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Showing items 31-80 of 126 (3 Page(s) Totally)
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Institution	Date	Title	Author
國立交通大學	2014-12-08T15:43:16Z	Integration of MOCVD titanium nitride with collimated titanium and ion metal plasma titanium for 0.18-mu m logic process	Lan, JK; Wang, YL; Lo, KY; Liu, CP; Liu, CW; Wang, JK; Cheng, YL; Chau, CG
國立交通大學	2014-12-08T15:42:45Z	The removal selectivity of titanium and aluminum in chemical mechanical planarization	Hsu, JW; Chiu, SY; Wang, YL; Dai, BT; Tsai, MS; Feng, MS; Shih, HC
國立交通大學	2014-12-08T15:41:17Z	Improving the quality of electroplated copper films by rapid thermal annealing	Chang, SC; Shieh, JM; Dai, BT; Feng, MS; Wang, YL
國立交通大學	2014-12-08T15:40:54Z	Superpolishing for planarizing copper damascene interconnects	Chang, SC; Shieh, JM; Dai, BT; Feng, MS; Li, YH; Shih, CH; Tsai, MH; Shue, SL; Liang, RS; Wang, YL
國立交通大學	2014-12-08T15:40:43Z	Effect of substrate on the step coverage of plasma-enhanced chemical-vapor deposited tetraethylorthosilicate films	Lan, JK; Wang, YL; Chao, CG; Lo, K; Cheng, YL
國立交通大學	2014-12-08T15:40:27Z	Mechanisms of circular defects for shallow trench isolation oxide deposition	Lan, JK; Wang, YL; Liu, CP; Chao, CG; Ay, CY; Liu, CW; Cheng, YL
國立交通大學	2014-12-08T15:40:06Z	The application of electrochemical metrologies for investigating chemical mechanical polishing of Al with a Ti barrier layer	Chiu, SY; Wang, YL; Liu, CP; Lan, JK; Ay, C; Feng, MS; Tsai, MS; Dai, BT
國立交通大學	2014-12-08T15:39:57Z	Roles of copper mechanical characteristics in electropolishing	Chang, SC; Shieh, JM; Fang, JY; Wang, YL; Dai, BT; Feng, MS
國立交通大學	2014-12-08T15:39:46Z	Pattern-dependent copper microcorrosion from CMP	Chen, KW; Wang, YL; Chang, L; Chang, SC; Li, FY; Lin, SH
國立交通大學	2014-12-08T15:39:44Z	Integration of a stack of two fluorine doped silicon oxide film with ULSI interconnect metallization	Cheng, YL; Wang, YL; Liu, CP; Wu, YL; Lo, KY; Liu, CW; Lan, JK; Ay, C; Feng, MS
國立交通大學	2014-12-08T15:39:43Z	Evaluation of advanced chemical mechanical planarization techniques for copper damascene interconnect	Chen, KW; Wang, YL; Liu, CP; Yang, K; Chang, L; Lo, KY; Liu, CW
國立交通大學	2014-12-08T15:39:43Z	Copper surface protection with a completely enclosed copper structure for a damascene process	Wang, TC; Hsieh, TE; Wang, YL; Wu, YL; Lo, KY; Liu, CW; Chen, KW
國立交通大學	2014-12-08T15:39:43Z	Study on precipitations of fluorine-doped silicon oxide	Wu, J; Wang, YL; Liu, CP; Chang, SC; Kuo, CT; Ay, C
國立交通大學	2014-12-08T15:39:43Z	Moisture resistance and thermal stability of fluorine-incorporation siloxane-based low-dielectric-constant material	Cheng, YL; Wang, YL; Wu, YL; Liu, CP; Liu, CW; Lan, JK; O'Neil, ML; Ay, C; Feng, MS
國立交通大學	2014-12-08T15:39:43Z	Monitor and eliminate the circular defects in HDP-STI deposition through oxynitride/oxide composite liner	Lan, JK; Wang, YL; Liu, CP; Lee, WH; Ay, C; Cheng, YL; Chang, SC
國立交通大學	2014-12-08T15:39:16Z	Effect of deposition temperature, on thermal stability in high-density plasma chemical vapor deposition fluorine-doped silicon dioxide	Cheng, YL; Wang, YL; Chen, HW; Lan, JL; Liu, CP; Wu, SA; Wu, YL; Lo, KY; Feng, MS
國立交通大學	2014-12-08T15:38:56Z	Optimization of post-N-2 treatment and undoped-Si-glass cap to improve metal wring delamination in deep submicron high-density plasma-fluorinated silica glass intermetal dielectric application	Cheng, YL; Wang, YL; Lan, JK; Wu, SA; Chang, SC; Lo, KY; Feng, MS
國立交通大學	2014-12-08T15:38:39Z	Direct COSi2 thin-film formation with homogeneous nanograin-size distribution by oxide-mediated silicidation	Chang, JJ; Liu, CP; Chen, SW; Chang, CC; Hsieh, TE; Wang, YL
國立交通大學	2014-12-08T15:37:01Z	Stress migration and electromigration improvement for copper dual damascene interconnection	Wang, TC; Hsieh, TE; Wang, MT; Su, DS; Chang, CH; Wang, YL; Lee, JYM
國立交通大學	2014-12-08T15:35:42Z	Modified polycrystalline silicon chemical-vapor deposition process for improving roughness at oxide/polycrystalline silicon interface	Chang, JJ; Hsieh, TE; Wang, YL; Tseng, WT; Liu, CP; Lan, CY
國立交通大學	2014-12-08T15:26:47Z	Novel strategies of FSG-CMP for within-wafer uniformity improvement and wafer edge yield enhancement beyond 0.18 micro technologies	Chen, KW; Wang, YL; Chang, L; Liu, CW; Lin, YK; Wang, TC; Chang, ST; Lo, KY
國立交通大學	2014-12-08T15:19:22Z	Formation of pyramid-like nanostructures during cobalt film growth by magnetron sputtering	Liu, CP; Chang, JJ; Chen, SW; Chung, HC; Wang, YL
國立交通大學	2014-12-08T15:19:18Z	Aplication of plasma immersion ion implantation on seeding copper electroplating for multilevel interconnection	Chiu, SY; Wang, YL; Chang, SC; Feng, MS
國立交通大學	2014-12-08T15:18:36Z	Study of diffusion and quality control for CoSi2 formation by oxide-mediated cobalt silicidation with Ti capping	Chang, JJ; Liu, CP; Hsieh, TE; Wang, YL
國立交通大學	2014-12-08T15:17:41Z	CoSix thermal stability on narrow-width polysilicon resistors	Chen, YM; Tu, GC; Wang, YL; Hwang, GJ; Lo, CY
國立交通大學	2014-12-08T15:17:21Z	Investigation of overpotential and seed thickness on damascene copper electroplating	Chen, KW; Wang, YL; Chang, L; Li, FY; Chang, SC
國立交通大學	2014-12-08T15:17:21Z	Heat, moisture and chemical resistance on low dielectric constant (low-k) film using diethoxymethylsilane (DEMS) prepared by plasma enhanced chemical vapor deposition	Cheng, YL; Wang, YL; Lan, JK; Hwang, GJ; O'Neil, ML; Chen, CF
國立交通大學	2014-12-08T15:17:21Z	Effect of deposition temperature and oxygen flow rate on properties of low dielectric constant SiCOH film prepared by plasma enhanced chemical vapor deposition using diethoxymethylsilane	Cheng, YL; Wang, YL; Hwang, GJ; O'Neill, ML; Karwacki, EJ; Liu, PT; Chen, CF
國立交通大學	2014-12-08T15:17:21Z	Precipitates formation and its impact on the structure of plasma-deposited fluorinated silicon oxide films	Wu, J; Wang, YL; Kuo, CT
國立交通大學	2014-12-08T15:17:21Z	The study of diffusion and nucleation for COSi2 formation by oxide-mediated cobalt silicidation	Chang, JJ; Liu, CP; Hsieh, TE; Wang, YL
國立交通大學	2014-12-08T15:17:19Z	Characterization and thermal stability of fluorosilicate glass films deposited by high density plasma chemical vapor deposition with different bias power	Hsiao, WC; Liu, CP; Wang, YL; Cheng, YL
國立交通大學	2014-12-08T15:17:19Z	Mechanism for Cu void defect on various electroplated film conditions	Feng, HP; Cheng, MY; Wang, YL; Chang, SC; Wang, YY; Wan, CC
國立交通大學	2014-12-08T15:17:19Z	Effects of plasma treatment in the tungsten process for chemical vapor deposition titanium nitride barrier film beyond nanometer technology	Chen, KW; Wang, YL; Chang, L; Li, FY; Hwang, GJ
國立交通大學	2014-12-08T15:17:19Z	Uniform COSi2 nano-nucleus formation by oxide mediated silicidation with a Ti capping layer	Chang, JJ; Hsieh, TE; Liu, CP; Wang, YL
國立交通大學	2014-12-08T15:17:19Z	Oxide-mediated fort-nation of epitaxy silicide on heavily doped Si surfaces and narrow width active region	Chen, YM; Tu, GC; Wang, YL
國立交通大學	2014-12-08T15:17:18Z	Width-dependent anomalous CoSix sheet resistance change by Ti and TiN capping process	Chen, YM; Tu, GC; Wang, YL
國立交通大學	2014-12-08T15:17:12Z	Comparison of characteristics and integration of copper diffusion-barrier dielectrics	Wang, TC; Cheng, YL; Wang, YL; Hsieh, TE; Hwang, GJ; Chen, CF
國立交通大學	2014-12-08T15:17:12Z	Novel slurry solution for dishing elimination in copper process beyond 0.1-mu m technology	Chen, KW; Wang, YL; Liu, CP; Chang, L; Li, FY
國立交通大學	2014-12-08T15:17:12Z	High-selectivity damascene chemical mechanical polishing	Chiu, SY; Wang, YL; Liu, CP; Chang, SC; Hwang, GJ; Feng, MS; Chen, CF
國立交通大學	2014-12-08T15:02:02Z	Re-examination of pressure and speed dependences of removal rate during chemical-mechanical polishing processes	Tseng, WT; Wang, YL
國立交通大學	2014-12-08T15:01:30Z	Integration of modified plasma-enhanced chemical vapor deposited tetraethoxysilane intermetal dielectric and chemical-mechanical polishing processes for 0.35 mu m IC device reliability improvement	Wang, YL; Tseng, WT; Feng, MS
國立交通大學	2014-12-08T15:01:23Z	Effects of underlying films on the chemical-mechanical polishing for shallow trench isolation technology	Wang, YL; Liu, C; Feng, MS; Dun, JW; Chou, KS
國立交通大學	2014-12-08T15:01:23Z	Chemical-mechanical polishing of low-dielectric-constant spin-on-glasses: film chemistries, slurry formulation and polish selectivity	Wang, YL; Liu, C; Chang, ST; Tsai, MS; Feng, MS; Tseng, WT
國立交通大學	2014-12-08T15:01:09Z	The exothermic reaction and temperature measurement for tungsten CMP technology and its application on endpoint detection	Wang, YL; Liu, C; Feng, MS; Tseng, WT
國立交通大學	2014-12-08T15:01:09Z	A modified multi-chemicals spray cleaning process for post-CMP cleaning application	Wang, YL; Liu, C; Feng, MS; Tseng, WT
國家衛生研究院	2014-10	Novel cholesterol sensor based on ultra-low detection limit hydrogen peroxide sensor	Chu, CH;Fang, KC;Hsu, CP;Kang, YW;Fang, JY;Hsu, CH;Huang, YF;Chen, CC;Li, SS;Yeh, JA;Yao, DJ;Wang, YL
國家衛生研究院	2014-10	A novel ultra-low detection limit hydrogen peroxide sensor based on horseradish peroxidase immobilized polyaniline film	Fang, KC;Chu, CH;Hsu, CP;Kang, YW;Fang, JY;Hsu, CH;Huang, YF;Chen, CC;Li, SS;Yeh, JA;Yao, DJ;Wang, YL
國家衛生研究院	2014-09-15	Cost-effective and highly sensitive cholesterol microsensors with fast response based on the enzyme-induced conductivity change of polyaniline	Fang, KC;Chu, CH;Hsu, CP;Kang, YW;Fang, JY;Hsu, CH;Huang, YF;Chen, CC;Li, SS;Andrew Yeh, J;Yao, DJ;Wang, YL
國家衛生研究院	2014-05-15	Realization of an ultra-sensitive hydrogen peroxide sensor with conductance change of horseradish peroxidase-immobilized polyaniline and investigation of the sensing mechanism	Fang, KC;Hsu, CP;Kang, YW;Fang, JY;Huang, CC;Hsu, CH;Huang, YF;Chen, CC;Li, SS;Andrew Yeh, J;Yao, DJ;Wang, YL
國家衛生研究院	2014-03	Investigation of C-terminal domain of SARS nucleocapsid protein - Duplex DNA interaction using transistors and binding-site models	Hsu, YR;Kang, YW;Fang, JY;Lee, GY;Chyi, JI;Chang, Ck;Huang, CC;Hsu, CP;Huang, Th;Huang, YF;Sun, YC;Hsu, CH;Chen, CC;Sheng-Shian, L;Yeh, JA;Yao, DJ;Ren, F;Wang, YL

Showing items 31-80 of 126 (3 Page(s) Totally)
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