-12-08T15:22:20Z |
A Study of Trimethylsilane (3MS) and Tetramethylsilane (4MS) Based alpha-SiCN:H/alpha-SiCO:H Diffusion Barrier Films
|
Chen, Sheng-Wen; Wang, Yu-Sheng; Hu, Shao-Yu; Lee, Wen-Hsi; Chi, Chieh-Cheng; Wang, Ying-Lang |
| 國立交通大學 |
2014-12-08T15:22:12Z |
Investigation of the Galvanic Effect between RuN Barriers and Cu Seed Layers
|
Wu, Chia-Yang; Lee, Wen-Hsi; Chang, Shih-Chieh; Wang, Ying-Lang |
| 國立交通大學 |
2014-12-08T15:21:54Z |
Asymmetric Carrier Conduction Mechanism by Tip Electric Field in WSiOX Resistance Switching Device
|
Syu, Yong-En; Chang, Ting-Chang; Tsai, Tsung-Ming; Chang, Geng-Wei; Chang, Kuan-Chang; Lou, Jyun-Hao; Tai, Ya-Hsiang; Tsai, Ming-Jinn; Wang, Ying-Lang; Sze, Simon M. |
| 國立交通大學 |
2014-12-08T15:21:51Z |
Effect of Electric Potential and Mechanical Force on Copper Electro-Chemical Mechanical Planarization
|
Chen, Sheng-Wen; Kung, Te-Ming; Liu, Chuan-Pu; Chang, Shih-Chieh; Cheng, Yi-Lung; Wang, Ying-Lang |
| 國立交通大學 |
2014-12-08T15:21:29Z |
Silicon introduced effect on resistive switching characteristics of WO(X) thin films
|
Syu, Yong-En; Chang, Ting-Chang; Tsai, Tsung-Ming; Chang, Geng-Wei; Chang, Kuan-Chang; Tai, Ya-Hsiang; Tsai, Ming-Jinn; Wang, Ying-Lang; Sze, Simon M. |
| 國立交通大學 |
2014-12-08T15:11:45Z |
Enhancement of the Thermal Stability of TiN(x) Capping Layer on the Nickel Silicides
|
Wu, Chi-Ting; Lee, Wen-Hsi; Chang, Shih-Chieh; Cheng, Yi-Lung; Wang, Ying-Lang |
| 國立交通大學 |
2014-12-08T15:11:31Z |
Effect of N(2)/H(2) plasma treatment on the moisture adsorption of MOCVD-TiN films
|
Huang, J. K.; Huang, Cheng-Liang; Chang, Shih-Chieh; Cheng, Yi-Lung; Wang, Ying-Lang |
| 國立交通大學 |
2014-12-08T15:11:02Z |
Effect of Under-Layer Treatment of Ta/TaN Barrier Film on Corrosion Between Cu Seed and Ta in Chemical-Mechanical-Polishing Slurry
|
Lee, Wen-Hsi; Hung, Chi-Cheng; Wang, Yu-Sheng; Chang, Shih-Chieh; Wang, Ying-Lang |
| 國立交通大學 |
2014-12-08T15:09:04Z |
Evolution of Fluorine Content with Precipitate Formation in Fluorine-Doped Silicon Oxide
|
Wu, Jun; Wang, Ying-Lang; Kuo, Cheng-Tzu; Pan, Fu-Ming |
| 國立交通大學 |
2014-12-08T15:07:51Z |
Effect of Cu-Ion Concentration in Concentrated H(3)PO(4) Electrolyte on Cu Electrochemical Mechanical Planarization
|
Kung, Te-Ming; Liu, Chuan-Pu; Chang, Shih-Chieh; Chen, Kei-Wei; Wang, Ying-Lang |
| 國立交通大學 |
2014-12-08T15:07:06Z |
Microstructure and Formation of Copper Oxide in the Cu Electro-Polishing Process
|
Kung, Te-Ming; Huang, Michael Rong-Shie; Tsao, Jung-Chih; Liu, Chuan-Pu; Wang, Ying-Lang |
| 國立成功大學 |
2013-10-01 |
An electroplating method for copper plane twin boundary manufacturing
|
Wang, Yu-Sheng; Lee, Wen-Hsi; Chang, Shih-Chieh; Nian, Jun-Nan; Wang, Ying-Lang |
| 國立成功大學 |
2013-09 |
The influence of abrasive particle size in copper chemical mechanical planarization
|
Wei, Kuo-Hsiu; Wang, Yu-Sheng; Liu, Chuan-Pu; Chen, Kei-Wei; Wang, Ying-Lang; Cheng, Yi-Lung |
| 國立成功大學 |
2013-08 |
Investigation the Electroplating Behavior of Self Formed CuMn Barrier
|
Wu, Chia-Yang; Lee, Wen-Hsi; Chang, Shih-Chieh; Wang, Ying-Lang |
| 國立成功大學 |
2013-07 |
Impact of Electroforming Current on Self-Compliance Resistive Switching in an ITO/Gd:SiOx/TiN Structure
|
Tseng, Hsueh-Chih; Chang, Ting-Chang; Wu, Yi-Chun; Wu, Sei-Wei; Huang, Jheng-Jie; Chen, Yu-Ting; Yang, Jyun-Bao; Lin, Tzu-Ping; Sze, Simon. M.; Tsai, Ming-Jinn; Wang, Ying-Lang; Chu, Ann-Kuo |
| 國立成功大學 |
2013-02-01 |
Investigating bipolar resistive switching characteristics in filament type and interface type BON-based resistive switching memory
|
Tseng, Hsueh-Chih; Chang, Ting-Chang; Cheng, Kai-Hung; Huang, Jheng-Jie; Chen, Yu-Ting; Jian, Fu-Yen; Sze, Simon M.; Tsai, Ming-Jinn; Chu, Ann-Kuo; Wang, Ying-Lang |
| 國立成功大學 |
2013-02-01 |
Effects of (002) beta-Ta barrier on copper chemical mechanical polishing behavior
|
Wang, Yu-Sheng; Chen, Kei-Wei; Cheng, Min-Yuan; Lee, Wen-Hsi; Wang, Ying-Lang |
| 國立成功大學 |
2012-12 |
Novel Method for Cu out of Plan Orientation Control by under Ta BaseL ayer Substrate
|
Wang, Yu-Sheng; Lee, Wen-Hsi; Wang, Ying-Lang; Chang, Shih-Chieh |
| 國立成功大學 |
2012-11-25 |
A study on annealing mechanisms with different manganese contents in CuMn alloy
|
Wu, Chia-Yang; Wu, Chi-Ting; Lee, Wen-Hsi; Chang, Shih-Chieh; Wang, Ying-Lang |
| 國立成功大學 |
2012-09 |
A Novel Synthesis of a CuInSe2 Thin Film from Electrodeposited Cu-Se-In-Se Precursors with Three Steps Annealing
|
Hu, Shao-Yu; Lee, Wen-Hsi; Chang, Shih-Chieh; Wang, Ying-Lang |
| 國立成功大學 |
2012-03 |
Asymmetric Carrier Conduction Mechanism by Tip Electric Field in WSiOX Resistance Switching Device
|
Syu, Yong-En; Chang, Ting-Chang; Tsai, Tsung-Ming; Chang, Geng-Wei; Chang, Kuan-Chang; Lou, Jyun-Hao; Tai, Ya-Hsiang; Tsai, Ming-Jinn; Wang, Ying-Lang; Sze, Simon M. |
| 國立成功大學 |
2012-03 |
A Study of Trimethylsilane (3MS) and Tetramethylsilane (4MS) Based alpha-SiCN:H/alpha-SiCO:H Diffusion Barrier Films
|
Chen, Sheng-Wen; Wang, Yu-Sheng; Hu, Shao-Yu; Lee, Wen-Hsi; Chi, Chieh-Cheng; Wang, Ying-Lang |
| 國立成功大學 |
2012-01-09 |
Silicon introduced effect on resistive switching characteristics of WOX thin films
|
Syu, Yong-En; Chang, Ting-Chang; Tsai, Tsung-Ming; Chang, Geng-Wei; Chang, Kuan-Chang; Tai, Ya-Hsiang; Tsai, Ming-Jinn; Wang, Ying-Lang; Sze, Simon M. |
| 國立成功大學 |
2011-05-31 |
Effect of N(2)/H(2) plasma treatment on the moisture adsorption of MOCVD-TiN films
|
Huang, J. K.; Huang, Cheng-Liang; Chang, Shih-Chieh; Cheng, Yi-Lung; Wang, Ying-Lang |
| 國立成功大學 |
2011-04 |
Enhancement of the Thermal Stability of TiN(x) Capping Layer on the Nickel Silicides
|
Wu, Chi-Ting; Lee, Wen-Hsi; Chang, Shih-Chieh; Cheng, Yi-Lung; Wang, Ying-Lang |
| 國立成功大學 |
2011 |
Pulsed Electrodeposition of CuInSe(2) Thin Films onto Mo-Glass Substrates
|
Hu, Shao-Yu; Lee, Wen-Hsi; Chang, Shih-Chieh; Cheng, Yi-Lung; Wang, Ying-Lang |
| 國立成功大學 |
2011 |
Effect of Annealing on the Microstructure and Electrical Property of RuN Thin Films
|
Wu, Chia-Yang; Lee, Wen-Hsi; Chang, Shih-Chieh; Cheng, Yi-Lung; Wang, Ying-Lang |
| 國立成功大學 |
2010-07 |
Effect of Under-Layer Treatment of Ta/TaN Barrier Film on Corrosion Between Cu Seed and Ta in Chemical-Mechanical-Polishing Slurry
|
Lee, Wen-Hsi; Hung, Chi-Cheng; Wang, Yu-Sheng; Chang, Shih-Chieh; Wang, Ying-Lang |
| 國立成功大學 |
2010 |
Bis-(3-sodiumsulfopropyl disulfide) Decomposition with Cathodic Current Flowing in a Copper-Electroplating Bath
|
Lee, Wen-Hsi; Hung, Chi-Cheng; Chang, Shih-Chieh; Wang, Ying-Lang |
| 國立成功大學 |
2009-07 |
Magnetic Effect during Copper Electroplating Using Electrochemical Impedance Spectroscopy
|
Hung, Chi-Cheng; Lee, Wen-Hsi; Chang, Shih-Chieh; Hwang, Gwo-Jen; Wang, Ying-Lang |
| 國立成功大學 |
2009-02 |
Study of Nitrogen Diffusion Profile of Low Resistivity Diffusion Barrier by Resputtering Technology
|
Tsao, Jung-Chih; Liu, Chuan-Pu; Wang, Ying-Lang; Chen, Kei-Wei |
| 國立成功大學 |
2009 |
A Strategic Copper Plating Method Without Annealing Process
|
Chen, Kei-Wei; Hsu, Li-Hsuan; Huang, Jiun-Kai; Wang, Ying-Lang; Lo, Kuang-Yao |
| 國立成功大學 |
2008-12-25 |
Plasma over-treatment effect on the MOCVD-TiN contact glue layer
|
Chang, Shih-Chieh; Wang, Ying-Lang; Chan, Din-Yuen; Huang, J. K.; Wang, Ming-Tsong |
| 國立成功大學 |
2008-12-01 |
Investigation of deplating behavior of Pt contact pins in semiconductor Cu electroplating process
|
Hu, Shao-Yu; Hung, Chi-Cheng; Lee, Wen-Hsi; Chang, Shih-Chieh; Chan, Din-Yuen; Wang, Ying-Lang |
| 國立成功大學 |
2008-09 |
Investigation of the suppression effect of polyethylene glycol on copper electroplating by electrochemical impedance spectroscopy
|
Hung, Chi-Cheng; Lee, Wen-Hsi; Wang, Ying-Lang; Chan, Din-Yuen; Hwang, Gwo-Jen |
| 國立成功大學 |
2008-09 |
Investigation of copper scratches and void defects after chemical mechanical polishing
|
Hung, Chi-Cheng; Lee, Wen-Hsi; Chang, Shih-Chieh; Wang, Ying-Lang; Hwang, Gwo-Jen |
| 國立成功大學 |
2008-06-30 |
Under-layer behavior study of low resistance Ta/TaNx barrier film
|
Wang, Yu-Sheng; Hung, Chi-Cheng; Lee, Wen-Hsi; Chang, Shih-Chieh; Wang, Ying-Lang |
| 國立成功大學 |
2008-05 |
The effects of oxygen content on bonding configurations and properties of low-k organosilicate glass dielectric films
|
Chen, Sheng-Wen; Liu, Chuan-Pu; JangJian, Shiu-Ko; Wang, Ying-Lang |
| 國立成功大學 |
2008-05 |
Direct alpha Ta formation on TaN by resputtering for low resistive diffusion barriers
|
Tsao, Jung-Chih; Liu, Chuan-Pu; Wang, Ying-Lang; Chen, Kei-Wei |
| 國立成功大學 |
2008-05 |
The integration solution of copper barrier deposition for nanometer interconnect process
|
Chen, Kei-Wei; Wang, Ying-Lang; Tsao, Jung-Chih; Lo, Kuang-Yao |
| 國立成功大學 |
2008-02 |
The electrical property of plasma-treated Ta/TaNx diffusion barrier
|
Wang, Yu-Sheng; Lee, Wen-Hsi; Wang, Ying-Lang; Hung, Chi-Cheng; Chang, Shih-Chieh |
| 國立成功大學 |
2008-02 |
Mechanism of the metal-insulator-metal capacitance drift for advanced mixed-signal copper process device
|
JangJian, Shiu-Ko; Wang, Ying-Lang; Liao, Mlao-Cheng; Chang, Hung-Jui; Juang, Yungder |
| 國立成功大學 |
2008-02 |
Interface integration defect of copper and low-K materials beyond nano-scale copper damascene process
|
Chen, Kel-Wei; Wang, Ying-Lang; Tsao, Jung-Chih; Juang, Yungder; Lee, Feng-Yi |
| 國立成功大學 |
2008-02 |
The effect of oxygen content on bonding configuration and properties of low-k organosilicate glass dielectric film
|
Chen, Sheng-Wen; Liu, Chuan-Pu; JangJian, Shiu-Ko; Wang, Ying-Lang |
| 國立成功大學 |
2008-02 |
Mechanism of over-etching defects during Ta/TaN barrier resputtering in micro-trench for Cu metallization
|
Tsao, Jung-Chih; Liu, Chuan-Pu; Wang, Ying-Lang; Chen, Kel-Wel; Lo, Kuang-Yao |
| 國立成功大學 |
2008-02 |
Thermal properties of hydrogenated amorphous silicon prepared by high-density plasma chemical vapor deposition
|
Hsao, Wen-Chu; Liu, Chuan-Pu; Wang, Ying-Lang |
