|
"wang yl"的相關文件
显示项目 16-65 / 126 (共3页)
1 2 3 > >>
每页显示[10|25|50]项目
| 國立交通大學 |
2019-04-02T05:59:14Z |
A modified multi-chemicals spray cleaning process for post-CMP cleaning application
|
Wang, YL; Liu, C; Feng, MS; Tseng, WT |
| 國立交通大學 |
2019-04-02T05:58:48Z |
Integration of modified plasma-enhanced chemical vapor deposited tetraethoxysilane intermetal dielectric and chemical-mechanical polishing processes for 0.35 mu m IC device reliability improvement
|
Wang, YL; Tseng, WT; Feng, MS |
| 臺大學術典藏 |
2018-09-10T07:28:07Z |
Gas-assisted focused-ion-beam lithography of a diamond (100) surface
|
Datta, A; Wu, YR; Wang, YL; YUH-RENN WU |
| 臺大學術典藏 |
2018-09-10T03:44:21Z |
Real-time observation of ripple structure formation on a diamond surface under focused ion-beam bombardment
|
YUH-RENN WU; Wang, YL; Wu, YR; Datta, A |
| 國家衛生研究院 |
2018-07 |
National surveillance of 2,3,7,8-substituted polychlorinated dibenzo-p-dioxins/furans in soil in Taiwan
|
Hsu, YC;Que, DE;Gou, YY;Tsou, TC;Liu, CK;Wang, YL;Hou, WC;Lin, YH;Liu, WY;Chao, HR;Lee, WJ |
| 國家衛生研究院 |
2017-08 |
Overexpression of phosphoprotein phosphatase 2A predicts worse prognosis in patients with breast cancer: A 15-year follow-up
|
Chen, PM;Chu, PY;Tung, SL;Liu, CY;Tsai, YF;Lin, YS;Wang, WL;Wang, YL;Lien, PJ;Chao, TC;Tseng, LM |
| 國家衛生研究院 |
2015-11 |
Doubly spliced RNA of hepatitis B Virus suppresses viral transcription via TATA-binding protein and induces stress granule assembly
|
Tsai, KN;Chong, CL;Chou, YC;Huang, CC;Wang, YL;Wang, SW;Chen, ML;Chen, CH;Chang, C |
| 國家衛生研究院 |
2015-06-29 |
Doxorubicin activates hepatitis B virus replication by elevation of p21 (Waf1/Cip1) and C/EBPalpha expression
|
Chen, YF;Chong, CL;Wu, YC;Wang, YL;Tsai, KN;Kuo, TM;Hong, MH;Hu, CP;Chen, ML;Chou, YC;Chang, CM |
| 國家衛生研究院 |
2015-03-18 |
The inhibitory effect of the hepatitis B virus singly-spliced RNA-encoded p21.5 protein on HBV nucleocapsid formation
|
Wang, YL;Liou, GG;Lin, CH;Chen, ML;Kuo, TM;Tsai, KN;Huang, CC;Chen, YL;Huang, LR;Chou, YC;Chang, C |
| 國家衛生研究院 |
2015-03 |
Electronic hydroxyl radical microsensors based on the conductivity change of polyaniline
|
Fang, JY;Chu, CH;Sarang, I;Fang, KC;Hsu, CP;Huang, YF;Hsu, CH;Chen, CC;Li, SS;Yeh, AJ;Yao, DJ;Wang, YL |
| 國立交通大學 |
2014-12-08T15:47:23Z |
A modified multi-chemical spray cleaning process for post shallow trench isolation chemical mechanical polishing cleaning application
|
Wang, YL; Wang, TC; Wu, J; Tseng, WT; Lin, CF |
| 國立交通大學 |
2014-12-08T15:46:28Z |
A ULSI shallow trench isolation process through the integration of multilayered dielectric process and chemical-mechanical planarization
|
Lin, CF; Tseng, WT; Feng, MS; Wang, YL |
| 國立交通大學 |
2014-12-08T15:44:34Z |
Study the impact of liner thickness on the 0.18 mu m devices using low dielectric constant hydrogen silsesquioxane as the interlayer dielectric
|
Lan, JK; Wang, YL; Wu, YL; Liou, HC; Wang, JK; Chiu, SY; Cheng, YL; Feng, MS |
| 國立交通大學 |
2014-12-08T15:43:22Z |
X-ray reflectivity and FTIR measurements of N-2 plasma effects on the density profile of hydrogen silsesquioxane thin films
|
Lee, HJ; Lin, EK; Wu, WL; Fanconi, BM; Lan, JK; Cheng, YL; Liou, HC; Wang, YL; Feng, MS; Chao, CG |
| 國立交通大學 |
2014-12-08T15:43:16Z |
Characterization and reliability of low dielectric constant fluorosilicate glass and silicon rich oxide process for deep sub-micron device application
|
Cheng, YL; Wang, YL; Liu, CW; Wu, YL; Lo, KY; Liu, CP; Lan, JK |
| 國立交通大學 |
2014-12-08T15:43:16Z |
Integration of MOCVD titanium nitride with collimated titanium and ion metal plasma titanium for 0.18-mu m logic process
|
Lan, JK; Wang, YL; Lo, KY; Liu, CP; Liu, CW; Wang, JK; Cheng, YL; Chau, CG |
| 國立交通大學 |
2014-12-08T15:42:45Z |
The removal selectivity of titanium and aluminum in chemical mechanical planarization
|
Hsu, JW; Chiu, SY; Wang, YL; Dai, BT; Tsai, MS; Feng, MS; Shih, HC |
| 國立交通大學 |
2014-12-08T15:41:17Z |
Improving the quality of electroplated copper films by rapid thermal annealing
|
Chang, SC; Shieh, JM; Dai, BT; Feng, MS; Wang, YL |
| 國立交通大學 |
2014-12-08T15:40:54Z |
Superpolishing for planarizing copper damascene interconnects
|
Chang, SC; Shieh, JM; Dai, BT; Feng, MS; Li, YH; Shih, CH; Tsai, MH; Shue, SL; Liang, RS; Wang, YL |
| 國立交通大學 |
2014-12-08T15:40:43Z |
Effect of substrate on the step coverage of plasma-enhanced chemical-vapor deposited tetraethylorthosilicate films
|
Lan, JK; Wang, YL; Chao, CG; Lo, K; Cheng, YL |
| 國立交通大學 |
2014-12-08T15:40:27Z |
Mechanisms of circular defects for shallow trench isolation oxide deposition
|
Lan, JK; Wang, YL; Liu, CP; Chao, CG; Ay, CY; Liu, CW; Cheng, YL |
| 國立交通大學 |
2014-12-08T15:40:06Z |
The application of electrochemical metrologies for investigating chemical mechanical polishing of Al with a Ti barrier layer
|
Chiu, SY; Wang, YL; Liu, CP; Lan, JK; Ay, C; Feng, MS; Tsai, MS; Dai, BT |
| 國立交通大學 |
2014-12-08T15:39:57Z |
Roles of copper mechanical characteristics in electropolishing
|
Chang, SC; Shieh, JM; Fang, JY; Wang, YL; Dai, BT; Feng, MS |
| 國立交通大學 |
2014-12-08T15:39:46Z |
Pattern-dependent copper microcorrosion from CMP
|
Chen, KW; Wang, YL; Chang, L; Chang, SC; Li, FY; Lin, SH |
| 國立交通大學 |
2014-12-08T15:39:44Z |
Integration of a stack of two fluorine doped silicon oxide film with ULSI interconnect metallization
|
Cheng, YL; Wang, YL; Liu, CP; Wu, YL; Lo, KY; Liu, CW; Lan, JK; Ay, C; Feng, MS |
| 國立交通大學 |
2014-12-08T15:39:43Z |
Evaluation of advanced chemical mechanical planarization techniques for copper damascene interconnect
|
Chen, KW; Wang, YL; Liu, CP; Yang, K; Chang, L; Lo, KY; Liu, CW |
| 國立交通大學 |
2014-12-08T15:39:43Z |
Copper surface protection with a completely enclosed copper structure for a damascene process
|
Wang, TC; Hsieh, TE; Wang, YL; Wu, YL; Lo, KY; Liu, CW; Chen, KW |
| 國立交通大學 |
2014-12-08T15:39:43Z |
Study on precipitations of fluorine-doped silicon oxide
|
Wu, J; Wang, YL; Liu, CP; Chang, SC; Kuo, CT; Ay, C |
| 國立交通大學 |
2014-12-08T15:39:43Z |
Moisture resistance and thermal stability of fluorine-incorporation siloxane-based low-dielectric-constant material
|
Cheng, YL; Wang, YL; Wu, YL; Liu, CP; Liu, CW; Lan, JK; O'Neil, ML; Ay, C; Feng, MS |
| 國立交通大學 |
2014-12-08T15:39:43Z |
Monitor and eliminate the circular defects in HDP-STI deposition through oxynitride/oxide composite liner
|
Lan, JK; Wang, YL; Liu, CP; Lee, WH; Ay, C; Cheng, YL; Chang, SC |
| 國立交通大學 |
2014-12-08T15:39:16Z |
Effect of deposition temperature, on thermal stability in high-density plasma chemical vapor deposition fluorine-doped silicon dioxide
|
Cheng, YL; Wang, YL; Chen, HW; Lan, JL; Liu, CP; Wu, SA; Wu, YL; Lo, KY; Feng, MS |
| 國立交通大學 |
2014-12-08T15:38:56Z |
Optimization of post-N-2 treatment and undoped-Si-glass cap to improve metal wring delamination in deep submicron high-density plasma-fluorinated silica glass intermetal dielectric application
|
Cheng, YL; Wang, YL; Lan, JK; Wu, SA; Chang, SC; Lo, KY; Feng, MS |
| 國立交通大學 |
2014-12-08T15:38:39Z |
Direct COSi2 thin-film formation with homogeneous nanograin-size distribution by oxide-mediated silicidation
|
Chang, JJ; Liu, CP; Chen, SW; Chang, CC; Hsieh, TE; Wang, YL |
| 國立交通大學 |
2014-12-08T15:37:01Z |
Stress migration and electromigration improvement for copper dual damascene interconnection
|
Wang, TC; Hsieh, TE; Wang, MT; Su, DS; Chang, CH; Wang, YL; Lee, JYM |
| 國立交通大學 |
2014-12-08T15:35:42Z |
Modified polycrystalline silicon chemical-vapor deposition process for improving roughness at oxide/polycrystalline silicon interface
|
Chang, JJ; Hsieh, TE; Wang, YL; Tseng, WT; Liu, CP; Lan, CY |
| 國立交通大學 |
2014-12-08T15:26:47Z |
Novel strategies of FSG-CMP for within-wafer uniformity improvement and wafer edge yield enhancement beyond 0.18 micro technologies
|
Chen, KW; Wang, YL; Chang, L; Liu, CW; Lin, YK; Wang, TC; Chang, ST; Lo, KY |
| 國立交通大學 |
2014-12-08T15:19:22Z |
Formation of pyramid-like nanostructures during cobalt film growth by magnetron sputtering
|
Liu, CP; Chang, JJ; Chen, SW; Chung, HC; Wang, YL |
| 國立交通大學 |
2014-12-08T15:19:18Z |
Aplication of plasma immersion ion implantation on seeding copper electroplating for multilevel interconnection
|
Chiu, SY; Wang, YL; Chang, SC; Feng, MS |
| 國立交通大學 |
2014-12-08T15:18:36Z |
Study of diffusion and quality control for CoSi2 formation by oxide-mediated cobalt silicidation with Ti capping
|
Chang, JJ; Liu, CP; Hsieh, TE; Wang, YL |
| 國立交通大學 |
2014-12-08T15:17:41Z |
CoSix thermal stability on narrow-width polysilicon resistors
|
Chen, YM; Tu, GC; Wang, YL; Hwang, GJ; Lo, CY |
| 國立交通大學 |
2014-12-08T15:17:21Z |
Investigation of overpotential and seed thickness on damascene copper electroplating
|
Chen, KW; Wang, YL; Chang, L; Li, FY; Chang, SC |
| 國立交通大學 |
2014-12-08T15:17:21Z |
Heat, moisture and chemical resistance on low dielectric constant (low-k) film using diethoxymethylsilane (DEMS) prepared by plasma enhanced chemical vapor deposition
|
Cheng, YL; Wang, YL; Lan, JK; Hwang, GJ; O'Neil, ML; Chen, CF |
| 國立交通大學 |
2014-12-08T15:17:21Z |
Effect of deposition temperature and oxygen flow rate on properties of low dielectric constant SiCOH film prepared by plasma enhanced chemical vapor deposition using diethoxymethylsilane
|
Cheng, YL; Wang, YL; Hwang, GJ; O'Neill, ML; Karwacki, EJ; Liu, PT; Chen, CF |
| 國立交通大學 |
2014-12-08T15:17:21Z |
Precipitates formation and its impact on the structure of plasma-deposited fluorinated silicon oxide films
|
Wu, J; Wang, YL; Kuo, CT |
| 國立交通大學 |
2014-12-08T15:17:21Z |
The study of diffusion and nucleation for COSi2 formation by oxide-mediated cobalt silicidation
|
Chang, JJ; Liu, CP; Hsieh, TE; Wang, YL |
| 國立交通大學 |
2014-12-08T15:17:19Z |
Characterization and thermal stability of fluorosilicate glass films deposited by high density plasma chemical vapor deposition with different bias power
|
Hsiao, WC; Liu, CP; Wang, YL; Cheng, YL |
| 國立交通大學 |
2014-12-08T15:17:19Z |
Mechanism for Cu void defect on various electroplated film conditions
|
Feng, HP; Cheng, MY; Wang, YL; Chang, SC; Wang, YY; Wan, CC |
| 國立交通大學 |
2014-12-08T15:17:19Z |
Effects of plasma treatment in the tungsten process for chemical vapor deposition titanium nitride barrier film beyond nanometer technology
|
Chen, KW; Wang, YL; Chang, L; Li, FY; Hwang, GJ |
| 國立交通大學 |
2014-12-08T15:17:19Z |
Uniform COSi2 nano-nucleus formation by oxide mediated silicidation with a Ti capping layer
|
Chang, JJ; Hsieh, TE; Liu, CP; Wang, YL |
| 國立交通大學 |
2014-12-08T15:17:19Z |
Oxide-mediated fort-nation of epitaxy silicide on heavily doped Si surfaces and narrow width active region
|
Chen, YM; Tu, GC; Wang, YL |
显示项目 16-65 / 126 (共3页)
1 2 3 > >>
每页显示[10|25|50]项目
|
