| 國立成功大學 |
2009 |
A Strategic Copper Plating Method Without Annealing Process
|
Chen, Kei-Wei; Hsu, Li-Hsuan; Huang, Jiun-Kai; Wang, Ying-Lang; Lo, Kuang-Yao |
| 國立成功大學 |
2008-12-25 |
Plasma over-treatment effect on the MOCVD-TiN contact glue layer
|
Chang, Shih-Chieh; Wang, Ying-Lang; Chan, Din-Yuen; Huang, J. K.; Wang, Ming-Tsong |
| 國立成功大學 |
2008-12-01 |
Investigation of deplating behavior of Pt contact pins in semiconductor Cu electroplating process
|
Hu, Shao-Yu; Hung, Chi-Cheng; Lee, Wen-Hsi; Chang, Shih-Chieh; Chan, Din-Yuen; Wang, Ying-Lang |
| 國立成功大學 |
2008-09 |
Investigation of the suppression effect of polyethylene glycol on copper electroplating by electrochemical impedance spectroscopy
|
Hung, Chi-Cheng; Lee, Wen-Hsi; Wang, Ying-Lang; Chan, Din-Yuen; Hwang, Gwo-Jen |
| 國立成功大學 |
2008-09 |
Investigation of copper scratches and void defects after chemical mechanical polishing
|
Hung, Chi-Cheng; Lee, Wen-Hsi; Chang, Shih-Chieh; Wang, Ying-Lang; Hwang, Gwo-Jen |
| 國立成功大學 |
2008-06-30 |
Under-layer behavior study of low resistance Ta/TaNx barrier film
|
Wang, Yu-Sheng; Hung, Chi-Cheng; Lee, Wen-Hsi; Chang, Shih-Chieh; Wang, Ying-Lang |
| 國立成功大學 |
2008-05 |
The effects of oxygen content on bonding configurations and properties of low-k organosilicate glass dielectric films
|
Chen, Sheng-Wen; Liu, Chuan-Pu; JangJian, Shiu-Ko; Wang, Ying-Lang |
| 國立成功大學 |
2008-05 |
Direct alpha Ta formation on TaN by resputtering for low resistive diffusion barriers
|
Tsao, Jung-Chih; Liu, Chuan-Pu; Wang, Ying-Lang; Chen, Kei-Wei |
| 國立成功大學 |
2008-05 |
The integration solution of copper barrier deposition for nanometer interconnect process
|
Chen, Kei-Wei; Wang, Ying-Lang; Tsao, Jung-Chih; Lo, Kuang-Yao |
| 國立成功大學 |
2008-02 |
The electrical property of plasma-treated Ta/TaNx diffusion barrier
|
Wang, Yu-Sheng; Lee, Wen-Hsi; Wang, Ying-Lang; Hung, Chi-Cheng; Chang, Shih-Chieh |
| 國立成功大學 |
2008-02 |
Mechanism of the metal-insulator-metal capacitance drift for advanced mixed-signal copper process device
|
JangJian, Shiu-Ko; Wang, Ying-Lang; Liao, Mlao-Cheng; Chang, Hung-Jui; Juang, Yungder |
| 國立成功大學 |
2008-02 |
Interface integration defect of copper and low-K materials beyond nano-scale copper damascene process
|
Chen, Kel-Wei; Wang, Ying-Lang; Tsao, Jung-Chih; Juang, Yungder; Lee, Feng-Yi |
| 國立成功大學 |
2008-02 |
The effect of oxygen content on bonding configuration and properties of low-k organosilicate glass dielectric film
|
Chen, Sheng-Wen; Liu, Chuan-Pu; JangJian, Shiu-Ko; Wang, Ying-Lang |
| 國立成功大學 |
2008-02 |
Mechanism of over-etching defects during Ta/TaN barrier resputtering in micro-trench for Cu metallization
|
Tsao, Jung-Chih; Liu, Chuan-Pu; Wang, Ying-Lang; Chen, Kel-Wel; Lo, Kuang-Yao |
| 國立成功大學 |
2008-02 |
Thermal properties of hydrogenated amorphous silicon prepared by high-density plasma chemical vapor deposition
|
Hsao, Wen-Chu; Liu, Chuan-Pu; Wang, Ying-Lang |
| 國立成功大學 |
2008-02 |
Controlling Ta phase in Ta/TaN bilayer by surface pre-treatment on TaN
|
Tsao, Jung-Chih; Liu, Chuan-Pu; Wang, Ying-Lang; Wang, Yu-Sheng; Chen, Ke-Wei |
| 國立成功大學 |
2008-01 |
Effect of bis-(3-sodiumsulfopropyl disulfide) byproducts on copper defects after chemical mechanical polishing
|
Hung, Chi-Cheng; Lee, Wen-Hsi; Hu, Shao-Yu; Chang, Shih-Chieh; Chen, Kei-Wei; Wang, Ying-Lang |
| 國立成功大學 |
2008-01 |
Study of pretreatment prior to silicon-oxycarbide deposition on Cu interconnect
|
Huang, Chun-Chieh; Huang, Jow-Lay; Wang, Ying-Lang; Lo, Kuang-Yao |
| 國立成功大學 |
2008 |
Suppression effect of low-concentration bis-(3-sodiumsulfopropyl disulfide) on copper electroplating
|
Hung, Chi-Cheng; Lee, Wen-Hsi; Chang, Shih-Chieh; Chen, Kei-Wei; Wang, Ying-Lang |
| 國立成功大學 |
2008 |
Investigation of bis-(3-sodiumsulfopropyl disulfide) (SPS) decomposition in a copper-electroplating bath using mass spectroscopy
|
Hung, Chi-Cheng; Lee, Wen-Hsi; Hu, Shao-Yu; Chang, Shih-Chieh; Chen, Kei-Wei; Wang, Ying-Lang |
| 國立成功大學 |
2008 |
Investigation of static corrosion between W metals and TiNx barriers in a W chemical-mechanical-polishing slurry
|
Hung, Chi-Cheng; Wang, Ying-Lang; Lee, Wen-Hsi; Chang, Shih-Chieh |
| 國立成功大學 |
2008 |
Competitive adsorption between bis(3-sodiumsulfopropyl disulfide) and polyalkylene glycols on copper electroplating
|
Hung, Chi-Cheng; Wang, Ying-Lang; Lee, Wen-Hsi; Chang, Shih-Chieh |
| 國立成功大學 |
2008 |
Investigation of slurry chemical corrosion on TaN barriers with plasma treatment
|
Hung, Chi-Cheng; Lee, Wen-Hsi; Wang, Ying-Lang |
| 國立成功大學 |
2007-05 |
Role of surface tension in copper electroplating
|
Chang, Shih-Chieh; Wang, Ying-Lang; Hung, Chi-Cheng; Lee, Wen-His; Hwang, Gwo-Jen |
| 國立成功大學 |
2007 |
Investigation of galvanic corrosion between TaNx barriers and copper seed by electrochemical impedance spectroscopy
|
Hung, Chi-Cheng; Lee, Wen-Hsi; Wang, Yu-Sheng; Chang, Shih-Chieh; Wang, Ying-Lang |
| 國立成功大學 |
2007 |
Galvanic corrosion between TaNx barriers and copper seed
|
Hung, Chi-Cheng; Wang, Yu-Sheng; Lee, Wen-Hsi; Chang, Shih-Chieh; Wang, Ying-Lang |
| 國立成功大學 |
2007 |
Influence of RF bias on hydrogenated amorphous silicon by high-density plasma chemical vapor deposition
|
Hsiao, Wen-Chu; Liu, Chuan-Pu; Wang, Ying-Lang |
| 國立成功大學 |
2006-11 |
Electrical properties of fluorine-doped silicon-oxycarbide dielectric barrier for copper interconnect
|
Huang, Chun-Chieh; Huang, Jow-Lay; Wang, Ying-Lang; Chang, Juin-Jie |
| 國立成功大學 |
2006-11 |
Characterization of fluorine-modified organosilicate glass
|
Liu, Chi-Wen; Wang, Ying-Lang; Juang, Yungder; JangJean, Shiuh-Ko; Lee, Wen-His |
| 國立成功大學 |
2006-09 |
Thermal stability study on nanoscale polysilicide resistors
|
Chen, Yen-Ming; Wang, Ying-Lang; Hwang, Gwo-Jen; Juang, Yungder; Lee, Wen-His |
| 國立成功大學 |
2006-05-22 |
Secondary emission of strain-induced dopant contrast in the source/drain regions of metal-oxide-semiconductor devices
|
Hsiao, Wen-Chu; Liu, Chuan-Pu; Wang, Ying-Lang |
| 國立成功大學 |
2006-03-01 |
High-selectivity damascene chemical mechanical polishing
|
Chiu, Shao-Yu; Wang, Ying-Lang; Liu, Chuan-Pu; Chang, Shih-Chieh; Hwang, Gwo-Jen; Feng, Ming-Shiann; Chen, Chia-Fu |
| 國立成功大學 |
2006-03-01 |
Characterization and thermal stability of fluorosilicate glass films deposited by high density plasma chemical vapor deposition with different bias power
|
Hsiao, Wen-Chu; Liu, Chuan-Pu; Wang, Ying-Lang; Cheng, Yi-Lung |
| 國立成功大學 |
2006-03-01 |
Uniform COSi2 nano-nucleus formation by oxide mediated silicidation with a Ti capping layer
|
Chang, Juin-Jie; Hsieh, Tsung-Eong; Liu, Chuan-Pu; Wang, Ying-Lang |
| 國立成功大學 |
2006-02-28 |
Phase transformation of tantalum on different dielectric films with plasma treatment
|
Huang, Chun-Chieh; Wang, Ying-Lang; Chang, Shih-Chieh; Hwang, Gwo-Jen; Huang, Jow-Lay |
| 國立成功大學 |
2006-02-28 |
Characterization of sputter-induced temperature effect in fluorine doped SiO2 film deposition by high-density plasma chemical vapor deposition
|
Hsiao, Wen-Chu; Liu, Chuan-Pu; Wang, Ying-Lang |
| 國立成功大學 |
2006-02-24 |
The study of diffusion and nucleation for COSi2 formation by oxide-mediated cobalt silicidation
|
Chang, Juin-Jie; Liu, Chuan-Pu; Hsieh, Tsung-Eong; Wang, Ying-Lang |
| 國立成功大學 |
2005-09 |
Influence of thermal budget on phosphosilicate glass prepared by high-density plasma chemical-vapor deposition
|
Hsiao, Wen-Chu; Liu, Chuan-Pu; Wang, Ying-Lang |
| 國立成功大學 |
2005 |
Study of diffusion and quality control for CoSi2 formation by oxide-mediated cobalt silicidation with Ti capping
|
Chang, Juin-Jie; Liu, Chuan-Pu; Hsieh, Tsung-Eong; Wang, Ying-Lang |
| 國立成功大學 |
2004-12-22 |
Thermal stability and bonding configuration of fluorine-modified low-k SiOC : H composite films
|
JangJian, Shiu-Ko; Liu, Chuan-Pu; Wang, Ying-Lang; Hwang, Weng-Sing; Tseng, Wei-Tsu |
| 國立成功大學 |
2004-11 |
Effects of wetting ability of plating electrolyte on Cu seed layer for electroplated copper film
|
Liu, Chi-Wen; Tsao, Jung-Chih; Tsai, Ming-Shih; Wang, Ying-Lang |
| 國立成功大學 |
2004-09 |
Direct COSi2 thin-film formation with homogeneous nanograin-size distribution by oxide-mediated silicidation
|
Chang, Juin-Jie; Liu, Chuan-Pu; Chen, Shih-Wei; Chang, Chih-Chia; Hsieh, Tsung-Eong; Wang, Ying-Lang |
| 國立成功大學 |
2004-01-30 |
Monitor and eliminate the circular defects in HDP-STI deposition through oxynitride/oxide composite liner
|
Lan, Jin-Kun; Wang, Ying-Lang; Liu, Chuan-Pu; Lee, Wen-His; Ay, Chyung; Cheng, Yi-Lung; Chang, Shih-Chieh |
| 國立成功大學 |
2004-01-30 |
Study on precipitations of fluorine-doped silicon oxide
|
Wu, Jun; Wang, Ying-Lang; Liu, Chuan-Pu; Chang, Shih-Chieh; Kuo, Cheng-Tzu; Ay, Chyung |
| 國立成功大學 |
2004-01-30 |
Fluorine-modified low-k a-SiOC : H composite films prepared by plasma enhanced chemical vapor deposition
|
JangJean, Shiuh-Ko; Liu, Chuan-Pu; Wang, Ying-Lang; Hwang, Weng-Sing; Tseng, Wei-Tsu; Chen, Sheng-Wen; Lo, Kuang-Yao |
| 國立成功大學 |
2003-11-15 |
The application of electrochemical metrologies for investigating chemical mechanical polishing of Al with a Ti barrier layer
|
Chiu, Shao-Yu; Wang, Ying-Lang; Liu, Chuan-Pu; Lan, Jin-Kun; Ay, Chyung; Feng, Ming-Shiann; Tsai, Ming-Shih; Dai, Bau-Tong |
| 國立成功大學 |
2003-09 |
Mechanisms of circular defects for shallow trench isolation oxide deposition
|
Lan, Jin-Kun; Wang, Ying-Lang; Liu, Chuan-Pu; Chao, Chuen-Guang; Ay, Chyung; Liu, Chi-Wen; Cheng, Yi-Lung |
| 國立成功大學 |
2003-06-30 |
In situ fluorine-modified organosilicate glass prepared by plasma enhanced chemical vapor deposition
|
JangJean, Shiuh-Ko; Wang, Ying-Lang; Liu, Chuan-Pu; Hwang, Weng-Sing; Tseng, Wei-Tsu; Liu, Chi-Wen |
| 國立成功大學 |
2001-11 |
Characterization and reliability of low dielectric constant fluorosilicate glass and silicon rich oxide process for deep sub-micron device application
|
Cheng, Y. L.; Wang, Ying-Lang; Liu, C. W.; Wu, Y. L.; Lo, Kuang-Yao; Liu, Chuan-Pu; Lan, J. K. |
| 國立成功大學 |
2001-11 |
Integration of MOCVD titanium nitride with collimated titanium and ion metal plasma titanium for 0.18-mu m logic process
|
Lan, J. K.; Wang, Ying-Lang; Lo, Kuang-Yao; Liu, Chuan-Pu; Liu, C. W.; Wang, JK; Cheng, Y. L.; Chau, C. G. |
