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Institution Date Title Author
國立成功大學 2025-01-15 牛罵頭文化石製品之製作技術特徵──以安和遺址福和段96地號打製石片為例 王禹升; Wang, Yu-Sheng
臺大學術典藏 2020-02-19T07:21:41Z ?H, ??C and ??N backbone and side-chain resonance assignments of a family 36 carbohydrate binding module of xylanase from Paenibacillus campinasensis Wang, Yu-Sheng; Ko, Chun-Han; Chang, Hao-Ting; Yang, Kai-Jay; Chen, Yu-Jen; Huang, Shing-Jong; Fang, Pei-Ju; Chang, Chi-Fon; Tzou, Der-Lii M.; HUI-TING CHANG
國立交通大學 2019-04-02T06:04:50Z A Study on the Plating and Wetting Ability of Ruthenium-Tungsten Multi-layers for Advanced Cu Metallization Kuo, Tai-Chen; Su, Yin-Hsien; Lee, Wen-Hsi; Liao, Wei-Hsiang; Wang, Yu-Sheng; Hung, Chi-Cheng; Wang, Ying-Lang
國立暨南國際大學 2019 Doping Effects of Li-rich Mn-based Oxides Battery Materials 王裕勝; Wang, Yu-Sheng
國立交通大學 2018-08-21T05:54:18Z Cleaning methodology of small residue defect with surfactant in copper chemical mechanical polishing post-cleaning Wei, Kuo-Hsiu; Hung, Chi-Cheng; Wang, Yu-Sheng; Liu, Chuan-Pu; Chen, Kei-Wei; Wang, Ying-Lang
國立交通大學 2018-08-21T05:52:53Z Effect of tungsten incorporation in cobalt tungsten alloys as seedless diffusion barrier materials Su, Yin-Hsien; Kuo, Tai-Chen; Lee, Wen-Hsi; Wang, Yu-Sheng; Hung, Chi-Cheng; Tseng, Wei-Hsiang; Wei, Kuo-Hsiu; Wang, Ying-Lang
臺大學術典藏 2018-06-28T21:15:36Z Enhancement of the optical transmission by mixing the metallic and dielectric nanoparticles atop the silicon substrate Yeh, Yung-Ming; Wang, Yu-Sheng; Li, Jia-Han; Yeh, Yung-Ming; Wang, Yu-Sheng; Li, Jia-Han
國立交通大學 2017-04-21T06:49:59Z A study on the plating and wetting ability of ruthenium-tungsten multi-layers for advanced Cu metallization Kuo, Tai-Chen; Su, Yin-Hsien; Lee, Wen-Hsi; Liao, Wei-Hsiang; Wang, Yu-Sheng; Hung, Chi-Cheng; Wang, Ying-Lang
國立交通大學 2017-04-21T06:48:55Z Cleaning methodology of small residue defect with surfactant in copper chemical mechanical polishing post-cleaning Wei, Kuo-Hsiu; Hung, Chi-Cheng; Wang, Yu-Sheng; Liu, Chuan-Pu; Chen, Kei-Wei; Wang, Ying-Lang
國立成功大學 2016-11-01 Cleaning methodology of small residue defect with surfactant in copper chemical mechanical polishing post-cleaning Wei, Kuo-Hsiu; Hung, Chi-Cheng; Wang, Yu-Sheng; Liu, Chuan-Pu; Chen, Kei-Wei; Wang, Ying-Lang

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