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"wang ying lang"的相關文件
顯示項目 91-100 / 121 (共13頁)
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| 國立成功大學 |
2008 |
Investigation of static corrosion between W metals and TiNx barriers in a W chemical-mechanical-polishing slurry
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Hung, Chi-Cheng; Wang, Ying-Lang; Lee, Wen-Hsi; Chang, Shih-Chieh |
| 國立成功大學 |
2008 |
Competitive adsorption between bis(3-sodiumsulfopropyl disulfide) and polyalkylene glycols on copper electroplating
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Hung, Chi-Cheng; Wang, Ying-Lang; Lee, Wen-Hsi; Chang, Shih-Chieh |
| 國立成功大學 |
2008 |
Investigation of slurry chemical corrosion on TaN barriers with plasma treatment
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Hung, Chi-Cheng; Lee, Wen-Hsi; Wang, Ying-Lang |
| 國立成功大學 |
2007-05 |
Role of surface tension in copper electroplating
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Chang, Shih-Chieh; Wang, Ying-Lang; Hung, Chi-Cheng; Lee, Wen-His; Hwang, Gwo-Jen |
| 國立成功大學 |
2007 |
Investigation of galvanic corrosion between TaNx barriers and copper seed by electrochemical impedance spectroscopy
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Hung, Chi-Cheng; Lee, Wen-Hsi; Wang, Yu-Sheng; Chang, Shih-Chieh; Wang, Ying-Lang |
| 國立成功大學 |
2007 |
Galvanic corrosion between TaNx barriers and copper seed
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Hung, Chi-Cheng; Wang, Yu-Sheng; Lee, Wen-Hsi; Chang, Shih-Chieh; Wang, Ying-Lang |
| 國立成功大學 |
2007 |
Influence of RF bias on hydrogenated amorphous silicon by high-density plasma chemical vapor deposition
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Hsiao, Wen-Chu; Liu, Chuan-Pu; Wang, Ying-Lang |
| 國立成功大學 |
2006-11 |
Electrical properties of fluorine-doped silicon-oxycarbide dielectric barrier for copper interconnect
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Huang, Chun-Chieh; Huang, Jow-Lay; Wang, Ying-Lang; Chang, Juin-Jie |
| 國立成功大學 |
2006-11 |
Characterization of fluorine-modified organosilicate glass
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Liu, Chi-Wen; Wang, Ying-Lang; Juang, Yungder; JangJean, Shiuh-Ko; Lee, Wen-His |
| 國立成功大學 |
2006-09 |
Thermal stability study on nanoscale polysilicide resistors
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Chen, Yen-Ming; Wang, Ying-Lang; Hwang, Gwo-Jen; Juang, Yungder; Lee, Wen-His |
顯示項目 91-100 / 121 (共13頁)
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