臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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Institution	Date	Title	Author
元智大學	2014-10-22	Correlation between Ni(P) Depletion and IMCs Formation in Microelectronic Solder Joints with A Submicron Ni(P) Surface Finish	Wan-Zhen Hsieh; Tsung-Hsun Yang; Wei-Hsiang Wu; Yu-Wei Lee; Cheng-En Ho
元智大學	2013	鈀厚度對無鉛銲接反應及其機械可靠度之相關性研究	巫維翔; Wei-Hsiang Wu
元智大學	2012-06	Method for Inhibiting Electromigration-Indiced Phase Segregation in Solder Joints	Cheng-En Ho; Wei-Hsiang Wu
元智大學	2012-06	Method for Inhibiting Electromigration-Indiced Phase Segregation in Solder Joints	Cheng-En Ho; Wei-Hsiang Wu
元智大學	2010-12	Critical Current Density of Inhibiting (Cu,Ni)6Sn5 Formation on the Ni side of Cu/Solder/Ni Joints	Wei-Hsiang Wu; Han-Lin Chung; Bo-Zong Chen; Cheng-En Ho
元智大學	2010-11	Influence of Palladium Thickness on the Soldering Reactions between Sn-3Ag-0.5Cu and Au/Pd(P)/Ni(P) Surface Finish	黃淑惠 (助理); Wei-Hsiang Wu; Cheng-Shiuan Lin; Cheng-En Ho
元智大學	2010-11	Influence of Palladium Thickness on the Soldering Reactions between Sn-3Ag-0.5Cu and Au/Pd(P)/Ni(P) Surface Finish	黃淑惠 (助理); Wei-Hsiang Wu; Cheng-Shiuan Lin; Cheng-En Ho
元智大學	2010-11	Influence of Palladium Thickness on the Soldering Reactions between Sn-3Ag-0.5Cu and Au/Pd(P)/Ni(P) Surface Finish	Wei-Hsiang Wu; Cheng-Shiuan Lin; Shu-Hui Huang (助理); Cheng-En Ho
元智大學	2010-10	A Study on the Soldering Reaction between Sn3Ag0.5Cu and Electrolytic-Ni Coated with A Au/Pd(P) Bilayer Surface Finish	Nico Lee (台灣上村課長); Robert Peng (台灣上村工程師); Wei-Hsiang Wu; Cheng-En Ho
元智大學	2010-08	抵消電遷移的方法	Cheng-En Ho; Wei-Hsiang Wu
元智大學	2010-08	抵消電遷移的方法	Cheng-En Ho; Wei-Hsiang Wu
元智大學	2007	兩岸晶圓代工產業發展之研究	吳維祥; Wei-Hsiang Wu

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