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Showing items 76-85 of 121  (13 Page(s) Totally)
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Institution Date Title Author
國立成功大學 2008-06-30 Under-layer behavior study of low resistance Ta/TaNx barrier film Wang, Yu-Sheng; Hung, Chi-Cheng; Lee, Wen-Hsi; Chang, Shih-Chieh; Wang, Ying-Lang
國立成功大學 2008-05 The effects of oxygen content on bonding configurations and properties of low-k organosilicate glass dielectric films Chen, Sheng-Wen; Liu, Chuan-Pu; JangJian, Shiu-Ko; Wang, Ying-Lang
國立成功大學 2008-05 Direct alpha Ta formation on TaN by resputtering for low resistive diffusion barriers Tsao, Jung-Chih; Liu, Chuan-Pu; Wang, Ying-Lang; Chen, Kei-Wei
國立成功大學 2008-05 The integration solution of copper barrier deposition for nanometer interconnect process Chen, Kei-Wei; Wang, Ying-Lang; Tsao, Jung-Chih; Lo, Kuang-Yao
國立成功大學 2008-02 The electrical property of plasma-treated Ta/TaNx diffusion barrier Wang, Yu-Sheng; Lee, Wen-Hsi; Wang, Ying-Lang; Hung, Chi-Cheng; Chang, Shih-Chieh
國立成功大學 2008-02 Mechanism of the metal-insulator-metal capacitance drift for advanced mixed-signal copper process device JangJian, Shiu-Ko; Wang, Ying-Lang; Liao, Mlao-Cheng; Chang, Hung-Jui; Juang, Yungder
國立成功大學 2008-02 Interface integration defect of copper and low-K materials beyond nano-scale copper damascene process Chen, Kel-Wei; Wang, Ying-Lang; Tsao, Jung-Chih; Juang, Yungder; Lee, Feng-Yi
國立成功大學 2008-02 The effect of oxygen content on bonding configuration and properties of low-k organosilicate glass dielectric film Chen, Sheng-Wen; Liu, Chuan-Pu; JangJian, Shiu-Ko; Wang, Ying-Lang
國立成功大學 2008-02 Mechanism of over-etching defects during Ta/TaN barrier resputtering in micro-trench for Cu metallization Tsao, Jung-Chih; Liu, Chuan-Pu; Wang, Ying-Lang; Chen, Kel-Wel; Lo, Kuang-Yao
國立成功大學 2008-02 Thermal properties of hydrogenated amorphous silicon prepared by high-density plasma chemical vapor deposition Hsao, Wen-Chu; Liu, Chuan-Pu; Wang, Ying-Lang

Showing items 76-85 of 121  (13 Page(s) Totally)
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