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機構 日期 題名 作者
臺大學術典藏 2020-05-12T02:53:23Z Relationship between wettability and interfacial reaction for Sn10Ag4Ti on Al2O3 and SiC substrates TUNG-HAN CHUANG; Chuang, T.H.; Weng, W.P.; Chai, Y.H.
臺大學術典藏 2020-05-12T02:53:23Z Interfacial characteristics for brazing of aluminum matrix composites with Al-12Si filler metals Weng, W.P.; Chuang, T.H.; TUNG-HAN CHUANG
臺大學術典藏 2020-05-12T02:53:23Z Brazing of aluminum matrix composite with Sn 10 Ag 4 Ti active filler metal TUNG-HAN CHUANG; Chuang, T.H.; Weng, W.P.
臺大學術典藏 2020-05-12T02:53:22Z Applicability of ultrasonic testing for the determination of volume fraction of particulates in alumina-reinforced aluminum matrix composites Fang, C.-K.; Fang, R.L.; Weng, W.P.; Chuang, T.H.; TUNG-HAN CHUANG
臺大學術典藏 2020-05-12T02:53:21Z Plastic flow behavior during the forging of a 6061 AI/10 Vol Pct Al2O3 (p) composite Yeh, M.S.; Weng, W.P.; Wang, S.C.; Chuang, T.H.; TUNG-HAN CHUANG
臺大學術典藏 2020-05-12T02:53:17Z Intermetallic compounds formed during the reflow of In-49Sn solder ball-grid array packages Chuang, T.H.; Chang, S.Y.; Tsao, L.C.; Weng, W.P.; Wu, H.M.; TUNG-HAN CHUANG
臺大學術典藏 2020-05-12T02:53:17Z Brazeability of a 3003 aluminum alloy with Al-Si-Cu-based filler metals TUNG-HAN CHUANG; Chuang, T.H.; Tsao, C.W.; Cheng, M.D.; Weng, W.P.; Tsao, L.C.
臺大學術典藏 2020-02-26T01:36:50Z Acoustic polarization for optimized implantable power transimittion Po-Jen ShihShih, P.-J.;Weng, W.-P.;Shih, W.-P.;Tsai, Y.-C.;Chang, P.-Z.; Shih, P.-J.; Weng, W.-P.; Shih, W.-P.; Tsai, Y.-C.; Chang, P.-Z.; PO-JEN SHIH
臺大學術典藏 2018-09-10T09:43:36Z Construction of a high frequency and high reflectance shutter for a direct write EUV lithography system JIA-YUSH YEN;Lin, M.-H.;Weng, W.-P.;Juang, B.-Y.;Yen, J.-Y.;Chuang, J.-Y.;JIA-YUSH YEN; JIA-YUSH YEN; Chuang, J.-Y.; Yen, J.-Y.; Juang, B.-Y.; Weng, W.-P.; Lin, M.-H.; JIA-YUSH YEN
臺大學術典藏 2018-09-10T06:26:02Z Acoustic polarization for optimized implantable power transimittion Chang, Pei-Zen;Shih, Wen-Pin;Weng, Wen-Pin;Shih, Po-Jen;WEN-PIN SHIH;Chang, P.-Z.;Tsai, Y.-C.;Shih, W.-P.;Weng, W.-P.;Shih, P.-J.; Shih, P.-J.; Weng, W.-P.; Shih, W.-P.; Tsai, Y.-C.; Chang, P.-Z.; WEN-PIN SHIH; Shih, Po-Jen; Weng, Wen-Pin; Shih, Wen-Pin; Chang, Pei-Zen
臺大學術典藏 2018-06-28T22:11:27Z Intermetallic Compounds Formed during the Reflow of In-49Sn Solder Ball-Grid-Array Packages Chuang, T. H.; Chang, S. Y.; Tsao, L. C.; Weng, W. P.; Wu, H. M.; Chuang, T. H.; Chang, S. Y.; Tsao, L. C.; Weng, W. P.; Wu, H. M.; ChuangTH
國立臺灣大學 2008 Yao1, MMP-3 Response to Compressive Forces in vitro and in vivo Chang, H.-H.; Wu, C.-B.; Chen, Y.-J.; Wong, C.-Y.; Weng, W.-P.; Chang, Y.-J.; Chen, B.-E.; Chen, J, M.-H.
國立臺灣大學 2003 Intermetallic Compounds Formed during the Reflow of In-49Sn Solder Ball-Grid-Array Packages Chuang, T. H.; Chang, S. Y.; Tsao, L. C.; Weng, W. P.; Wu, H. M.
國立臺灣大學 2002 Brazeability of a 3003 Aluminum alloy with Al-Si-Cu-based filler metals Tsao, L. C.; Weng, W. P.; Cheng, M. D.; Tsao, C. W.; Chuang, T. H.
國立臺灣大學 2000 Plastic flow behavior during the forging of a 6061 Al/10 vol pct Al2O3 ( p ) composite Yeh, M. S.; Weng, W. P.; Wang, S. C.; Chuang, T. H.
國立臺灣大學 1999 Applicability of Ultrasonic Testing for the Determination of Volume Fraction of Particulates in Alumina-Reinforced Aluminum Matrix Composites Fang, C. -K.; Fang, R. L.; Weng, W. P.; Chuang, T. H.
淡江大學 1998-05-15 A study on process and tribological behavior of Al alloy/Gr. (p) composite 林清彬; Lin, C. B.; Chang, R. J.; Weng, W. P.
國立臺灣大學 1998 Relationship between wettability and interfacial reaction for Sn10Ag4Ti on Al2O3 and SiC substrates Chai, Y. H.; Weng, W. P.; Chuang, T. H.
國立臺灣大學 1997 Interfacial Characteristics for Active Brazing of Alumina to Superalloys Weng, W. P.; Wu, H. W.; Chai, Y. H.; Chuang, T. H.
國立臺灣大學 1997 Brazing of Aluminum Matrix Composite with Sn10Ag4Ti Active Filler Metal Weng, W. P.; Chuang, T. H.
國立臺灣大學 1997 Interfacial characteristics for brazing of aluminum matrix composites with Al-12Si filler metals Weng, W. P.; Chuang, T. H.
國立臺灣大學 1995 Studies on the Brazing Interfaces for Al-Matrix Composites Weng, W. P.; Chuang, T. H.

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