| 國立成功大學 |
2023-03 |
TCAD-Based RF performance prediction and process optimization of 3D monolithically stacked complementary FET
|
Chang;Shu-Wei;Chou;Jia-Hon;Lee;Wen-Hsi;Lee;Yao-Jen;Lu;Darsen, Darsen D. |
| 國立成功大學 |
2023--AUG |
Characteristic of CuMn Alloy Films Prepared Using Electrochemical Deposition
|
Lee;Wen-Hsi;Puteri;Gharini, Narendra;Kuo;C, R. |
| 國立成功大學 |
2023 |
3-D Monolithic Stacking of Complementary-FET on CMOS for Next Generation Compute-In-Memory SRAM
|
Baig;Aftab, Md.;Yeh;Cheng-Jui;Chang;Shu-Wei;Qiu;Bo-Han;Huang;Xiao-Shan;Tsai;Cheng-Hsien;Chang;Yu-Ming;Sung;Po-Jung;Su;Chun-Jung;Cho;Ta-Chun;De;Sourav;Lu;Darsen;Lee;Yao-Jen;Lee;Wen-Hsi;Wu;Wen-Fa;Yeh;Wen-Kuan |
| 國立成功大學 |
2022-09-1 |
Nanosheet-Compatible Complementary-Field Effect Transistor Logic Non-Volatile Memory Device
|
Chang;Shu-Wei;Chang;Yu-Ming;Lee;Wen-Hsi;Lee;Yao-Jen;Lu;Darsen, Darsen D. |
| 國立成功大學 |
2022-05 |
Power Molding Inductors Prepared Using Amorphous FeSiCrB Alloy Powder, Carbonyl Iron Powder, and Silicone Resin
|
Hsiang;Hsing-;I;Wu;Liang-Chih;Chen;Chih-Cheng;Lee;Wen-Hsi |
| 國立成功大學 |
2021-12 |
Fabrication, simulation, and characterization of planar inductors
|
Hsiang;Hsing-;I;Fan;Shau-Guang;Lee;Wen-Hsi |
| 國立成功大學 |
2021-11 |
A Novel Fabricating a Thick Film Cu-Ni Alloy Resistor by Screen Printing an Al Electrode and Galvanic Replacement Reaction
|
Kuo;C, R.;Kuo;Tzu-Chiang;Lee;Wen-Hsi |
| 國立成功大學 |
2021-04 |
Magnetic Properties of Iron-Based Alloy Powder Coils Prepared with Screen Printing Using High-Solid-Content Magnetic Pastes
|
Hsiang;Hsing-;I;Chuang;Kai-Hsin;Lee;Wen-Hsi |
| 國立成功大學 |
2021-03 |
A Novel Method to Fabricate a Thick-Film Cu Electrode Fired in Air Through Printing Al Electrode and Reduction-Oxidation Substitution Reaction
|
Kuo;Tzu-Chiang;Kuo;C, R.;Lee;Wen-Hsi |
| 國立成功大學 |
2021-01 |
Titanate coupling agent surface modification effect on the magnetic properties of iron-based alloy powder coil prepared using screen printing
|
Hsiang;Hsing-;I;Chuang;Kai-Hsin;Lee;Wen-Hsi |
| 國立成功大學 |
2019-08-1 |
Effect of pretreatment on Al2O3 substrate by depositing Al2O3 film on the properties of Ni-Cr-Si based thin film resistor
|
Chung;K, C.;Lee;Wen-Hsi |
| 國立成功大學 |
2019-03 |
Characteristic of high frequency Fe-Si-Cr material for motor application by selective laser melting
|
Jhong;Kai-Jyun;Chang;Tsung-Wei;Lee;Wen-Hsi;Tsai;Mi-Ching;Jiang;I-Hua |
| 國立成功大學 |
2019-01 |
Effect of annealing conditions on dopants activation and stress conservation in silicon-germanium
|
Kuo;Tai-Chen;Jhong;Kai-Jyun;Lin;Chia-Wei;Lee;Wen-Hsi |
| 國立成功大學 |
2018-04 |
Investigation on Low Firing Copper for Front Electrode of Si-Based Solar Cell Applications
|
Chiang;Chen-Su;Wu;Yia-Ming;Lee;Wen-Hsi |
| 國立成功大學 |
2017-07-3 |
Effect of microwave annealing on electrical characteristics of TiN/Al/TiN/HfO2/Si MOS capacitors
|
Shih;Tzu-Lang;Su;Yin-Hsien;Kuo;Tai-Chen;Lee;Wen-Hsi;Current;Ira, Michael |
| 國立成功大學 |
2017-06 |
A Study on Cu Particles Coated with Nano-Silver by a Replacement Reaction Between Silver Nitrate and Copper Particles
|
Lee;Tai-Kung;Chiang;Chen-Su;Lee;Wen-Hsi |
| 國立成功大學 |
2017-03-5 |
Effect of tungsten incorporation in cobalt tungsten alloys as seedless diffusion barrier materials
|
Su;Yin-Hsien;Kuo;Tai-Chen;Lee;Wen-Hsi;Wang;Yu-Sheng;Hung;Chi-Cheng;Tseng;Wei-Hsiang;Wei;Kuo-Hsiu;Wang;Ying-Lang |
| 國立成功大學 |
2017-01 |
Fabrication of In0.75Zn1.5Sn1.0 (IZTO) Thin-Film Transistors Using Solution-Processable Materials and PZT Inkjet-Printing
|
Lee;Tai-Kuang;Liuand;Chao-Te;Lee;Wen-Hsi |
| 國立成功大學 |
2017-01 |
Effects of Annealing Pressure on Microstructure and Conversion Efficiency for Electrodeposited CuInSe2 Absorbers
|
Lee;Wen-Hsi;Chang;Tsung-Wei;Su;Yin-Hsien |
