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Showing items 1-8 of 8  (1 Page(s) Totally)
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Institution Date Title Author
中原大學 2004-03 Thermal stability of epoxy-silica hybrid materials by thermogravimetric analysis Ying-Ling Liu;Wen-Lung Wei;Keh-Ying Hsu;Wen-Hsuan Ho
中原大學 2004 Thermal stability of epoxy-silica hybrid materials by thermogravimetric analysis Ying-Ling Liu;Wen-Lung Wei;Keh-Ying Hsu;Wen-Hsuan Ho
中原大學 2003-10 Novel Thermosetting Resins Based on 4-(N-maleimidophenyl)glycidylether I. Preparation and Characterization of Monomer and Cured Resins Ying-Ling Liu;Yu-Jane Chen;Wen-Lung Wei
中原大學 2003-08 Preparation and thermal properties of epoxy-silica nanocomposites from nanoscale colloidal silica Ying-Ling Liu;Chih-Yuan Hsu;Wen-Lung Wei;Ru-Jong Jeng
中原大學 2003-06-16 以亞磷酸二乙酯作為熱延遲性的環氧樹脂硬化劑及其硬化樹脂性質研究 魏文龍; Wen-Lung Wei
中原大學 2003-02 Using diethylphosphites as thermally latent curing agents for epoxy compounds Yie-Shun Chiu;Ying-Ling Liu;Wen-Lung Wei;Wen-Yu Chen
中原大學 2003 Reversibility of Hydration and Dehydration Reactions of a Phosphaphenanthrene Oxide (DOPO) Pendent Group on Polyamide Ying-Ling Liu;Wen-Lung Wei;Wen-Yu Chen
中原大學 2003 Using diethylphosphites as thermally latent curing agents for epoxy compounds Yie-Shun Chiu;Ying-Ling Liu;Wen-Lung Wei;Wen-Yu Chen

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