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| 臺大學術典藏 |
2020-06-16T06:31:34Z |
Thermal-driven analog placement considering device matching.
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Lin, Mark Po-Hung;Zhang, Hongbo;Wong, Martin D. F.;Chang, Yao-Wen; Lin, Mark Po-Hung; Zhang, Hongbo; Wong, Martin D. F.; Chang, Yao-Wen; YAO-WEN CHANG |
| 臺大學術典藏 |
2020-06-16T06:31:34Z |
Flip-chip routing with unified area-I/O pad assignments for package-board co-design.
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Fang, Jia-Wei;Wong, Martin D. F.;Chang, Yao-Wen; Fang, Jia-Wei; Wong, Martin D. F.; Chang, Yao-Wen; YAO-WEN CHANG |
| 國立交通大學 |
2014-12-08T15:15:33Z |
I/O clustering in design cost and performance optimization for flip-chip design
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Chen, Hung-Ming; Liu, I-Min; Wong, Martin D. F. |
| 國立臺灣大學 |
2006-08 |
Temperature-Aware Placement for SOCs
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Tsai, Jeng-Liang; Chen, Charlie Chung-Ping; Chen, Guoqiang; Goplen, Brent; Qian, Haifeng; Zhan, Yong; Kang, Steve Sung-M; Wong, Martin D.F.; Sapatnekar, Sachin S. |
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