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Showing items 1-8 of 8 (1 Page(s) Totally)
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| 國立交通大學 |
2018-08-21T05:54:18Z |
Cleaning methodology of small residue defect with surfactant in copper chemical mechanical polishing post-cleaning
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Wei, Kuo-Hsiu; Hung, Chi-Cheng; Wang, Yu-Sheng; Liu, Chuan-Pu; Chen, Kei-Wei; Wang, Ying-Lang |
| 國立交通大學 |
2018-08-21T05:52:53Z |
Effect of tungsten incorporation in cobalt tungsten alloys as seedless diffusion barrier materials
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Su, Yin-Hsien; Kuo, Tai-Chen; Lee, Wen-Hsi; Wang, Yu-Sheng; Hung, Chi-Cheng; Tseng, Wei-Hsiang; Wei, Kuo-Hsiu; Wang, Ying-Lang |
| 國立交通大學 |
2017-04-21T06:48:55Z |
Cleaning methodology of small residue defect with surfactant in copper chemical mechanical polishing post-cleaning
|
Wei, Kuo-Hsiu; Hung, Chi-Cheng; Wang, Yu-Sheng; Liu, Chuan-Pu; Chen, Kei-Wei; Wang, Ying-Lang |
| 國立成功大學 |
2017-01-19 |
銅化學機械研磨在奈米半導體積體電路製程之研究
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魏國修; Wei, Kuo-Hsiu |
| 國立成功大學 |
2017-01-07 |
銅化學機械研磨在奈米半導體積體電路製程之研究
|
魏國修; Wei, Kuo-Hsiu |
| 國立成功大學 |
2016-11-01 |
Cleaning methodology of small residue defect with surfactant in copper chemical mechanical polishing post-cleaning
|
Wei, Kuo-Hsiu; Hung, Chi-Cheng; Wang, Yu-Sheng; Liu, Chuan-Pu; Chen, Kei-Wei; Wang, Ying-Lang |
| 國立交通大學 |
2014-12-08T15:33:46Z |
The influence of abrasive particle size in copper chemical mechanical planarization
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Wei, Kuo-Hsiu; Wang, Yu-Sheng; Liu, Chuan-Pu; Chen, Kei-Wei; Wang, Ying-Lang; Cheng, Yi-Lung |
| 國立成功大學 |
2013-09 |
The influence of abrasive particle size in copper chemical mechanical planarization
|
Wei, Kuo-Hsiu; Wang, Yu-Sheng; Liu, Chuan-Pu; Chen, Kei-Wei; Wang, Ying-Lang; Cheng, Yi-Lung |
Showing items 1-8 of 8 (1 Page(s) Totally)
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