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Taiwan Academic Institutional Repository >
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"wang ying lang"
Showing items 51-75 of 121 (5 Page(s) Totally)
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| 國立成功大學 |
2013-10-01 |
An electroplating method for copper plane twin boundary manufacturing
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Wang, Yu-Sheng; Lee, Wen-Hsi; Chang, Shih-Chieh; Nian, Jun-Nan; Wang, Ying-Lang |
| 國立成功大學 |
2013-09 |
The influence of abrasive particle size in copper chemical mechanical planarization
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Wei, Kuo-Hsiu; Wang, Yu-Sheng; Liu, Chuan-Pu; Chen, Kei-Wei; Wang, Ying-Lang; Cheng, Yi-Lung |
| 國立成功大學 |
2013-08 |
Investigation the Electroplating Behavior of Self Formed CuMn Barrier
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Wu, Chia-Yang; Lee, Wen-Hsi; Chang, Shih-Chieh; Wang, Ying-Lang |
| 國立成功大學 |
2013-07 |
Impact of Electroforming Current on Self-Compliance Resistive Switching in an ITO/Gd:SiOx/TiN Structure
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Tseng, Hsueh-Chih; Chang, Ting-Chang; Wu, Yi-Chun; Wu, Sei-Wei; Huang, Jheng-Jie; Chen, Yu-Ting; Yang, Jyun-Bao; Lin, Tzu-Ping; Sze, Simon. M.; Tsai, Ming-Jinn; Wang, Ying-Lang; Chu, Ann-Kuo |
| 國立成功大學 |
2013-02-01 |
Investigating bipolar resistive switching characteristics in filament type and interface type BON-based resistive switching memory
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Tseng, Hsueh-Chih; Chang, Ting-Chang; Cheng, Kai-Hung; Huang, Jheng-Jie; Chen, Yu-Ting; Jian, Fu-Yen; Sze, Simon M.; Tsai, Ming-Jinn; Chu, Ann-Kuo; Wang, Ying-Lang |
| 國立成功大學 |
2013-02-01 |
Effects of (002) beta-Ta barrier on copper chemical mechanical polishing behavior
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Wang, Yu-Sheng; Chen, Kei-Wei; Cheng, Min-Yuan; Lee, Wen-Hsi; Wang, Ying-Lang |
| 國立成功大學 |
2012-12 |
Novel Method for Cu out of Plan Orientation Control by under Ta BaseL ayer Substrate
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Wang, Yu-Sheng; Lee, Wen-Hsi; Wang, Ying-Lang; Chang, Shih-Chieh |
| 國立成功大學 |
2012-11-25 |
A study on annealing mechanisms with different manganese contents in CuMn alloy
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Wu, Chia-Yang; Wu, Chi-Ting; Lee, Wen-Hsi; Chang, Shih-Chieh; Wang, Ying-Lang |
| 國立成功大學 |
2012-09 |
A Novel Synthesis of a CuInSe2 Thin Film from Electrodeposited Cu-Se-In-Se Precursors with Three Steps Annealing
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Hu, Shao-Yu; Lee, Wen-Hsi; Chang, Shih-Chieh; Wang, Ying-Lang |
| 國立成功大學 |
2012-03 |
Asymmetric Carrier Conduction Mechanism by Tip Electric Field in WSiOX Resistance Switching Device
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Syu, Yong-En; Chang, Ting-Chang; Tsai, Tsung-Ming; Chang, Geng-Wei; Chang, Kuan-Chang; Lou, Jyun-Hao; Tai, Ya-Hsiang; Tsai, Ming-Jinn; Wang, Ying-Lang; Sze, Simon M. |
| 國立成功大學 |
2012-03 |
A Study of Trimethylsilane (3MS) and Tetramethylsilane (4MS) Based alpha-SiCN:H/alpha-SiCO:H Diffusion Barrier Films
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Chen, Sheng-Wen; Wang, Yu-Sheng; Hu, Shao-Yu; Lee, Wen-Hsi; Chi, Chieh-Cheng; Wang, Ying-Lang |
| 國立成功大學 |
2012-01-09 |
Silicon introduced effect on resistive switching characteristics of WOX thin films
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Syu, Yong-En; Chang, Ting-Chang; Tsai, Tsung-Ming; Chang, Geng-Wei; Chang, Kuan-Chang; Tai, Ya-Hsiang; Tsai, Ming-Jinn; Wang, Ying-Lang; Sze, Simon M. |
| 國立成功大學 |
2011-05-31 |
Effect of N(2)/H(2) plasma treatment on the moisture adsorption of MOCVD-TiN films
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Huang, J. K.; Huang, Cheng-Liang; Chang, Shih-Chieh; Cheng, Yi-Lung; Wang, Ying-Lang |
| 國立成功大學 |
2011-04 |
Enhancement of the Thermal Stability of TiN(x) Capping Layer on the Nickel Silicides
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Wu, Chi-Ting; Lee, Wen-Hsi; Chang, Shih-Chieh; Cheng, Yi-Lung; Wang, Ying-Lang |
| 國立成功大學 |
2011 |
Pulsed Electrodeposition of CuInSe(2) Thin Films onto Mo-Glass Substrates
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Hu, Shao-Yu; Lee, Wen-Hsi; Chang, Shih-Chieh; Cheng, Yi-Lung; Wang, Ying-Lang |
| 國立成功大學 |
2011 |
Effect of Annealing on the Microstructure and Electrical Property of RuN Thin Films
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Wu, Chia-Yang; Lee, Wen-Hsi; Chang, Shih-Chieh; Cheng, Yi-Lung; Wang, Ying-Lang |
| 國立成功大學 |
2010-07 |
Effect of Under-Layer Treatment of Ta/TaN Barrier Film on Corrosion Between Cu Seed and Ta in Chemical-Mechanical-Polishing Slurry
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Lee, Wen-Hsi; Hung, Chi-Cheng; Wang, Yu-Sheng; Chang, Shih-Chieh; Wang, Ying-Lang |
| 國立成功大學 |
2010 |
Bis-(3-sodiumsulfopropyl disulfide) Decomposition with Cathodic Current Flowing in a Copper-Electroplating Bath
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Lee, Wen-Hsi; Hung, Chi-Cheng; Chang, Shih-Chieh; Wang, Ying-Lang |
| 國立成功大學 |
2009-07 |
Magnetic Effect during Copper Electroplating Using Electrochemical Impedance Spectroscopy
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Hung, Chi-Cheng; Lee, Wen-Hsi; Chang, Shih-Chieh; Hwang, Gwo-Jen; Wang, Ying-Lang |
| 國立成功大學 |
2009-02 |
Study of Nitrogen Diffusion Profile of Low Resistivity Diffusion Barrier by Resputtering Technology
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Tsao, Jung-Chih; Liu, Chuan-Pu; Wang, Ying-Lang; Chen, Kei-Wei |
| 國立成功大學 |
2009 |
A Strategic Copper Plating Method Without Annealing Process
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Chen, Kei-Wei; Hsu, Li-Hsuan; Huang, Jiun-Kai; Wang, Ying-Lang; Lo, Kuang-Yao |
| 國立成功大學 |
2008-12-25 |
Plasma over-treatment effect on the MOCVD-TiN contact glue layer
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Chang, Shih-Chieh; Wang, Ying-Lang; Chan, Din-Yuen; Huang, J. K.; Wang, Ming-Tsong |
| 國立成功大學 |
2008-12-01 |
Investigation of deplating behavior of Pt contact pins in semiconductor Cu electroplating process
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Hu, Shao-Yu; Hung, Chi-Cheng; Lee, Wen-Hsi; Chang, Shih-Chieh; Chan, Din-Yuen; Wang, Ying-Lang |
| 國立成功大學 |
2008-09 |
Investigation of the suppression effect of polyethylene glycol on copper electroplating by electrochemical impedance spectroscopy
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Hung, Chi-Cheng; Lee, Wen-Hsi; Wang, Ying-Lang; Chan, Din-Yuen; Hwang, Gwo-Jen |
| 國立成功大學 |
2008-09 |
Investigation of copper scratches and void defects after chemical mechanical polishing
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Hung, Chi-Cheng; Lee, Wen-Hsi; Chang, Shih-Chieh; Wang, Ying-Lang; Hwang, Gwo-Jen |
Showing items 51-75 of 121 (5 Page(s) Totally)
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