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| 臺大學術典藏 |
2018-09-10T08:42:36Z |
Thermal-driven analog placement considering device matching
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YAO-WEN CHANG; Chang, Y.-W.; Wong, M.D.F.; Lin, M.P.-H.; Zhang, H.; Lin, M.P.-H.;Zhang, H.;Wong, M.D.F.;Chang, Y.-W. |
| 臺大學術典藏 |
2018-09-10T07:36:54Z |
Thermal-driven analog placement considering device matching
|
Lin, P.-H.;Zhang, H.;Wong, M.D.F.;Chang, Y.-W.; Lin, P.-H.; Zhang, H.; Wong, M.D.F.; Chang, Y.-W.; YAO-WEN CHANG |
| 臺大學術典藏 |
2009 |
Flip-chip routing with unified area-I/O pad assignments for package-board co-design
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Fang, J.-W.;Wong, M.D.F.;Chang, Y.-W.; Fang, J.-W.; Wong, M.D.F.; Chang, Y.-W.; YAO-WEN CHANG |
| 國立臺灣大學 |
2001 |
Matching-Based Algorithm for FPGA Channel Segmentation Design
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Chang, Yao-Wen; Lin, Jai-Ming; Wong, M. D. F. |
| 臺大學術典藏 |
2001 |
Matching-Based Algorithm for FPGA Channel Segmentation Design
|
Chang, Yao-Wen; Lin, Jai-Ming; Wong, M. D. F.; Chang, Yao-Wen; Lin, Jai-Ming; Wong, M. D. F. |
Showing items 1-5 of 5 (1 Page(s) Totally)
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