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"wang yl"
Showing items 66-75 of 126 (13 Page(s) Totally)
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| 國立交通大學 |
2014-12-08T15:17:18Z |
Width-dependent anomalous CoSix sheet resistance change by Ti and TiN capping process
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Chen, YM; Tu, GC; Wang, YL |
| 國立交通大學 |
2014-12-08T15:17:12Z |
Comparison of characteristics and integration of copper diffusion-barrier dielectrics
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Wang, TC; Cheng, YL; Wang, YL; Hsieh, TE; Hwang, GJ; Chen, CF |
| 國立交通大學 |
2014-12-08T15:17:12Z |
Novel slurry solution for dishing elimination in copper process beyond 0.1-mu m technology
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Chen, KW; Wang, YL; Liu, CP; Chang, L; Li, FY |
| 國立交通大學 |
2014-12-08T15:17:12Z |
High-selectivity damascene chemical mechanical polishing
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Chiu, SY; Wang, YL; Liu, CP; Chang, SC; Hwang, GJ; Feng, MS; Chen, CF |
| 國立交通大學 |
2014-12-08T15:02:02Z |
Re-examination of pressure and speed dependences of removal rate during chemical-mechanical polishing processes
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Tseng, WT; Wang, YL |
| 國立交通大學 |
2014-12-08T15:01:30Z |
Integration of modified plasma-enhanced chemical vapor deposited tetraethoxysilane intermetal dielectric and chemical-mechanical polishing processes for 0.35 mu m IC device reliability improvement
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Wang, YL; Tseng, WT; Feng, MS |
| 國立交通大學 |
2014-12-08T15:01:23Z |
Effects of underlying films on the chemical-mechanical polishing for shallow trench isolation technology
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Wang, YL; Liu, C; Feng, MS; Dun, JW; Chou, KS |
| 國立交通大學 |
2014-12-08T15:01:23Z |
Chemical-mechanical polishing of low-dielectric-constant spin-on-glasses: film chemistries, slurry formulation and polish selectivity
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Wang, YL; Liu, C; Chang, ST; Tsai, MS; Feng, MS; Tseng, WT |
| 國立交通大學 |
2014-12-08T15:01:09Z |
The exothermic reaction and temperature measurement for tungsten CMP technology and its application on endpoint detection
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Wang, YL; Liu, C; Feng, MS; Tseng, WT |
| 國立交通大學 |
2014-12-08T15:01:09Z |
A modified multi-chemicals spray cleaning process for post-CMP cleaning application
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Wang, YL; Liu, C; Feng, MS; Tseng, WT |
Showing items 66-75 of 126 (13 Page(s) Totally)
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