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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)
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Institution Date Title Author
中原大學 2006-01 The Geometrical Effects of Bumps on the Fatigue Life of Flip-chip Packages by Taguchi Method Wen-Ren Jong;Shia-Chung Chen;Hsin-Chun Tsai;Chien-Chia Chiu;Hsiu-Tao Chang
中原大學 2004-05 Structural Analysis of DC-DC Converters Wen-Ren Jong;Shu-Hui Peng;Tsung-Hsiang Kuo;Steven Hu;Shr-Wai Ho
中原大學 2000-02-01 The Analysis of Warpage for Integrated Circuit Devices Wen-Ren Jong;Ming-Lun Chang
中原大學 1998 Integrated Simulations of Structural Performance, Molding Process, and Warpage for Gas-Assisted Injection-Molded Parts. III. Simulation of Cyclic, Transient Variations in Mold Wall Temperatures Shia-Chung Chen;Sheng-Yan Hu;Wen-Ren Jong

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