臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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Institution	Date	Title	Author
義守大學	2013-09	Further characterization of Pd-coated copper wire on wirebonding process: from a nanoscale perspective	Hsiang-Chen Hsu;Li-Ming Chu;Wei-Yao Chang;Yi-Feng Chen;Jih-Hsin Chien;Shen-Li Fu;Shin-Pon Ju;Wen-Jui Feng
義守大學	2011-01	Characteristic of copper wire and transient analysis on wirebonding process	Hsiang-Chen Hsu;Wei-Yao Chang;Chang-Lin Yeh;Yi-Shao Lai
國立臺灣海洋大學	2010-12	An Alternative Bend-testing Technique for a Flexible Indium Tin Oxide Film	Yen-Liang Chen;Hung-Chih Hsieh;Wang-Tsung Wu;Bor-Jiunn Wen;Wei-Yao Chang;Der-Chin S
義守大學	2010-03	A Study on the Characteristic of the Ultra-Thin Copper Bonding Wire	Hsiang-Chen Hsu;Wei-Yao Chang
義守大學	2009-10	Dynamic Analysis on Underlay Microstructure for Cu/Low-k Wafer during Wire Bonding	Hsiang-Chen Hsu;Pei-Chieh Chin;Chin-Yuan Hu;Wei-Yao Chang;Chang-Lin Yeh;Yi-Shao Lai
義守大學	2008/12/09	Characteristic of Heat Affected Zone for Ultra Thin Gold Wire/Copper Wire and Advanced Finite Element Wirebonding Model	Wei-Yao Chang ; Hsiang-Chen Hsu ; Shen-Li Fu ; Chang-Lin Yeh ; Yi-Shao Lai
義守大學	2008/10/22	An Investigation on Heat Affected Zone for Au Wire/Cu Wire and Advanced Finite Element Wirebonding Model	Wei-Yao Chang ; Hsiang-Chen Hsu ; Shen-Li Fu ; Yi-Shao Lai ; Chang-Lin Yeh
義守大學	2008-12	Characteristic of Heat Affected Zone for Ultra Thin Gold Wire/Copper Wire and Advanced Finite Element Wirebonding Model	Wei-Yao Chang; Hsiang-Chen Hsu; Shen-Li Fu; Chang-Lin Yeh; Yi-Shao Lai
義守大學	2008	金線與銅線在熱影響區的材料特性及其應用於銲線製程之動態分析	張巍耀; Wei-Yao Chang
義守大學	2008	An Investigation on Heat Affected Zone for Au Wire/Cu Wire and Advanced Finite Element Wirebonding Model	Wei-Yao Chang; Hsiang-Chen Hsu; Shen-Li Fu; Yi-Shao Lai; Chang-Lin Yeh

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