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Institution Date Title Author
義守大學 2018-04 Laser Micro-machining of LPM Compound Material for Panel and IC packaging Wen-Fei Lin;Shih-jeh Wu;Hsiang-Chen Hsu;Boen Houng;Min-Shuo Chen
義守大學 2018-04 Rapid Laser Drilling on Thick Ceramic Substrates for SiP Applications Shih-jeh Wu;Hsiang-Chen Hsu;Wen-Fei Lin;Boen Houng;Yeh Chang
義守大學 2018-01 Reliability Design and Optimization Process on Through Mold Via Using Ultrafast Laser Hsiang-Chen Hsu;Shih-Jeh Wu;Wen-Fei Lin;Boen Houng
義守大學 2017-04 An investigation on ultrathin wafer dicing by ultrafast laser with high density plasma etching Shih-jeh Wu;Hsiang-Chen Hsu;Wen-Fei Lin;Shen-Li Fu
義守大學 2016-12 Glass cutting with elongation optics in comparison to conventional methods by laser Shih-Jeh Wu;Hsiang-Chen Hsu;Wen-Fei Lin
義守大學 2016-10 Reduction of Residual Stresses in Sapphire Cover Glass Induced by Mechanical Polishing and Laser Chamfering Through Etching Shih-Jeh Wu;Hsiang-Chen Hsu;Wen-Fei Lin
義守大學 2016-04 Through Mold Via (TMV) by gas-aided laser Hsiang-Chen Hsu;Shih-Jeh Wu;Wen-Fei Lin;Chi-Shiung Hsi;Hsing-Yi Pao;Pin-Chieh Wang

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