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"wang yung yun"的相关文件
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| 國立交通大學 |
2014-12-08T15:17:35Z |
Tapered Cu pattern metallization by electrodeposition through mask
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Jenq, Shrane Ning; Wan, Chi Chao; Wang, Yung Yun; Li, Hung Wei; Liu, Po Tsun; Chen, Jing Hon |
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Forming tapered pattern by Cu electrodeposition through mask on Ni seed layer for thin-film transistors
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Behavior of copper removal by CMP and its correlation to deposit structure and impurity content
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Feng, Hsien-Ping; Lin, Jeng-Yu; Cheng, Ming-Yung; Wang, Yung-Yun; Wan, Chi-Chao |
显示项目 1-3 / 3 (共1页)
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