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"wang yl"的相關文件
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| 國立交通大學 |
2014-12-08T15:40:27Z |
Mechanisms of circular defects for shallow trench isolation oxide deposition
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Lan, JK; Wang, YL; Liu, CP; Chao, CG; Ay, CY; Liu, CW; Cheng, YL |
| 國立交通大學 |
2014-12-08T15:40:06Z |
The application of electrochemical metrologies for investigating chemical mechanical polishing of Al with a Ti barrier layer
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Chiu, SY; Wang, YL; Liu, CP; Lan, JK; Ay, C; Feng, MS; Tsai, MS; Dai, BT |
| 國立交通大學 |
2014-12-08T15:39:57Z |
Roles of copper mechanical characteristics in electropolishing
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Chang, SC; Shieh, JM; Fang, JY; Wang, YL; Dai, BT; Feng, MS |
| 國立交通大學 |
2014-12-08T15:39:46Z |
Pattern-dependent copper microcorrosion from CMP
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Chen, KW; Wang, YL; Chang, L; Chang, SC; Li, FY; Lin, SH |
| 國立交通大學 |
2014-12-08T15:39:44Z |
Integration of a stack of two fluorine doped silicon oxide film with ULSI interconnect metallization
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Cheng, YL; Wang, YL; Liu, CP; Wu, YL; Lo, KY; Liu, CW; Lan, JK; Ay, C; Feng, MS |
| 國立交通大學 |
2014-12-08T15:39:43Z |
Evaluation of advanced chemical mechanical planarization techniques for copper damascene interconnect
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Chen, KW; Wang, YL; Liu, CP; Yang, K; Chang, L; Lo, KY; Liu, CW |
| 國立交通大學 |
2014-12-08T15:39:43Z |
Copper surface protection with a completely enclosed copper structure for a damascene process
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Wang, TC; Hsieh, TE; Wang, YL; Wu, YL; Lo, KY; Liu, CW; Chen, KW |
| 國立交通大學 |
2014-12-08T15:39:43Z |
Study on precipitations of fluorine-doped silicon oxide
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Wu, J; Wang, YL; Liu, CP; Chang, SC; Kuo, CT; Ay, C |
| 國立交通大學 |
2014-12-08T15:39:43Z |
Moisture resistance and thermal stability of fluorine-incorporation siloxane-based low-dielectric-constant material
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Cheng, YL; Wang, YL; Wu, YL; Liu, CP; Liu, CW; Lan, JK; O'Neil, ML; Ay, C; Feng, MS |
| 國立交通大學 |
2014-12-08T15:39:43Z |
Monitor and eliminate the circular defects in HDP-STI deposition through oxynitride/oxide composite liner
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Lan, JK; Wang, YL; Liu, CP; Lee, WH; Ay, C; Cheng, YL; Chang, SC |
顯示項目 36-45 / 126 (共13頁)
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