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Institution Date Title Author
國立成功大學 2025-01-15 牛罵頭文化石製品之製作技術特徵──以安和遺址福和段96地號打製石片為例 王禹升; Wang, Yu-Sheng
臺大學術典藏 2020-02-19T07:21:41Z ?H, ??C and ??N backbone and side-chain resonance assignments of a family 36 carbohydrate binding module of xylanase from Paenibacillus campinasensis Wang, Yu-Sheng; Ko, Chun-Han; Chang, Hao-Ting; Yang, Kai-Jay; Chen, Yu-Jen; Huang, Shing-Jong; Fang, Pei-Ju; Chang, Chi-Fon; Tzou, Der-Lii M.; HUI-TING CHANG
國立交通大學 2019-04-02T06:04:50Z A Study on the Plating and Wetting Ability of Ruthenium-Tungsten Multi-layers for Advanced Cu Metallization Kuo, Tai-Chen; Su, Yin-Hsien; Lee, Wen-Hsi; Liao, Wei-Hsiang; Wang, Yu-Sheng; Hung, Chi-Cheng; Wang, Ying-Lang
國立暨南國際大學 2019 Doping Effects of Li-rich Mn-based Oxides Battery Materials 王裕勝; Wang, Yu-Sheng
國立交通大學 2018-08-21T05:54:18Z Cleaning methodology of small residue defect with surfactant in copper chemical mechanical polishing post-cleaning Wei, Kuo-Hsiu; Hung, Chi-Cheng; Wang, Yu-Sheng; Liu, Chuan-Pu; Chen, Kei-Wei; Wang, Ying-Lang
國立交通大學 2018-08-21T05:52:53Z Effect of tungsten incorporation in cobalt tungsten alloys as seedless diffusion barrier materials Su, Yin-Hsien; Kuo, Tai-Chen; Lee, Wen-Hsi; Wang, Yu-Sheng; Hung, Chi-Cheng; Tseng, Wei-Hsiang; Wei, Kuo-Hsiu; Wang, Ying-Lang
臺大學術典藏 2018-06-28T21:15:36Z Enhancement of the optical transmission by mixing the metallic and dielectric nanoparticles atop the silicon substrate Yeh, Yung-Ming; Wang, Yu-Sheng; Li, Jia-Han; Yeh, Yung-Ming; Wang, Yu-Sheng; Li, Jia-Han
國立交通大學 2017-04-21T06:49:59Z A study on the plating and wetting ability of ruthenium-tungsten multi-layers for advanced Cu metallization Kuo, Tai-Chen; Su, Yin-Hsien; Lee, Wen-Hsi; Liao, Wei-Hsiang; Wang, Yu-Sheng; Hung, Chi-Cheng; Wang, Ying-Lang
國立交通大學 2017-04-21T06:48:55Z Cleaning methodology of small residue defect with surfactant in copper chemical mechanical polishing post-cleaning Wei, Kuo-Hsiu; Hung, Chi-Cheng; Wang, Yu-Sheng; Liu, Chuan-Pu; Chen, Kei-Wei; Wang, Ying-Lang
國立成功大學 2016-11-01 Cleaning methodology of small residue defect with surfactant in copper chemical mechanical polishing post-cleaning Wei, Kuo-Hsiu; Hung, Chi-Cheng; Wang, Yu-Sheng; Liu, Chuan-Pu; Chen, Kei-Wei; Wang, Ying-Lang
國立成功大學 2016-08-16 A study on the plating and wetting ability of ruthenium-tungsten multi-layers for advanced Cu metallization Kuo, Tai-Chen; Su, Yin-Hsien; Lee, Wen-Hsi; Liao, Wei-Hsiang; Wang, Yu-Sheng; Hung, Chi-Cheng; Wang, Ying-Lang
亞洲大學 2016 Role interaction in tourism governance of district office during the structure of regime In Taichung Dajia District Case. WANG, YU-SHENG
國立臺灣大學 2016 微弧氧化加工於鈦金屬鍍膜白色粉末之研究 王昱勝; Wang, Yu-Sheng
國立交通大學 2014-12-08T15:35:19Z Evaluating the sensitizing effect on the photocatalytic decoloration of dyes using anatase-TiO2 Hsiao, Yu-Cheng; Wu, Tsai-Fang; Wang, Yu-Sheng; Hu, Chi-Chang; Huang, Chihpin
國立交通大學 2014-12-08T15:33:46Z The influence of abrasive particle size in copper chemical mechanical planarization Wei, Kuo-Hsiu; Wang, Yu-Sheng; Liu, Chuan-Pu; Chen, Kei-Wei; Wang, Ying-Lang; Cheng, Yi-Lung
國立交通大學 2014-12-08T15:32:22Z An electroplating method for copper plane twin boundary manufacturing Wang, Yu-Sheng; Lee, Wen-Hsi; Chang, Shih-Chieh; Nian, Jun-Nan; Wang, Ying-Lang
國立交通大學 2014-12-08T15:29:55Z Effects of (002) beta-Ta barrier on copper chemical mechanical polishing behavior Wang, Yu-Sheng; Chen, Kei-Wei; Cheng, Min-Yuan; Lee, Wen-Hsi; Wang, Ying-Lang
國立交通大學 2014-12-08T15:22:20Z A Study of Trimethylsilane (3MS) and Tetramethylsilane (4MS) Based alpha-SiCN:H/alpha-SiCO:H Diffusion Barrier Films Chen, Sheng-Wen; Wang, Yu-Sheng; Hu, Shao-Yu; Lee, Wen-Hsi; Chi, Chieh-Cheng; Wang, Ying-Lang
國立交通大學 2014-12-08T15:11:02Z Effect of Under-Layer Treatment of Ta/TaN Barrier Film on Corrosion Between Cu Seed and Ta in Chemical-Mechanical-Polishing Slurry Lee, Wen-Hsi; Hung, Chi-Cheng; Wang, Yu-Sheng; Chang, Shih-Chieh; Wang, Ying-Lang
國立成功大學 2014-07-25 應用於次世代金屬銅製程鉭/釕/鈷基底多功能阻障層材料電化學及物理特性之研究 王喻生; Wang, Yu-Sheng
國立成功大學 2014-07-09 Lightweight and Flexible Reduced Graphene Oxide/Water-Borne Polyurethane Composites with High Electrical Conductivity and Excellent Electromagnetic Interference Shielding Performance Hsiao, Sheng-Tsung; Ma, Chen-Chi M.; Liao, Wei-Hao; Wang, Yu-Sheng; Li, Shin-Ming; Huang, Yu-Chin; Yang, Ruey-Bin; Liang, Wen-Fan
國立成功大學 2013-10-01 An electroplating method for copper plane twin boundary manufacturing Wang, Yu-Sheng; Lee, Wen-Hsi; Chang, Shih-Chieh; Nian, Jun-Nan; Wang, Ying-Lang
國立成功大學 2013-09 The influence of abrasive particle size in copper chemical mechanical planarization Wei, Kuo-Hsiu; Wang, Yu-Sheng; Liu, Chuan-Pu; Chen, Kei-Wei; Wang, Ying-Lang; Cheng, Yi-Lung
國立成功大學 2013-07-30 EC-225型機隊對我國搜救效能提升之探討 王昱昇; Wang, Yu-Sheng
國立成功大學 2013-07-07 EC-225型機隊對我國搜救效能提升之探討 王昱昇; Wang, Yu-Sheng

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