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機構 日期 題名 作者
元智大學 2013-11 Assessment of Thermal Impact on Performance of Metamorphic High-Electron-Mobility Transistors on Polymer Substrates Using Flip-Chip-on-Board Technology Ching-Te Wang; Heng-Tung Hsu; Che-Yang Chiang; Edward Yi Chang; Wee-Chin Lim
元智大學 2012-12-04 Impact of Bonding Temperature on the Performance of In0.6Ga0.4As Metamorphic High Electron Mobility Transistor (mHEMT) Device Packaged Using Flip-Chip-on-Board (FCOB) Technology Che-Yang Chiang; Heng-Tung Hsu; Chien-I Kuo; Ching-Te Wang; Wee Chin Lim; Edward Yi Chang
元智大學 2012-12-04 Impact of Bonding Temperature on the Performance of In0.6Ga0.4As Metamorphic High Electron Mobility Transistor (mHEMT) Device Packaged Using Flip-Chip-on-Board (FCOB) Technology Che-Yang Chiang; Heng-Tung Hsu; Chien-I Kuo; Ching-Te Wang; Wee Chin Lim; Edward Yi Chang
元智大學 2011-09 Flip-Chip Packaging of Low-Noise Metamorphic High Electron Mobility Transistors on Low-Cost Organic Substrate Chin-Te Wang; Chien-I Kuo; Heng-Tung Hsu; Edward Yi Chang; Li-Han Hsu; Wee-Chin Lim; Yasuyuki Miyamoto
元智大學 2011-09 Flip-Chip Packaging of Low-Noise Metamorphic High Electron Mobility Transistors on Low-Cost Organic Substrate Chin-Te Wang; Chien-I Kuo; Heng-Tung Hsu; Edward Yi Chang; Li-Han Hsu; Wee-Chin Lim; Yasuyuki Miyamoto
元智大學 2011-02 A Flip-Chip Packaged 80-nm In0.7Ga0.3As MHEMT for Millimeter-Wave Low-Noise Applications Chin-Te Wang; Chien-I Kuo; Heng-Tung Hsu; Edward Yi Chang; Li-Han Hsu; Wee-Chin Lim; Che-Yang Chiang; Suz-Ping Tsai; Guo-Wei Huang
元智大學 2011-02 A Flip-Chip Packaged 80-nm In0.7Ga0.3As MHEMT for Millimeter-Wave Low-Noise Applications Chin-Te Wang; Chien-I Kuo; Heng-Tung Hsu; Edward Yi Chang; Li-Han Hsu; Wee-Chin Lim; Che-Yang Chiang; Suz-Ping Tsai; Guo-Wei Huang
元智大學 2010-12 Improvement in RF Performance of 40-nm InAs-Channel Based HEMTs Using Pt Gate Sinking With Two-Step Recess Processes Technology C.I.Kuo; Heng-Tung Hsu; Chien-Ying Wu; E.Y.Chang; Chen-Yu Lin; Wee-Chin Lim
元智大學 2010-12 Improvement in RF Performance of 40-nm InAs-Channel Based HEMTs Using Pt Gate Sinking With Two-Step Recess Processes Technology C.I.Kuo; Heng-Tung Hsu; Chien-Ying Wu; E.Y.Chang; Chen-Yu Lin; Wee-Chin Lim
元智大學 2010-12 Bonding Temperature Effect on the Performance of Flip Chip Assembled 150nm mHEMT Device on Organic Substrate Chien-I Kuo; Wee-Chin Lim; Heng-Tung Hsu; Chin-Te Wang; Li-Han Hsu; Faiz Aizad; Guo-Wei Huang; Yasuyuki Miyamoto; Edward Yi Chang
元智大學 2010-12 Bonding Temperature Effect on the Performance of Flip Chip Assembled 150nm mHEMT Device on Organic Substrate Chien-I Kuo; Wee-Chin Lim; Heng-Tung Hsu; Chin-Te Wang; Li-Han Hsu; Faiz Aizad; Guo-Wei Huang; Yasuyuki Miyamoto; Edward Yi Chang
元智大學 2010-12 Bonding Temperature Effect on the Performance of Flip Chip Assembled 150nm mHEMT Device on Organic Substrate Chien-I Kuo; Wee-Chin Lim; Heng-Tung Hsu; Chin-Te Wang; Li-Han Hsu; Faiz Aizad; Guo-Wei Huang; Yasuyuki Miyamoto; Edward Yi Chang

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